Optical metrology model optimization based on goals

• US 7,588,949 B2
• Filed: 01/29/2007
• Issued: 09/15/2009
• Est. Priority Date: 09/21/2004
• Status: Active Grant

• Current Assignee: Tokyo Electron Limited
• Original Assignee: Tokyo Electron Limited
• Inventors: Bao, Junwei, Li, Shifang, Vuong, Vi, Drege, Emmanuel
• Primary Examiner(s): PERT, EVAN T
• Application Number:
  US11/699,837
• Publication Number:
  US 20070135959A1
• Time in Patent Office: 960 Days
• Field of Search: 438/16, 700/121, 702/85, 703/6
• US Class Current: 438/16
• CPC Class Codes: G03F 7/705 Modelling or simulating from physical phenomena up to complete wafer processes or whole workflow in wafer productions
• CPC Class Codes: G03F 7/70625 Dimensions, e.g. line width, critical dimension [CD], profile, sidewall angle or edge roughness

Abstract

The optimization of an optical metrology model for use in measuring a wafer structure is evaluated. An optical metrology model having metrology model variables, which includes profile model parameters of a profile model, is developed. One or more goals for metrology model optimization are selected. One or more profile model parameters to be used in evaluating the one or more selected goals are selected. One or more metrology model variables to be set to fixed values are selected. One or more selected metrology model variables are set to fixed values. One or more termination criteria for the one or more selected goals are set. The optical metrology model is optimized using the fixed values for the one or more selected metrology model variables. Measurements for the one or more selected profile model parameters are obtained using the optimized optical metrology model. A determination is then made as to whether the one or more termination criteria are met by the obtained measurements.

Claims

1. A method for evaluating an optical metrology model for use in examining a wafer structure, the method comprising:

a) defining an optical metrology model having metrology model variables, which includes profile model parameters of a profile model that characterizes the shape of the wafer structure to be examined;

b) selecting one or more goals for optimizing the optical metrology model;

c) measuring one or more profile model parameters using the optimized optical metrology model and a first metrology device, wherein the first metrology device is an optical metrology device;

d) measuring the one or more profile model parameters using a second metrology device;

e) calculating the one or more selected goals using the one or more profile model parameters measured using the first metrology device and the second metrology device; and

f) evaluating the optical metrology model based on the one or more selected goals calculated in e).

2. The method of claim 1, wherein the one or more profile model parameters measured in c) and d) include one or more widths or a height of the wafer structure to be examined.

3. The method of claim 2, wherein the metrology model variables include one or more wavelength of the incident beam, angle of incident of the incident beam, one or more widths of the wafer structure to be examined, and height of the wafer structure to be examined.

4. The method of claim 3, wherein the metrology model variables include wavelength analyzed, resolution, diffraction orders, diffraction simulation algorithms, refractive index, extinction coefficient, thickness of underlying films, pitch, sidewall angle, and footing.

5. The method of claim 1, wherein the one or more selected goals include closeness of match of measurements.

6. The method of claim 5, wherein the one or more selected goals include precision, accuracy, critical dimension uniformity, correlation coefficient, goodness-of-fit, cost function, figure of merit, throughput, cost of ownership, and return on investment.

7. The method of claim 1, wherein f) comprises:

g) comparing the one or more selected goals calculated in e) to one or more termination criteria;

h) if the one or more termination criteria are not met, then revising the optical metrology model and iterating steps c)-f).

8. The method of claim 7, further comprising:

i) if the one or more termination criteria are met, then collecting verification data using the optical metrology model.

9. The method of claim 1, wherein the first metrology device is a reflectometer or ellipsometer.

10. The method of claim 1, wherein the second metrology device is a non-optical metrology device.

11. The method of claim 10, wherein the second metrology device is a critical dimension scanning electron microscope, a critical dimension atomic force microscope, a cross section scanning electron microscope, a transmission electron microscope.

12. The method of claim 1, wherein the second metrology device is an optical metrology device.

13. The method of claim 12, wherein the second metrology device is a reflectometer or ellipsometer.

14. A system for evaluating an optical metrology model for use in examining a wafer structure, the system comprising:

a model preprocessor configured to define an optical metrology model having metrology model variables, which includes profile model parameters of a profile model that characterizes the shape of the wafer structure to be examined;

a first metrology device configured to measure one or more profile model parameters from the wafer structure using the optical metrology model and a first metrology device, wherein the first metrology device is an optical metrology device;

a second metrology device configured to measure the one or more profile model parameters from the wafer structure; and

a comparator configured to calculate one or more selected goals using the one or more profile model parameters measured using the first metrology device and the second metrology device, and to evaluating the optical metrology model based on the calculated one or more selected goals.

15. The system of claim 14, wherein the one or more profile model parameters measured in c) and d) include one or more widths or a height of the wafer structure to be examined, and wherein the one or more selected goals include closeness of match of measurements.

16. The system of claim 14, further comprising:

a model adjuster configured to receive data from the comparator, to revise the optical metrology model.

17. The system of claim 14, wherein the first metrology device is a reflectometer or ellipsometer.

18. The system of claim 17, wherein the second metrology device is a critical dimension scanning electron microscope, a critical dimension atomic force microscope, a cross section scanning electron microscope, a transmission electron microscope.

19. The system of claim 17, wherein the second metrology device is a reflectometer or ellipsometer.

20. A computer-readable storage medium containing computer executable instructions to evaluate an optical metrology model for use in examining a wafer structure, comprising instructions for:

a) defining an optical metrology model having metrology model variables, which includes profile model parameters of a profile model that characterizes the shape of the wafer structure to be examined;

b) obtaining one or more selected goals for optimizing the optical metrology model;

c) obtaining one or more profile model parameters measured using the optimized optical metrology model and a first metrology device, wherein the first metrology device is an optical metrology device;

d) obtaining the one or more profile model parameters measured using a second metrology device;

e) calculating the one or more selected goals using the one or more profile model parameters measured using the first metrology device and the second metrology device; and

f) evaluating the optical metrology model based on the one or more selected goals calculated in e).

21. The computer-readable storage medium of claim 20, wherein the one or more profile model parameters measured in c) and d) include one or more widths or a height of the wafer structure to be examined, and wherein the one or more selected goals include closeness of match of measurements.

22. The computer-readable storage medium of claim 20, wherein f) comprises instructions for:

g) comparing the one or more selected goals calculated in e) to one or more termination criteria;

h) if the one or more termination criteria are not met, then revising the optical metrology model and iterating steps c)-f).

23. The computer-readable storage medium of claim 22, further comprising instructions for:

i) if the one or more termination criteria are met, then collecting verification data using the optical metrology model.