Patterning device

• US 7,593,094 B2
• Filed: 06/26/2006
• Issued: 09/22/2009
• Est. Priority Date: 06/26/2006
• Status: Active Grant

• Current Assignee: ASML Netherlands BV (ASML Holding NV)
• Original Assignee: ASML Netherlands BV (ASML Holding NV)
• Inventors: Dekkers, Jeroen-Frank, Montagne, Antonius Johannes Maria, Klatser, Paul, Van Drieenhuizen, Bert Pieter, Hagting, Marcus
• Primary Examiner(s): Kim; Peter B
• Application Number:
  US11/474,493
• Publication Number:
  US 20070296944A1
• Time in Patent Office: 1,184 Days
• Field of Search: 355/53, 355/67, 385/18, 359/290, 359/298
• US Class Current: 355/67
• CPC Class Codes: G03B 27/54 Lamp housings; Illuminating means
• CPC Class Codes: G03F 7/70275 Multiple projection paths, e.g. array of projection systems, microlens projection systems or tandem projection systems
• CPC Class Codes: G03F 7/70291 Addressable masks, e.g. spatial light modulators [SLMs], digital micro-mirror devices [DMDs] or liquid crystal display [LCD] patterning devices

Abstract

A system and method allow for a more effective and efficient patterning device architecture and control arrangement. A lithography apparatus comprises an illumination system, a patterning device, and a projection system. The illumination system is configured to condition a beam of radiation. The patterning device is configured to pattern the beam of radiation. The patterning device comprises a control system and an array of individually controllable elements. The control system is configured to convert analog signals having respective first voltage values to corresponding differential control signals having second, higher voltage values. Corresponding ones of the individually controllable elements in the array of individually controllable elements are configured to actuate based on receiving a corresponding one of the differential control signals. The projection system is configured to project the patterned beam onto a target area of a substrate.

Claims

1. A lithography apparatus, comprising:

an illumination system configured to condition a beam of radiation;

a patterning device configured to pattern the beam of radiation, the patterning device comprising,

a control system configured to convert analog signals having respective first voltage values to corresponding differential control signals having second, higher voltage values, and

an array of individually controllable elements, corresponding ones of the individually controllable elements in the array of individually controllable elements being configured to actuate based on receiving a corresponding one of the differential control signals; and

a projection system configured to project the patterned beam onto a target area of a substrate.

2. The lithographic apparatus of claim 1, wherein the control system comprises:

a plurality of pins that receive a respective one of the analog signals; and

a plurality of differential amplifiers coupled to each of the plurality of pins, each of the differential amplifiers being coupled to a respective column of individually controllable elements in the array of individually controllable elements.

3. The lithographic apparatus of claim 2, wherein the control system is configured to generate a row address signal that controls which row of the respective column receives the corresponding one of the differential control signals.

4. The lithographic apparatus of claim 3, wherein each of the single or multiple stage switched-capacitor sample and hold amplifier circuits comprise:

a switched-capacitor portion;

a bias power source coupled to the switched-capacitor portion; and

first and second operational amplifiers coupled to the switched capacitor portion.

5. The lithographic apparatus of claim 4, wherein each of the single or multiple stage switched-capacitor sample and hold amplifier circuits further comprise:

first and second capacitors coupled to feedback loops of respective ones of the first and second operational amplifiers; and

first and second switches positioned in respective ones of the feedback loops, the first and second switches configured to move between a reset position and a hold position.

6. The lithographic apparatus of claim 2, wherein each of the differential amplifiers comprises a single stage or multiple stage switched-capacitor sample and hold amplifier circuit.

7. The lithographic apparatus of claim 2, wherein each of the single or multiple stage switched-capacitor sample and hold amplifier circuits comprise:

a push-pull output stage; and

a non-linear push-pull boost circuit.

8. The lithographic apparatus of claim 2, wherein the patterning device further comprises driving sections each coupled to respective ones of the individually controllable elements, the driving sections comprising:

first and second field effect transistors having gates that receive a respective portion of the control signal from a respectively selected row select line;

first and second electrodes coupled to respective ones of the first and second field effect transistors; and

first and second capacitors coupled between respective ones of the first and second field effect transistors and the first and second electrodes,

wherein the first and second capacitors are configured to store a charge correlating to the received respective portion of the differential control signal during a programming mode, and

wherein the first and second electrodes are configured to actuate movement of a corresponding one of the individually controllable elements based on the respective stored charges during an exposure mode.

9. The lithographic apparatus of claim 8, wherein the patterning device includes four quadrants and wherein:

bottom plates of the first capacitors in each of the driving sections of each of the four quadrants are coupled together; and

bottom plates of the second capacitors in each of the driving sections of each of the four quadrants are coupled together.

10. The lithographic apparatus of claim 1, wherein the array comprises at least about 10 million of the individually controllable elements.

11. The lithographic apparatus of claim 1, wherein the individually controllable elements comprise SiGe mirrors.

12. The lithographic apparatus of claim 1, wherein the individually controllable elements comprises mirrors having about a 8 μ

m width and length.

13. The lithographic apparatus of claim 1, further comprising:

first and second electrodes associated with each of the individually controllable elements, wherein each of the individually controllable elements comprises a bias electrode, such that the bias electrode receives a slow attack, fast decay negative raised cosine pulse during energizing of the driving electrodes to produce fast resonant free mirror position settling in within about 2 μ

s.

14. The lithographic apparatus of claim 1, wherein the patterning device further comprises a testing system coupled to the array of individually controllable devices and the control system.

15. The lithographic apparatus of claim 14, wherein the testing system is configured to test the control system.

16. The lithographic apparatus of claim 14, wherein the testing system is configured to test the individually controllable elements.

17. The lithographic apparatus of claim 1, wherein the patterning device further comprises a temperature sensor or an array of temperature sensors.

18. The lithographic apparatus of claim 1, the patterning device further comprising a plurality of bias electrodes, each of the bias electrode being coupled to a respective one of the individually controllable elements.

19. The lithographic apparatus of claim 18, wherein the bias electrodes are coupled together.

20. A device manufacturing method, comprising:

generating differential control signals having respective first voltages from analog input signals having second, lower voltages;

controlling respective ones of individually controllable elements within an array of individually controllable elements using corresponding ones of the differential control signals;

patterning a beam of radiation using the array of individually controllable elements; and

projecting the patterned beam onto a target portion of a substrate.

21. A patterning device, comprising:

a control system configured to convert analog signals having respective first voltage values to corresponding differential control signals having second, higher voltage values, and

an array of individually controllable elements, corresponding ones of the individually controllable elements in the array of individually controllable elements being configured to actuate based on receiving a corresponding one of the differential control signals.

22. The patterning device of claim 21, wherein the control system comprises:

a plurality of pins that receive a respective one of the analog signals; and

a plurality of differential amplifiers coupled to each of the plurality of pins, each of the differential amplifiers being coupled to a respective column of individually controllable elements in the array of individually controllable elements.

23. The patterning device of claim 22, wherein the control system is configured to generate a row address signal that controls which row of the respective column receives the corresponding one of the differential control signals.

24. The patterning device of claim 23, wherein each of the single or multiple stage switched-capacitor sample and hold amplifier circuits comprise:

a switched-capacitor portion;

a bias power source coupled to the switched-capacitor portion; and

first and second operational amplifiers coupled to the switched capacitor portion.

25. The patterning device of claim 24, wherein each of the single or multiple stage switched-capacitor sample and hold amplifier circuits further comprise:

first and second capacitors coupled to feedback loops of respective ones of the first and second operational amplifiers; and

first and second switches positioned in respective ones of the feedback loops, the first and second switches configured to move between a reset position and a hold position.

26. The patterning device of claim 22, wherein each of the differential amplifiers comprises a single stage or multiple stage switched-capacitor sample and hold amplifier circuit.

27. The patterning device of claim 22, wherein each of the single or multiple stage switched-capacitor sample and hold amplifier circuits comprise:

a push-pull output stage; and

a non-linear push-pull boost circuit.

28. The patterning device of claim 22, further comprising driving sections each coupled to respective ones of the individually controllable elements, the driving sections comprising:

first and second field effect transistors having gates that receive a respective portion of the control signal from a respectively selected row select line;

first and second electrodes coupled to respective ones of the first and second field effect transistors; and

first and second capacitors coupled between respective ones of the first and second field effect transistors and the first and second electrodes,

wherein the first and second capacitors are configured to store a charge correlating to the received respective portion of the differential control signal during a programming mode, and

wherein the first and second electrodes are configured to actuate movement of a corresponding one of the individually controllable elements based on the respective stored charges during an exposure mode.

29. The patterning device of claim 28, comprising four quadrants and wherein:

bottom plates of the first capacitors in each of the driving sections of each of the four quadrants are coupled together; and

bottom plates of the second capacitors in each of the driving sections of each of the four quadrants are coupled together.

30. The patterning device of claim 21, wherein the array comprises at least about 10 million of the individually controllable elements.

31. The patterning device of claim 21, wherein the individually controllable elements comprise SiGe mirrors.

32. The patterning device of claim 31, wherein the individually controllable elements comprises mirrors having about a 8 μ

m width and length.

33. The patterning device of claim 31, further comprising:

first and second electrodes associated with each of the individually controllable elements, wherein each of the individually controllable elements comprises a bias electrode, such that the bias electrode receives a slow attack, fast decay negative raised cosine pulse during energizing of the driving electrodes to produce fast resonant free mirror position settling in within about 2 μ

s.

34. The patterning device of claim 21, further comprising a testing system coupled to the array of individually controllable devices and the control system.

35. The patterning device of claim 34, wherein the testing system is configured to test the control system.

36. The patterning device of claim 34, wherein the testing system is configured to test the individually controllable elements.

37. The patterning device of claim 21, further comprising a temperature sensor or an array of temperature sensors.

38. The patterning device of claim 21, further comprising a plurality of bias electrodes, each of the bias electrode being coupled to a respective one of the individually controllable elements.

39. The patterning device of claim 38, wherein the bias electrodes are coupled together.