Surface mount package

• US 7,595,453 B2
• Filed: 05/24/2005
• Issued: 09/29/2009
• Est. Priority Date: 05/24/2005
• Status: Expired due to Fees

• Current Assignee: MACOM Technology Solutions Holdings, Inc.
• Original Assignee: MACOM Technology Solutions Holdings, Inc.
• Inventors: Palmteer, William
• Primary Examiner(s): Reichard; Dean A.
• Assistant Examiner(s): Semenenko; Yuriy
• Application Number:
  US11/136,249
• Publication Number:
  US 20060266546A1
• Time in Patent Office: 1,589 Days
• Field of Search: 174/255, 174/260, 257/704, 257/707, 257/774
• US Class Current: 174/255
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 23/142 Metallic substrates having insulating layers
• CPC Class Codes: H01L 23/49537 Plurality of lead frames mounted in one device
• CPC Class Codes: H01L 23/49861 Lead-frames fixed on or encapsulated in insulating substrates H01L23/4985, H01L23/49805 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/10253 Silicon [Si]
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: Y10T 29/49124 On flat or curved insulated base, e.g., printed circuit, etc.

Abstract

A surface mount package is provided that includes a first metal layer and a second metal layer configured to be electrically connected to the first metal layer. The surface mount package further includes a ceramic layer between the first and second metal layers. The ceramic layer has an opening therethrough.

Claims

1. A surface mount package comprising:

a first lead frame;

a second lead frame configured to be electrically connected to the first lead frame and forming a metal frame structure having a cavity for receiving therein a surface mounted device; and

a ceramic layer between the first and second lead frames, the ceramic layer configured to electrically isolate a positive side and a negative side of the lead frames.

2. A surface mount package in accordance with claim 1 further comprising an opening in the second lead frame and a corresponding opening in the ceramic layer.

3. A surface mount package in accordance with claim 1 wherein the first lead frame comprises a gap configured to electrically isolate the positive side and the negative side of the lead frames.