Electronic circuit device

• US 7,595,998 B2
• Filed: 11/08/2005
• Issued: 09/29/2009
• Est. Priority Date: 11/10/2004
• Status: Expired due to Fees

• Current Assignee: Panasonic Corporation (Panasonic Holdings Corporation)
• Original Assignee: Panasonic Corporation (Panasonic Holdings Corporation)
• Inventors: Tokunaga, Shigetomi
• Primary Examiner(s): Bui; Hung S
• Application Number:
  US11/568,293
• Publication Number:
  US 20070222046A1
• Time in Patent Office: 1,421 Days
• Field of Search: 361/760, 361/741, 361/730, 361/720, 361/736, 361/748, 361/752, 361/790, 361/797, 361/800, 361/807, 361/810, 361/803, 174260-261
• US Class Current: 361/752
• CPC Class Codes: H01L 23/34 Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements thermal treatment apparatus H01L21/00
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 1/0203 Cooling of mounted components H05K1/0272 takes precedence
• CPC Class Codes: H05K 1/141 One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters H05K1/142 and H05K1/147 take precedence
• CPC Class Codes: H05K 2201/1034 Edge terminals, i.e. separate pieces of metal attached to the edge of the printed circuit board [PCB]
• CPC Class Codes: H05K 2201/1056 Metal over component, i.e. metal plate over component mounted on or embedded in PCB
• CPC Class Codes: H05K 2201/10689 Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
• CPC Class Codes: H05K 3/284 for encapsulating mounted components H05K1/185 takes precedence
• CPC Class Codes: H05K 3/366 substantially perpendicularly to each other H05K3/361 takes precedence

Abstract

An electronic circuit device includes a sub-board disposed upright on a main board. The sub-board is electrically coupled to the main board via a board terminal) disposed at sub-board edge. A semiconductor element is mounted on the sub-board facing the sub-board in parallel. A temperature sensor is also mounted on the sub-board. A heat sink is formed so as to surround the sub-board and the semiconductor element. A resin material is injected inside a heat sink so as to cover the sub-board, the temperature sensor, and the semiconductor element.

Claims

1. An electronic circuit device comprising:

a sub-board electrically coupled to a main board via a board terminal disposed at a sub-board edge, and disposed upright on the main board;

a semiconductor element mounted on the sub-board, the semiconductor element facing the sub-board in parallel;

a temperature sensor mounted on the sub-board adjacent the semiconductor element for detecting a temperature of the semiconductor element;

a heat sink formed so as to surround the sub-board and the semiconductor element; and

a resin material injected inside the heat sink so as to cover the sub-board, the temperature sensor, and a first portion of the semiconductor element,

wherein a second portion of the semiconductor element remains uncovered by the resin material and is attached to the heat sink to conduct thermal energy away from the semiconductor element, and

wherein the semiconductor element stops operating when the temperature sensor detects a temperature exceeding a predetermined temperature.

2. The electronic circuit device as defined in claim 1, wherein the temperature sensor is mounted on the sub-board at the same side of the semiconductor element.

3. The electronic circuit device as defined in claim 1, wherein the resin material is a potting material.

4. The electronic circuit device as defined in claim 1, wherein the resin material has high heat conductance.

5. The electronic circuit device as defined in claim 1, wherein the resin material is a mixture of urethane resin and inorganic filler.