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Probe card having a conductive thin film on the surface of an insulating film behind each of the alignment marks each marks comprises a plurality of second bumps

  • US 7,589,543 B2
  • Filed: 12/13/2005
  • Issued: 09/15/2009
  • Est. Priority Date: 12/20/2004
  • Status: Expired due to Fees
First Claim
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1. A probe card for a wafer level test of electrical characteristics of a plurality of semiconductor integrated circuit devices formed on a semiconductor wafer, said probe card comprising:

  • an insulating thin film held by a rigid ring;

    a plurality of first bumps on the insulating thin film for contacting inspection electrodes of a plurality of semiconductor integrated circuit devices;

    a plurality of alignment marks on the insulating thin film, anda conductive thin film on a surface of the insulating thin film behind each of the alignment marks, the conductive thin film being larger in area than the alignment mark to contrast with the plurality of second bumps forming the alignment marks during image processing using a recognition camera,wherein each of the alignment marks comprises a plurality of second bumps formed simultaneously with the first bumps that do not contact said inspection electrodes, the plurality of second bumps positioned closely to one another.

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