×

Optical connection structure between optical backplane and circuit substrate

  • US 7,585,119 B2
  • Filed: 10/05/2006
  • Issued: 09/08/2009
  • Est. Priority Date: 10/06/2005
  • Status: Active Grant
First Claim
Patent Images

1. Information processing equipment which comprises a photoelectric conversion module disposed on a circuit substrate, a first optical connector connected to the photoelectric conversion module through a plurality of first optical fibers and disposed to an edge portion of the circuit substrate, and a second optical connector disposed on an optical backplane, and in which the first optical connector is optically connected to the second optical connector, wherein:

  • the photoelectric conversion module and the first optical connector dispose and accommodate both the edge portions of the plurality of first optical fibers, respectively;

    the second optical connector disposes and accommodates edge portions of the plurality of second optical fibers;

    the disposing direction of the first optical fibers in the photoelectric conversion module is in nonparallel with the main surface of the circuit substrate;

    the disposing direction of the first optical fibers in the first optical connector and the disposing direction of the second optical fibers in the second optical connector are in nonparallel with the main surface of the circuit substrate;

    the photoelectric conversion module and the first optical connector being fixedly coupled to the circuit substrate;

    the second optical connector being fixedly coupled to the optical backplane; and

    the plurality of second optical fibers are laid on the main surface of the optical backplane, the main surface of the optical backplane being coupled to the circuit substrate.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×