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Semiconductor packaging device comprising a semiconductor chip including a MOSFET

  • US 7,586,180 B2
  • Filed: 07/02/2008
  • Issued: 09/08/2009
  • Est. Priority Date: 07/31/2003
  • Status: Active Grant
First Claim
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1. A semiconductor device comprising:

  • a semiconductor chip having a first major surface and a second major surface opposite to the first major surface, the semiconductor chip including a MOSFET,the semiconductor chip having a source electrode of the MOSFET on first major surface thereof,the semiconductor chip having a gate electrode of the MOSFET on the first major surface thereof,the semiconductor chip having a drain electrode of the MOSFET on the second major surface thereof,a source electrode terminal disposed under the semiconductor chip and electrically connected to the source electrode,the source electrode terminals being made of a lead frame;

    a gate electrode terminal disposed under the semiconductor chip and electrically connected to the gate electrode,the gate electrode terminals being made of a lead frame;

    drain electrode terminals disposed under the semiconductor chip and electrically connected to the drain electrode,the drain electrode terminals being made of a lead frame;

    a sealing member having a top surface and a bottom surface opposite to the top surface,the sealing member sealing the semiconductor chip and parts of the drain, source and gate electrode terminals;

    wherein the source, gate and drain electrode terminals are exposed from the bottom surface of the sealing member;

    wherein the source and gate electrode terminals are positioned between the drain electrode terminals;

    wherein a drain electrode plate is disposed over the semiconductor chip and electrically connected to the drain electrode terminals,the drain electrode plate being integrally connected with the drain electrode terminals; and

    wherein the drain electrode plate is exposed from the top surface of the sealing member.

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