Methods of operating electronic devices, and methods of providing electronic devices

• US 7,593,708 B2
• Filed: 08/29/2006
• Issued: 09/22/2009
• Est. Priority Date: 03/01/1999
• Status: Expired due to Fees

• Current Assignee: Round Rock Research LLC
• Original Assignee: Keystone Technology Solutions, LLC
• Inventors: Tandy, Patrick W.
• Primary Examiner(s): Tran; Pablo N
• Application Number:
  US11/512,783
• Publication Number:
  US 20060293019A1
• Time in Patent Office: 1,120 Days
• Field of Search: 455/333, 455/90.3, 455/575.1, 455/550.1, 455/90.2, 455/575.8, 455/334, 455/351, 455/73, 455/80, 455/88, 455/83, 455/41.2, 455128-129, 455347-348, 455572-574, 455/90.1, 455/41.1, 455/127.1, 455/127.5, 455/343.1, 455/343.6, 455/344, 455291-292, 257723-725, 257/700, 257/712, 257/728, 257/778, 257/787, 257/679, 257/924, 340/825.32, 342 42- 44, 343701-703, 343/720, 320101-102, 320/124, 320/127, 320137-138
• US Class Current: 455/333
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48257 connecting the wire to a die pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/85399 Material
• CPC Class Codes: H01L 23/48 Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 25/0655 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2924/207 : Diameter ranges
• CPC Class Codes: H01Q 1/2283 : mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
• CPC Class Codes: H04B 1/3816 : Mechanical arrangements for accommodating identification devices, e.g. cards or chips; with connectors for programming identification devices
• CPC Class Codes: H04B 1/3833 : Hand-held transceivers

Abstract

Some embodiments include a method disposing an integrated circuit die within a housing, the integrated circuit die having integrated circuitry formed thereon, the integrated circuitry including first transponder circuitry configured to transmit and receive radio frequency signals, wherein the integrated circuit die is void of external electrical connections for anything except power supply external connections; and disposing second transponder circuitry, discrete from the first transponder circuitry, within the housing, the second transponder circuitry being configured to transmit and receive radio frequency signals, wherein the first and second transponder circuitry are configured to establish wireless communication between one another within the housing, the second transponder circuitry being disposed within 24 inches of the first transponder circuitry within the housing.

Claims

1. A method comprising:

disposing an integrated circuit die within a housing, the integrated circuit die having integrated circuitry formed thereon, the integrated circuitry including first transponder circuitry configured to transmit and receive radio frequency signals;

disposing second transponder circuitry, discrete from the first transponder circuitry, within the housing, the second transponder circuitry being configured to transmit and receive radio frequency signals, wherein the first and second transponder circuitry are configured to establish wireless communication between one another within the housing, and except for a power supply and ground, the first and second integrated circuit are void of external wired electrical connections between each other, the second transponder circuitry being disposed within 24 inches of the first transponder circuitry within the housing; and

associating an antenna with the first transponder circuitry.

2. The method of claim 1, and comprising disposing more than one die in the housing.

3. The method of claim 1, and further comprising disposing the second transponder circuitry on a second integrated circuit die.

4. The method of claim 1, and further comprising disposing a substrate within the housing, and supporting the first and second transponder circuitry supported on the substrate.

5. The method of claim 1, and further comprising disposing a printed circuit board substrate within the housing, and supporting the first and second transponder circuitry on the printed circuit board substrate.

6. The method of claim 1, wherein the housing is sized to be hand-carriable.

7. The method of claim 1, wherein the housing is a microelectronic package.

8. The method of claim 1, wherein the first and second transponder circuitry comprise individual respective antennas configured to transmit and receive wireless communications.

9. The method of claim 1, wherein the first and second transponder circuitry comprise individual respective antennas configured to transmit and receive wireless RF communications.

10. The method of claim 1, wherein the first and second transponder circuitry comprise respective antennas configured to transmit and receive the wireless communication.

11. The method of claim 1, wherein the first and second transponder circuitry comprise respective antennas configured to transmit and receive wireless communication, the method further comprising disposing the antennas within one inch of one another within the housing.

12. The method of claim 1, wherein the first and second transponder circuitry comprise respective antennas configured to transmit and receive wireless communication, the method further comprising disposing the antennas within one half inch of one another within the housing.

13. A method comprising:

disposing an integrated circuit die within a housing and supporting the die by an integrated circuitry-supporting substrate inside the housing, the integrated circuit die having integrated circuitry formed thereon, the integrated circuitry having first transponder circuitry configured to transmit and receive wireless communications, the integrated circuit die having physical-electrical connection structure securing it to the integrated circuitry-supporting substrate and providing electrical connections;

disposing second transponder circuitry, discrete from the first transponder circuitry, within the housing, within 24 inches of the first transponder circuitry, the second transponder circuitry being configured to transmit and receive wireless communications;

causing the first and second transponder circuitry to establish wireless communications between one another within the housing, wherein the first and second integrated transponder circuitry are void of wired electrical connections between each other, except for one of a power supply and ground; and

operably associating an antenna with the first transponder circuitry.

14. The method of claim 13, wherein the wireless communication comprises RF communication.

15. The method of claim 13, and further comprising disposing the second transponder circuitry on a second integrated circuit die supported by the integrated circuitry-supporting substrate.

16. The method of claim 13, and further comprising supporting the second transponder circuitry by the integrated circuitry-supporting substrate.

17. The method of claim 13, wherein the housing is sized to be hand-transportable.

18. The method of claim 13, wherein the housing is a microelectronic package.

19. The method of claim 13, further comprising operably associating individual antennas with the first and second transponder circuitry respectively, and disposing the antennas within the housing within one inch of one another.

20. The method of claim 13, further comprising operably associating individual antennas with the first and second transponder circuitry respectively, and disposing the antennas within the housing within one half inch of one another.

21. The method of claim 13, and further comprising hermetically sealing the housing.

22. A method of operating a device comprising:

mounting a transmitter integrated circuit within a housing, wherein the transmitter integrated circuit die has physical-electrical connection structure securing it within the housing, said structure providing electrical connections for one of power only;

mounting an integrated circuit receiver within the housing;

positioning the transmitter and the receiver within 24 inches of one another;

transmitting a wireless communication using the transmitter;

receiving the produced wireless communication using the receiver inside the housing; and

responsive to said receiving, causing integrated circuitry separate from the transmitter and receiver to operate.

23. The method of claim 22, wherein the housing is a microelectronic package.

24. The method of claim 22, further comprising positioning the transmitter and the receiver within one inch of one another.

25. The method of claim 22, further comprising positioning the transmitter and the receiver within one half inch of one another.

26. The method of claim 22, further comprising fabricating the integrated circuitry.

27. A method of operating a microelectronic device comprising:

transmitting a wireless communication signal using an integrated circuitry transmitter inside a plastic package, the transmitter having physical-electrical connection structure securing it within the package, said structure providing electrical connections for power only;

receiving the transmitted wireless communication signal using an integrated circuitry receiver inside the package; and

responsive to said receiving, causing the integrated circuitry within the package to operate.

28. The method of claim 27, further comprising positioning the transmitter and the receiver within 24 inches of one another.

29. The method of claim 27, further comprising positioning the transmitter and the receiver within one inch of one another.

30. The method of claim 27, further comprising positioning the transmitter and the receiver within one half inch of one another.

31. The method of claim 27, further comprising fabricating one of the integrated circuitry transmitter or receiver.

32. A method of forming a microelectronic device comprising:

mounting an integrated circuitry transmitter within a housing; and

mounting an integrated circuit die within the housing, wherein the integrated circuit die has physical-electrical connection structure securing it within the housing, said structure providing electrical connections for power only, the die having integrated circuitry disposed thereon including an integrated circuit receiver, wherein the transmitter and receiver are configured to establish direct wireless communication with one another, wherein operating instructions for the integrated circuitry on the die are transmitted and received within the housing.

33. The method of claim 32, wherein the transmitter and the receiver are mounted within 24 inches of one another.

34. The method of claim 32, wherein the transmitter and the receiver are mounted within one inch of one another.

35. The method of claim 32, wherein the transmitter and the receiver are mounted within one half inch of one another.

36. A method of forming an electronic device, the method comprising:

providing a housing of the electronic device; and

mounting a plurality of integrated circuits within the housing, the plurality of integrated circuits including first and second integrated circuits configured to communicate with each other via at least one wireless communication link within the housing, wherein except for at least one of a power supply and a ground, the first and second integrated circuits are void of external wired electrical connections between each other.

37. The method of claim 36, wherein the first wire connected integrated circuit is formed on a first integrated circuit die;

and the second wire connected integrated circuit is formed on a second integrated circuit die.

38. The method of claim 37, wherein the first wire connected integrated circuit includes a first processor and a radio frequency receiver for the wireless communication link;

and the second wire connected integrated circuit includes a second processor and a radio frequency transmitter for the wireless communication link.

39. The method of claim 37, wherein the first integrated circuit die is void of wired external electrical connections except for power supply;

and the second integrated circuit die is void of wired external electrical connections except for power supply.

40. The method of claim 37, wherein the first wire connected integrated circuit is disposed within a self-contained hermetically-sealed package that is void of external electrical connections except for power supply.