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Selective deposition of embedded transient protection for printed circuit boards

  • US 7,593,203 B2
  • Filed: 02/16/2006
  • Issued: 09/22/2009
  • Est. Priority Date: 02/16/2005
  • Status: Active Grant
First Claim
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1. A printed circuit board with integrated transient protection, the printed circuit board comprising:

  • a conductive via barrel; and

    a transient protection material selectively deposited on or in portions of a plane selected from a signal plane, a power plane and a ground plane, and wherein said selectively deposited transient protection material is in contact with and bridges a region between a conductive material in the plane and a via structure selected from the conductive via barrel and a via pad connected to the conductive via barrel, wherein the transient protection material forms part of a transient protection discharge path extending through the via structure.

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