Multiple-dice packages using elements between dice to control application of underfill material to reduce void formation

• US 7,589,395 B2
• Filed: 06/30/2006
• Issued: 09/15/2009
• Est. Priority Date: 06/30/2006
• Status: Active Grant

• Current Assignee: Intel Corporation
• Original Assignee: Intel Corporation
• Inventors: Manusharow, Mathew J., Moon, Sung-Won, Sathe, Ajit V.
• Primary Examiner(s): Le; Thao P.
• Application Number:
  US11/428,250
• Publication Number:
  US 20080001310A1
• Time in Patent Office: 1,173 Days
• Field of Search: 257787-795, 257/620, 257/724, 257/725
• US Class Current: 257/620
• CPC Class Codes: H01L 21/563 Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73203 Bump and layer connectors
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00011 Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H05K 1/023 using auxiliary mounted passive components or auxiliary substances printed passive components H05K1/16
• CPC Class Codes: H05K 1/181 associated with surface mounted components
• CPC Class Codes: H05K 2201/10522 Adjacent components
• CPC Class Codes: H05K 2201/10674 Flip chip
• CPC Class Codes: H05K 3/305 Affixing by adhesive
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product

Abstract

Application of underfill material may be controlled to minimize the formation of voids between a plurality of integrated circuit (“IC”) dice and a substrate in an IC package. One or more elements are located in a gap between two dice to control the flow of underfill material and minimize the formation of voids within the underfill material. In an embodiment, an element may be an active electrical component, a passive electrical component, or a non-functional electrical component. Methods of fabrication, as well as application of the package to an electronic assembly and to an electronic system, are also described.

Claims

1. An integrated circuit package comprising:

a substrate having a plurality of dice on a surface thereof, the dice being separated by a gap, and the dice having a height;

one or more elements in the gap between the dice, wherein the one or more elements have a height that is at least 5% of the height of the dice; and

an underfill material covering the dice and the one or more elements;

wherein the gap is greater than a gap for which an application of the underfill from one edge of the integrated circuit package would increase a potential to form underfill voids in portions of the dice furthest from the edge in the absence of the one or more elements.

2. The package recited in claim 1, wherein the one or more elements comprise active or passive electrical components.

3. The package recited in claim 2, wherein the electrical components comprise capacitors.

4. The package recited in claim 1, wherein the one or more elements are in an orientation orthogonal to the dice.

5. The package recited in claim 1, wherein the one or more elements are in a symmetrical orientation with respect to one another.

6. The package recited in claim 1, wherein a selected element has a length and a width;

wherein two opposing dice are arranged on either side of the gap; and

wherein the selected element is oriented in the gap so that its length extends between the opposing dice.

7. The package recited in claim 1, wherein a selected element has a length and a width;

wherein two opposing dice are arranged on either side of the gap; and

wherein the selected element is oriented in the gap so that its width extends between the opposing dice.

8. The package recited in claim 1, wherein the one or more elements have different heights.

9. The package recited in claim 1, wherein two or more dice are linearly arranged on the substrate.

10. An electronic system comprising:

a bus coupling components in the electronic system;

a display coupled to the bus;

external memory coupled to the bus; and

a processor coupled to the bus and having an electronic assembly including at least one component package having

a substrate having a plurality of dice on a surface thereof, the dice being separated by a gap having a width;

one or more elements in the gap between the dice, wherein the elements have a width that is at least 5% of the gap width; and

a congealed material surrounding the dice and elements;

wherein the gap is greater than a gap for which an application of the underfill from one edge of the integrated circuit package would increase a potential to form underfill voids in portions of the dice furthest from the edge in the absence of the one or more elements.

11. The system recited in claim 10, wherein the one or more elements comprise active or passive electrical components.

12. The system recited in claim 11, wherein the electrical components comprise capacitors.

13. The system recited in claim 10, wherein the one or more elements are in an orientation orthogonal to the dice.

14. The system recited in claim 10, wherein the one or more elements are in a symmetrical orientation with respect to one another.

15. The system recited in claim 10, wherein a selected element has a length and a width;

wherein two opposing dice are arranged on either side of the gap; and

wherein the selected element is oriented in the gap so that its length extends between the opposing dice.

16. The system recited in claim 10, wherein a selected element has a length and a width;

wherein two opposing dice are arranged on either side of the gap; and

wherein the selected element is oriented in the gap so that its width extends between the opposing dice.

17. The system recited in claim 10, wherein the one or more elements have different heights.

18. The system recited in claim 10, wherein two or more dice are linearly arranged on the substrate.