System for monitoring temperature and pressure during a molding process

• US 7,585,166 B2
• Filed: 05/02/2006
• Issued: 09/08/2009
• Est. Priority Date: 05/02/2005
• Status: Active Grant

• Current Assignee: Frederick J. Buja
• Original Assignee: Frederick J. Buja
• Inventors: Buja, Frederick J.
• Primary Examiner(s): HEITBRINK, TIMOTHY W
• Application Number:
  US11/381,246
• Publication Number:
  US 20060246167A1
• Time in Patent Office: 1,225 Days
• Field of Search: 425/143, 425/144, 425/149
• US Class Current: 425/143
• CPC Class Codes: B29C 2945/76006 Pressure
• CPC Class Codes: B29C 2945/7604 Temperature
• CPC Class Codes: B29C 2945/76244 ejectors
• CPC Class Codes: B29C 2945/76257 cavity
• CPC Class Codes: B29C 2945/76277 nozzles
• CPC Class Codes: B29C 45/34 having venting means
• CPC Class Codes: B29C 45/77 of velocity or pressure of moulding material
• CPC Class Codes: B29C 45/78 of temperature

Abstract

Disclosed are systems and methods for the use of a micro-bead EMF junction in the sensing and control of an injection molding process, whereby the improved junction is able to reliably sense and indicate temperature and pressure changes in a molding process.

Claims

1. An injection molding system, including:

a multi-variable sensor comprising dissimilar metals formed into a micro-bead junction; and

a programmable device, with associated memory, connected to and receiving a signal from said sensor, said programmable device periodically receiving the signal and recording said signal to record changes in said signal, wherein said programmable device is capable of storing said signals as data.

2. The injection molding system of claim 1, wherein said junction is located within a spherically shaped bead.

3. The system of claim 1 wherein said multi-variable sensor is located in a recessed well.

4. The system of claim 1 wherein said multi-variable sensor is at least partially located in a vent grove in a mold.

5. The system of claim 1 wherein said multi-variable sensor is operatively associated with a moveable pin within the molding system.

6. The system of claim 5 wherein said pin is selected from the group consisting of an ejector pin;

and a gate pin.

7. The system of claim 1 wherein a response characteristic of said multi-variable sensor is a function of the size of the micro-bead junction.

10. The system of claim 1 wherein said programmable device includes a display capable of representing data collected from said sensor so as to represent a density increase within a melt material as a temperature rise.

11. The system of claim 1 wherein said programmable device includes a processor suitable for processing the sensor data and representing the combined changes in temperature and pressure as a function of time.

8. An injection molding system, including:

a multi-variable sensor wherein said multi-variable sensor includes a thermal-mechanical sensor having a micro-spherically shaped bead encapsulating an EMF junction comprising dissimilar metals formed into said micro-spherically shaped bead; and

a programmable device, with associated memory, connected to and receiving a signal from said sensor, said programmable device periodically receiving the signal and recording said signal to record changes in said signal, wherein said programmable device is capable of storing said signals as data.

12. The system of claim 8 wherein said multi-variable sensor is located in a recessed well.

13. The system of claim 8 wherein said multi-variable sensor is at least partially located in a vent grove in a mold.

14. The system of claim 8 wherein said multi-variable sensor is operatively associated with a moveable pin within the molding system.

15. The system of claim 14 wherein said pin is selected from the group consisting of an ejector pin;

and a gate pin.

16. The system of claim 8 wherein a response characteristic of said multi-variable sensor is a function of the size of the micro-bead junction.

9. An injection molding system, including:

a multi-variable sensor comprising dissimilar metals wherein said multi-variable sensor includes an EMF junction encapsulated within a micro-spherically shaped bead, said junction being suitable for sensing changes in at least the temperature and pressure of a surrounding environment; and

a programmable device, with associated memory, connected to and receiving a signal from said sensor, said programmable device periodically receiving the signal and recording said signal to record changes in said signal, wherein said programmable device is capable of storing said signals as data.