Plasma processing system and baffle assembly for use in plasma processing system

• US 7,601,242 B2
• Filed: 01/11/2005
• Issued: 10/13/2009
• Est. Priority Date: 01/11/2005
• Status: Active Grant

• Current Assignee: Tokyo Electron Limited
• Original Assignee: Tokyo Electron Limited
• Inventors: Fink, Steven T.
• Primary Examiner(s): Cleveland; Michael
• Assistant Examiner(s): Chen; Keath T
• Application Number:
  US11/032,101
• Publication Number:
  US 20060151114A1
• Time in Patent Office: 1,736 Days
• Field of Search: 156/345.51
• US Class Current: 156/345.51
• CPC Class Codes: H01J 37/3244 Gas supply means
• CPC Class Codes: H01J 37/32633 Baffles
• CPC Class Codes: H01L 21/67069 for drying etching

Abstract

The present invention presents a baffle assembly located in a plasma processing system, comprising a baffle carrier attached to the plasma processing system, and at least two baffle inserts having a plurality of passages therethrough, the at least two baffle inserts being supported by the baffle carrier.

Claims

1. A baffle assembly located in a plasma processing system having a chuck assembly for holding a substrate, comprising:

a baffle carrier formed into a ring surrounding the chuck assembly attached to the plasma processing system; and

at least two baffle inserts having a plurality of passages therethrough, the at least two baffle inserts being removably disposed on top of and supported by the baffle carrier,

wherein the at least two baffle inserts are not attached to the baffle carrier and lie on the baffle carrier.

2. The baffle assembly as recited in claim 1, wherein the at least two baffle inserts are not secured to any part of the plasma processing system.

3. The baffle assembly as recited in claim 1, wherein the at least two baffle inserts have the same shape.

4. The baffle assembly as recited in claim 1, wherein each of the at least two baffle inserts are adjacent to each other.

5. The baffle assembly as recited in claim 1, wherein the at least two baffle inserts have a disk shape.

6. The baffle assembly as recited in claim 1, wherein the plasma processing system includes a passageway for gas, and the at least two baffle inserts cover substantially the entire passageway.

7. The baffle assembly as recited in claim 1, wherein the baffle carrier comprises a baffle carrier ring attached to the chuck assembly and baffle carrier supports secured to the baffle carrier ring, and edges of the at least two baffle inserts are supported by the baffle carrier supports.

8. The baffle assembly as recited in claim 1, wherein the baffle inserts are substantially horizontal.

9. A plasma processing system comprising:

a processing chamber;

a chuck assembly disposed in said chamber for holding a substrate; and

a baffle assembly located in the processing chamber, wherein said baffle assembly comprises a baffle carrier formed into a ring surrounding the chuck assembly attached to the plasma processing system, and at least two baffle inserts having a plurality of passages therethrough, the at least two baffle inserts being removably disposed on top of and supported by the baffle carrier,

wherein the at least two baffle inserts are not attached to the baffle carrier and lie on the baffle carrier.

10. The plasma processing system as recited in claim 9, wherein the at least two baffle inserts are not secured to any part of the plasma processing system.

11. The plasma processing system as recited in claim 9, wherein the at least two baffle inserts have the same shape.

12. The plasma processing system as recited in claim 9, wherein each of the at least two baffle inserts are adjacent to each other.

13. The plasma processing system as recited in claim 9, wherein the at least two baffle inserts have a disk shape.

14. The plasma processing system as recited in claim 9, wherein the plasma processing system includes a passageway for gas, and the at least two baffle inserts cover substantially the entire passageway.

15. The plasma processing system as recited in claim 9, wherein the baffle carrier comprises a baffle carrier ring attached to the chuck assembly and baffle carrier supports secured to the baffle carrier ring, and edges of the at least two baffle inserts are supported by the baffle carrier supports.

16. The plasma processing system as recited in claim 9, wherein the baffle inserts are substantially horizontal.