Method and apparatus for maintaining parallelism of layers and/or achieving desired thicknesses of layers during the electrochemical fabrication of structures

• US 7,588,674 B2
• Filed: 01/03/2005
• Issued: 09/15/2009
• Est. Priority Date: 12/31/2003
• Status: Active Grant

• Current Assignee: Microfabrica Incorporated (Technoprobe S.P.A.), University of Southern California
• Original Assignee: Microfabrica Incorporated (Technoprobe S.P.A.)
• Inventors: Cohen, Adam L., Lockard, Michael S., Frodis, Uri
• Primary Examiner(s): Nguyen; Nam X
• Assistant Examiner(s): Van; Luan V
• Application Number:
  US11/028,944
• Publication Number:
  US 20050181316A1
• Time in Patent Office: 1,716 Days
• Field of Search: 205/118, 205/170, 205/206, 205/222, 205/223, 451/8, 451/14
• US Class Current: 205/222
• CPC Class Codes: B33Y 10/00 Processes of additive manufacturing
• CPC Class Codes: B81C 1/00492 Processes for surface micromachining not provided for in groups B81C1/0046 - B81C1/00484
• CPC Class Codes: B81C 2201/0104 Chemical-mechanical polishing [CMP]
• CPC Class Codes: B81C 2201/0197 Processes for making multi-layered devices not provided for in groups B81C2201/0176 - B81C2201/0192
• CPC Class Codes: B81C 99/0065 Process control; Yield prediction
• CPC Class Codes: C25D 1/00 Electroforming
• CPC Class Codes: C25D 1/003 3D structures, e.g. superposed patterned layers
• CPC Class Codes: C25D 21/12 Process control or regulation controlling or regulating in general G05
• CPC Class Codes: C25D 5/022 using masking means
• CPC Class Codes: C25D 5/10 Electroplating with more than one layer of the same or of different metals for bearings C25D7/10
• CPC Class Codes: C25D 5/48 After-treatment of electroplated surfaces
• CPC Class Codes: H01L 21/2885 using an external electrical current, i.e. electro-deposition
• CPC Class Codes: H01L 21/76885 By forming conductive members before deposition of protective insulating material, e.g. pillars, studs
• CPC Class Codes: Y10T 156/1052 with cutting, punching, tearing or severing

Abstract

Some embodiments of the present invention provide processes and apparatus for electrochemically fabricating multilayer structures (e.g. mesoscale or microscale structures) with improved endpoint detection and parallelism maintenance for materials (e.g. layers) that are planarized during the electrochemical fabrication process. Some methods involve the use of a fixture during planarization that ensures that planarized planes of material are parallel to other deposited planes within a given tolerance. Some methods involve the use of an endpoint detection fixture that ensures precise heights of deposited materials relative to an initial surface of a substrate, relative to a first deposited layer, or relative to some other layer formed during the fabrication process. In some embodiments planarization may occur via lapping while other embodiments may use a diamond fly cutting machine.

Claims

1. A fabrication process for forming a multi-layer three-dimensional structure, comprising:

(a) forming and adhering a given layer comprising at least two deposited materials to a previously formed layer or to a substrate, wherein one or more contact pads exist on the substrate or on a previously formed layer and are thin enough not to undergo planarization during formation of the given layer;

(b) subjecting the at least two materials of the given layer to a planarization operation, comprising;

(i) mounting the substrate to a first fixture in a fly cutting machine;

(ii) while the substrate is mounted to the first fixture, subjecting the deposited materials to a rotating cutting tool to planarize a surface of the at least two deposited materials of the given layer;

(c) positioning a second fixture in contact with the one or more contact pads and in contact with the deposited materials that were subjected to the planarization operation and extracting data from the second fixture concerning a measured height of the planarized deposited materials at at least one point relative to a desired reference point or plane defined by the one or more contact pads;

(d) comparing the measured height of the planarized deposited materials to a desired height for the deposited materials;

(e) if the measured and desired heights are not within a desired tolerance, repeating operations (b)-(d) until the measured and desired heights are within the desired tolerance; and

(f) repeating the forming and adhering of operation (a) one or more times to form the three-dimensional structure from a plurality of adhered layers.

2. The process of claim 1 wherein forming and adhering of the given layer comprises a selective deposition of a first material, and a blanket deposition of a second material.

3. The process claim 1 wherein forming and adhering of the given layer comprises a selective deposition of a first material, a blanket deposition of a second material, and wherein at least one of the first or second materials is deposited via an electroplating operation.

4. The process of claim 1 wherein the planarization operation comprises a lapping operation.

5. The process of claim 1 wherein the planarization operation comprises a diamond machining operation.

6. A fabrication process for forming a multi-layer three-dimensional structure, comprising:

(a) forming and adhering a given layer comprising at least two deposited materials to a previously formed layer or to a substrate, wherein one or more contact pads exist on the substrate or on a previously formed layer and are thin enough not to undergo planarization during formation of the given layer;

(b) subjecting the at least two deposited materials of the given layer to a planarization operation, comprising;

(i) mounting the substrate to a fixture in a fly cutting machine, wherein the fixture has the capability of adjusting the plane of the substrate relative to a cutting plane of the fly cutting machine;

(ii) adjusting the plane of the substrate to match the plane of cutting of the fly cutting machine; and

then

(iii) while the substrate is mounted to the fixture, subjecting the at least two deposited materials to a rotating cutting tool to planarize a surface of the at least two deposited materials; and

(c) repeating the forming and adhering of operation (a) one or more times to form the three-dimensional structure from a plurality of adhered layers,

wherein during formation of at least one layer the one or more contact pads are used in determining a height of the planarized deposited materials.

7. The process of claim 6 wherein forming and adhering of the given layer comprises a selective deposition of a first material, and a blanket deposition of a second material.

8. The process claim 6 wherein forming and adhering of the given layer comprises a selective deposition of a first material, a blanket deposition of a second material, and wherein at least one of the first or second materials is deposited via an electroplating operation.

9. The process of claim 6 wherein the planarization operation comprises a lapping operation.

10. The process of claim 6 wherein the planarization operation comprises a diamond machining operation.