Semiconductor package having through-hole via on saw streets formed with partial saw
First Claim
1. A method of forming through-hole vias in a semiconductor wafer, comprising:
- forming a semiconductor wafer having a plurality of die with contact pads disposed on a surface of each die, the semiconductor wafer having saw street guides between each die;
forming a trench in the saw street guides without using support material to support the semiconductor wafer, the trench extending partially but not completely through the semiconductor wafer, the uncut portion of the saw street guides below the trench along a backside of the semiconductor wafer being more than 60% of a thickness of the semiconductor wafer to maintain structural support for the semiconductor wafer without the support material during the processing steps of;
(a) filling the trench with organic material,(b) forming a plurality of via holes in the organic material,(c) forming traces between the contact pads and via holes, and(d) depositing conductive material in the via holes to form metal vias;
removing the uncut portion of the saw street guide below the trench along the backside of the semiconductor wafer portion;
applying dicing tape to the backside of the semiconductor wafer;
cutting through the metal vias to the dicing tape; and
singulating the semiconductor wafer along the saw street guides by removing the dicing tape to separate the die into individual units.
6 Assignments
0 Petitions
Accused Products
Abstract
A method of forming through-hole vias in a semiconductor wafer involves forming a semiconductor wafer with many die having contact pads disposed on each die. The semiconductor wafer has saw street guides between each die. A trench is formed in the saw streets. The trench extends partially but not completely through the wafer. The uncut portion of the saw street guides below the trench along a backside of the wafer maintains structural support for the semiconductor wafer. The trench is filled with organic material. Via holes are formed in the organic material. Traces are formed between the contact pads and via holes. Conductive material is deposited in the via holes to form metal vias. The uncut portion of the saw streets below the trench along the backside of the semiconductor wafer portion is removed. The semiconductor wafer is singulated along the saw street guides to separate the die.
56 Citations
26 Claims
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1. A method of forming through-hole vias in a semiconductor wafer, comprising:
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forming a semiconductor wafer having a plurality of die with contact pads disposed on a surface of each die, the semiconductor wafer having saw street guides between each die; forming a trench in the saw street guides without using support material to support the semiconductor wafer, the trench extending partially but not completely through the semiconductor wafer, the uncut portion of the saw street guides below the trench along a backside of the semiconductor wafer being more than 60% of a thickness of the semiconductor wafer to maintain structural support for the semiconductor wafer without the support material during the processing steps of; (a) filling the trench with organic material, (b) forming a plurality of via holes in the organic material, (c) forming traces between the contact pads and via holes, and (d) depositing conductive material in the via holes to form metal vias; removing the uncut portion of the saw street guide below the trench along the backside of the semiconductor wafer portion; applying dicing tape to the backside of the semiconductor wafer; cutting through the metal vias to the dicing tape; and singulating the semiconductor wafer along the saw street guides by removing the dicing tape to separate the die into individual units. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A method of forming through-hole vias in a semiconductor wafer, comprising:
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forming a semiconductor wafer having a plurality of die with contact pads disposed on a surface of each die, the semiconductor wafer having saw street guides between each die; forming a trench in the saw street guides without using support material to support the semiconductor wafer, the trench extending partially through the semiconductor wafer, the uncut portion of the saw street guides below the trench along a backside of the semiconductor wafer having sufficient thickness to maintain structural support for the semiconductor wafer without the support material during the processing steps of; (a) filling the trench with organic material, (b) forming a plurality of via holes in the organic material, (c) forming traces between the contact pads and via holes, and (d) depositing conductive material in the via holes to form metal vias; removing the uncut portion of the saw street guide below the trench along the backside of the semiconductor wafer portion; applying wafer support material to the backside of the semiconductor wafer; cutting through the metal vias to the wafer support material; and singulating the semiconductor wafer along the saw street guides by removing the wafer support material to separate the die into individual units. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16, 17)
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18. A method of forming through-hole vias in a semiconductor wafer, comprising:
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forming a semiconductor wafer having a plurality of die with contact pads disposed on a surface of each die, the semiconductor wafer having saw Street guides between each die; forming a trench in the saw street guides without using support material to support the semiconductor wafer, the trench extending partially through the semiconductor wafer, the uncut portion of the saw street guides below the trench along a backside of the semiconductor wafer having sufficient thickness to maintain structural support for the semiconductor wafer without the support material during the processing steps of; (a) filling the trench with organic material, (b) forming a plurality of via holes in the organic material, (c) depositing conductive material in the via holes to form conductive vias, and (d) forming conductive traces between the contact pads and conductive vias; removing the uncut portion of the saw street guide below the trench along the backside of the semiconductor wafer portion; and singulating the semiconductor wafer along the saw street guides to separate the die into individual units. - View Dependent Claims (19, 20, 21, 22, 23, 24, 25, 26)
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Specification