Selective deposition of embedded transient protection for printed circuit boards
First Claim
Patent Images
1. A printed circuit board with integrated transient protection, the printed circuit board comprising:
- a conductive via barrel; and
a transient protection material selectively deposited on or in portions of a plane selected from a signal plane, a power plane and a ground plane, and wherein said selectively deposited transient protection material is in contact with and bridges a region between a conductive material in the plane and a via structure selected from the conductive via barrel and a via pad connected to the conductive via barrel, wherein the transient protection material forms part of a transient protection discharge path extending through the via structure.
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Abstract
Protection for sensitive components on a printed circuit board by selectively depositing transient protection material on one or more layers of the printed circuit board is disclosed.
69 Citations
21 Claims
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1. A printed circuit board with integrated transient protection, the printed circuit board comprising:
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a conductive via barrel; and a transient protection material selectively deposited on or in portions of a plane selected from a signal plane, a power plane and a ground plane, and wherein said selectively deposited transient protection material is in contact with and bridges a region between a conductive material in the plane and a via structure selected from the conductive via barrel and a via pad connected to the conductive via barrel, wherein the transient protection material forms part of a transient protection discharge path extending through the via structure. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A method for making a printed circuit board with integrated transient protection, the method comprising:
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printing and etching a copper clad core material comprising any one of resin impregnated fiberglass cloth, random fiber and film material; selectively depositing a transient protection material on or in portions of a plane selected from a signal plane, a power plane and a ground plane, and wherein said selectively deposited transient protection material is in contact with and bridges a region between a conductive material in the plane and a via structure selected from a via pad and a conductive via barrel, wherein the transient protection material forms part of a transient protection discharge path extending through the via structure; and laminating said copper clad core into a multilayer PCB structure and completing a fabrication process of said PCB by;
drilling holes, depositing conductive seed, imaging, plating-, and etching outer layer copper to form component mounting pads connected to elements of selectively deposited transient protection material. - View Dependent Claims (10, 11, 12, 13, 14, 15)
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16. A system with integrated transient protection, the system comprising:
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a multi-layered printed circuit board having a length, a width and a cross-sectional area; a plurality of electrical components on one or more layers of said multi-layered printed circuit board, wherein said multi-layered printed circuit board comprises at least one signal region, at least one power region, and at least one ground region; and a transient protection material selectively deposited on or in portions of said one or more layers or regions, wherein said selectively deposited transient protection material is in contact with and situated between a conductive material in any of said one or more layers or regions and a via structure of a via traversing said one or more layers or regions, the via structure being selected from a via pad and a conductive via barrel, wherein the transient protection material forms part of a transient protection discharge path extending through the via structure.
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17. A planar distributed capacitance structure with integrated transient protection, the planar distributed capacitance structure comprising:
a subcomposite structure including multiple layers and a via traversing the multiple layers wherein said sub-composite structure includes transient protection material in contact with and situated between a via structure of the via and at least one layer of conductive material of the subcomposite structure, wherein the via structure is selected from a via pad and a conductive via barrel, wherein the transient protection material forms part of a transient protection discharge path extending through the via structure, and wherein the subcomposite structure has a capacitance of at least 100 picofarads per square inch. - View Dependent Claims (18, 19)
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20. A system with integrated transient protection, the system comprising:
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a multi-layered planar distributed capacitance structure having a length, a width and a cross-sectional area; and a plurality of electrical components on one or more layers of said multi-layered planar distributed capacitance structure; wherein said multi-layered planar distributed capacitance structure comprises at least one sub-composite structure, wherein said sub-composite structure includes transient protection material in contact with and situated between a via structure and a region of a layer of conductive material, the via structure being selected from a via pad and a conductive via barrel, the transient protection material forming part of a transient protection discharge path extending through the via structure, the sub-composite structure having a capacitance of at least 100 picofarads per square inch. - View Dependent Claims (21)
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Specification