Conditioner with coplanar conductors

• US 7,586,728 B2
• Filed: 03/10/2006
• Issued: 09/08/2009
• Est. Priority Date: 03/14/2005
• Status: Active Grant

• Current Assignee: X2Y Attenuators, LLC
• Original Assignee: X2Y Attenuators, LLC
• Inventors: Anthony, William M.
• Primary Examiner(s): Jackson; Stephen W
• Application Number:
  US11/372,132
• Publication Number:
  US 20060203414A1
• Time in Patent Office: 1,278 Days
• Field of Search: 361/118
• US Class Current: 361/118
• CPC Class Codes: H01G 4/35 Feed-through capacitors or anti-noise capacitors

Abstract

Disclosed are novel internal structures of energy conditioners having A, B, and G master electrodes, novel circuits including energy conditioners having A, B, and G master electrodes conductive structures, novel assemblies of internal structures and internal structures of energy conditioners having A, B, and G electrodes, and novel arrangements of energy conditioners having A, B, and G master electrodes on connection structures. Certain internal structures have conductive layers of A and B master electrodes in the same plane and conductive layers of the G master electrode extended beyond the periphery of the A and B layers except where the A and B layers have tabs extended to conductive integration structure integrating the A and B layers into respective A and B master electrodes.

Claims

1. An internal structure of an energy conditioner:

wherein said internal structure has a left side surface, a right side surface, an upper side surface, a lower side surface, a top side surface, and a bottom side surface;

wherein said internal structure comprises a dielectric material and a conductive material;

wherein surfaces of said dielectric material and surfaces of said conductive material define said left side surface, said right side surface, said upper side surface, said lower side surface, said top side surface, and said bottom side surface;

wherein said conductive material comprises a first A conductive layer and a first B conductive layer in a first plane, and a first G conductive layer;

wherein said first A conductive layer, said first B conductive layer, and said first G conductive layer are electrically isolated from one another in said internal structure;

wherein said first A conductive layer comprises at least one first A conductive layer first tab and a first A conductive layer main body portion;

wherein said first B conductive layer comprises at least one first B conductive layer first tab and a first B conductive layer main body portion;

wherein said first G conductive layer comprises at least a first G conductive main body portion;

wherein said first A conductive layer main body portion does not extend to any one of said left side surface, said right side surface, said upper side surface, and said lower side surface;

wherein said first B conductive layer main body portion does not extend to any one of said left side surface, said right side surface, said upper side surface, and said lower side surface;

wherein said first G conductive layer main body portion does not extend to any one of said left side surface, said right side surface, said upper side surface, and said lower side surface; and

wherein said first G conductive layer extends towards said left side surface, said right side surface, said upper side surface, and said lower side surface further than said first A conductive layer main body portion and further than said first B conductive layer main body portion.

2. The structure of claim 1 wherein said first G conductive layer extends further towards said left side surface, said right side surface, said upper side surface, and said lower side surface than all portions of said first A conductive layer, except for where said at least one first A conductive layer first tab extends toward surfaces of said internal structure.

3. The structure of claim 1 wherein said G conductor main body portion has a G conductor main body portion area, said A conductor main body portion has an A conductor main body portion area, and said G conductor main body portion area is larger than said A conductor main body portion area.

4. The structure of claim 1 wherein said G conductor main body portion has a G conductor main body portion area, said A conductor main body portion has an A conductor main body portion area, said B conductor main body portion has an B conductor main body portion area, and said G conductor main body portion area is larger than the sum of said A conductor main body portion area and said B conductor main body portion area.

5. The structure of claim 1 wherein said first G conductive layer further comprises a first G conductive layer first tab and a first G conductive layer second tab.

6. An energy conditioner comprising the structure of claim 1 and an energy conditioner external structure.

7. An assembly comprising the energy conditioner of claim 6 mounted on mounting surface structure, wherein said mounting surface structure consists of a first conductive region, a second conductive region, and a third conductive region;

wherein said first A conductive layer conductively connects to said first conductive region;

wherein said first B conductive layer conductively connects to said second conductive region; and

wherein said G conductive layer conductively connects to said third conductive region.

8. The conditioner of claim 6 wherein said external conductive structure comprises a first conductive integration structure, a second conductive integration structure, and a third conductive integration structure;

wherein said first conductive integration structure contacts said first A conductive layer first tab and said first conductive region;

wherein said second conductive integration structure contacts said first B conductive layer first tab and said second conductive region;

wherein said third conductive integration structure contacts a first G conductive layer first tab and said third conductive region.

9. The conditioner of claim 8 wherein said first conductive integration structure resides on a at least said left side surface, said second conductive integration structure resides on at least said right side surface, and said third conductive integration structure resides between said first conductive integration structure and said second conductive integration structure.

10. The conditioner of claim 8 further comprising a fourth conductive integration structure that contacts a first G conductive layer second tab and said third conductive region.

11. The conditioner of claim 8 wherein said third conductive integration structure also contacts a first G conductive layer second tab and said third conductive region.

12. The structure of claim 1 wherein said first A conductive layer first tab extends to at least one of said left side surface, said upper side surface, and said bottom side surface.

13. The structure of claim 1 wherein said first A conductive layer first tab extends to all of said left side surface, a portion of said upper side surface at the intersection of said upper side surface and said left side surface, and a portion of said lower side surface at the intersection of said lower side surface and said left side surface.

14. The structure of claim 1 wherein said first A conductive layer first tab extends to only said left side surface.

15. The structure of claim 1 wherein said at least one first A conductive layer first tab consists of said first A conductive layer first tab and a first A conductive layer second tab;

wherein said first A conductive layer first tab extends to only said upper side surface; and

wherein said first A conductive layer second tab extends only to said lower side surface.

16. The structure of claim 1 wherein said at least one first A conductive layer first tab consists of said first A conductive layer first tab and a first A conductive layer second tab;

wherein said first A conductive layer first tab extends to only said upper side surface near said left side surface; and

wherein said first A conductive layer second tab extends only to said lower side surface at a region near said left side surface.

17. The structure of claim 1 wherein said A conductive layer and said B conductive layer are mirror images of one another about a line extending from a center of said upper side surface to a center of said lower side surface.

18. The structure of claim 1:

wherein said first A conductive layer first tab extends to a region at a corner of said lower side surface and said left side surface; and

wherein said first B conductive layer first tab extends to a region at a corner of said upper side surface and said right side surface.

19. The structure of claim 1 wherein said first G conductive layer is in said first plane.

20. The structure of claim 1 wherein said first G conductive layer is in said first plane and between said first A conductive layer and said first B conductive layer.

21. The structure of claim 1 wherein said first G conductive layer is in said first plane and between said first A conductive layer and said first B conductive layer, and said first G conductive layer comprises a first G conductive layer first tab and a first G conductive layer second tab.

22. The structure of claim 1 wherein said first G conductive layer includes only one tab.

23. The structure of claim 1 wherein said first G conductive layer has exactly two tabs.

24. The structure of claim 1 wherein said first G conductive layer comprises at least four tabs.

25. The structure of claim 1 wherein said first G conductive layer has internal surfaces defining at least one aperture in said first G conductive layer.

26. The structure of claim 1 wherein said first G conductive layer includes no tabs.

27. The structure of claim 1 further comprising surfaces defining a via, conductive material in said via, wherein said conductive material connects to only one of A, B, and G conductive layers.

28. The structure of claim 1 wherein said at least one first A conductive layer first tab consists of a first A conductive layer first tab, and said first A conductive layer main body extends in a direction parallel to the surface of said internal structure to which said first a conductive layer first tab contacts further than the extent in that direction of said first a conductive layer first tab.

29. The structure of claim 1 wherein said at least one first A conductive layer first tab consists of a first A conductive layer first tab, and said first A conductive layer main body extends in a direction parallel to the surface of said internal structure to which said first a conductive layer first tab contacts not as far as the extent in that direction of said first a conductive layer first tab.

30. The structure of claim 1 wherein said first A conductive layer main body portion includes a rounded corner.

31. The structure of claim 1 wherein said first A conductive layer main body extends to only an upper left quadrant, said first B conductive layer main body extends to only a lower right quadrant.

32. The structure of claim 1 wherein said at least one first A conductive layer first tab consists of a first A conductive layer first tab that spans a corner of said left side surface and said lower side surface, and said at least one first B conductive layer first tab consists of a first B conductive layer first tab that spans a corner of said right side surface and said upper side surface.

33. The structure of claim 1:

wherein said at least one first A conductive layer first tab consists of a first A conductive layer first tab and a first A conductive layer second tab, said first A conductive layer first tab extends only to said upper side surface near said left side surface, and said first A conductive layer second tab extends only to said lower side surface near said left side surface; and

wherein said at least one first B conductive layer first tab consists of a first B conductive layer first tab and a first B conductive layer second tab, said first B conductive layer first tab extends only to said upper side surface near said right side surface, and said first B conductive layer second tab extends only to said lower side surface near said right side surface.

34. The structure of claim 1:

wherein said at least one first A conductive layer first tab consists of a first A conductive layer first tab and a first A conductive layer second tab, said first A conductive layer first tab extends only to a central region of said left side surface, and said first A conductive layer second tab extends only to a region of said lower side surface near said left side surface; and

wherein said at least one first B conductive layer first tab consists of a first B conductive layer first tab and a first B conductive layer second tab, said first B conductive layer first tab extends only to a central region of said right side surface, and said first B conductive layer second tab extends only to said upper side surface near said right side surface.

35. The structure of claim 1 wherein said first A conductive layer defines slots.

36. The structure of claim 1 wherein said first A conductive layer defines slots and said first B conductive layer defines slots.

37. The structure of claim 1 wherein said first A conductive a layer main body is larger than said first B conductive layer main body.

38. A circuit comprising said internal structure of claim 1, a source, and a load, wherein said internal structure is connected in said circuit in a circuit 1 configuration.

39. A circuit comprising said internal structure of claim 1, a source, and a load, wherein said internal structure is connected in said circuit in a circuit 2 configuration.

40. A circuit comprising said internal structure of claim 1, a source, and a load, wherein said internal structure is connected in said circuit in a circuit 3 configuration.

41. A circuit comprising said internal structure of claim 1, a first source, a second source, a first load, and a second load, wherein said internal structure is connected in said circuit in a circuit 4 configuration.

42. A circuit comprising said internal structure of claim 1, a first source, a first load, and a second load, wherein said internal structure is connected in said circuit in a circuit 5 configuration.

43. A circuit comprising said internal structure of claim 1, a first source, a first load, and a second load, wherein said internal structure is connected in said circuit in a circuit 6 configuration.

44. An assembly comprising said internal structure of claim 1 and an external structure of said energy conditioner, wherein said external structure comprises:

a first conductive integration region that extends along at least one of said left side surface, said upper side surface, and said lower side surface and contacts there at, at least one of said at least one first A conductive layer first tab; and

a second conductive integration region that extends along at least one of said right side surface, said upper side surface, and said lower side surface and contacts thereat at least one of said at least one first B conductive layer first tab.

45. The assembly of claim 44 wherein said first G conductive layer includes a first G conductive layer main body portion, a first G conductive layer first tab, and a first G conductive layer second tab, and wherein said external structure further comprises a third conductive integration region that extends along at least one side surface of said internal structure and contacts thereat said first G conductive layer first tab.

46. The assembly of claim 45 wherein said external structure further comprises a fourth conductive integration region that extends along at least one side surface of said internal structure opposite the one side surface of said internal structure along which said third conductive integration region extends where at said fourth conductive integration region contacts said first G conductive layer second tab.

47. The assembly of claim 46 further comprising a mounting structure to which said external structure is mounted, wherein said mounting structure consists of only a first conductive region, a second conductive region, and a third conductive region.

48. The assembly of claim 47 wherein said first conductive region comprises conductive material in a first via, said second conductive region comprises conductive material in a second via, and said third conductive region comprises conductive material in a third via.

49. The assembly of claim 48 wherein each one of said first conductive region, said second conductive region, and said third conductive region have conductive material in no more than two vias.

50. The assembly of claim 49 wherein said first conductive region, said second conductive region, and said third conductive region have conductive material in no more than a total of six vias.

51. The assembly of claim 49 wherein said first conductive region, said second conductive region, and said third conductive region have conductive material residing in no more than a total of five vias.

52. An assembly comprising:

an energy conditioner having said internal structure of claim 1;

a mounting structure; and

wherein said internal structure is mounted on said mounting structure;

wherein said mounting structure comprises no more than three separate conductive elements.

53. The assembly of claim 52 wherein each one of said no more than three separate conductive elements has conductive material extended into no more than two vias.

54. An assembly comprising:

an energy conditioner having the internal structure of claim 1, and an external structure comprising conductive regions that conductively connect components in said internal structure of an A master electrode to one another, of a B master electrode to one another, and of a G master electrode to one another;

a mounting structure; and

wherein said energy conditioner is mounted on said mounting structure;

wherein said mounting structure consists of only a first conductive region, a second conductive region, and a third conductive region;

and wherein said A master electrode is connected to said first conductive region, said B master electrode is connected to said second conductive region, and said G master electrode is connected to said third conductive region.

55. The assembly of claim 54 wherein said G master electrode includes a first G conductive integration region, and a second G conductive integration region spatially separated from and not contacting said first G conductive integration region, wherein both said first G conductive integration region and said second G conductive integration region contact said third conductive region.

58. A method of using an energy conditioner comprising the internal structure of claim 1 comprising:

connecting said energy conditioner in a circuit.

56. A method of making an internal structure of an energy conditioner comprising:

providing an internal structure comprises a dielectric material and a conductive material;

wherein said internal structure has a left side surface, a right side surface, an upper side surface, a lower side surface, a top side surface, and a bottom side surface;

wherein surfaces of said dielectric material and surfaces of said conductive material define said left side surface, said right side surface, said upper side surface, said lower side surface, said top side surface, and said bottom side surface;

wherein said conductive material comprises a first A conductive layer and a first B conductive layer in a first plane, and a first G conductive layer;

wherein said first A conductive layer, said first B conductive layer, and said first G conductive layer are electrically isolated from one another in said internal structure;

wherein said first A conductive layer comprises at least one first A conductive layer first tab and a first A conductive layer main body portion;

wherein said first B conductive layer comprises at least one first B conductive layer first tab and a first B conductive layer main body portion;

wherein said first G conductive layer comprises at least a first G conductive main body portion;

wherein said first A conductive layer main body portion does not extend to any one of said left side surface, said right side surface, said upper side surface, and said lower side surface;

wherein said first B conductive layer main body portion does not extend to any one of said left side surface, said right side surface, said upper side surface, and said lower side surface;

wherein said first G conductive layer main body portion does not extend to any one of said left side surface, said right side surface, said upper side surface, and said lower side surface; and

wherein said first G conductive layer extends towards said left side surface, said right side surface, said upper side surface, and said lower side surface further than said first A conductive layer main body portion and further than said first B conductive layer main body portion.

57. A method of making an energy conditioner comprising assembly the internal structure of claim 56 with an energy conditioner external structure.