Methods for producing a light emitting semiconductor body with a luminescence converter element
First Claim
1. A method for fabricating a light-radiating semiconductor component that includes an electrically contacted light emitting semiconductor body, mounted on a substrate element, and a luminescence conversion element that comprises at least one luminescent material and is deposited on said semiconductor body, characterized by the steps offabricating said semiconductor body, mounting on said substrate element and electrical contacting,applying a layer of bonding agent to at least one surface of said semiconductor body, wherein a maximum thickness of the layer of bonding agent is smaller than a thickness of the semiconductor body, andapplying at least one luminescent material to the layer of bonding agent.
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Accused Products
Abstract
The invention describes two methods of fabricating semiconductor components in which a luminescence conversion element is applied directly to the semiconductor body (1). In the first method, a suspension (4) containing a bonding agent and at least one luminescent material (5) is applied to the semiconductor body (1) in layers. In the next step the solvent escapes, leaving only the luminescent material (5) with the bonding agent on the semiconductor body.
In the second method, the semiconductor body (1) is provided with a layer (6) of bonding agent to which the luminescent material (5) is applied directly.
53 Citations
25 Claims
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1. A method for fabricating a light-radiating semiconductor component that includes an electrically contacted light emitting semiconductor body, mounted on a substrate element, and a luminescence conversion element that comprises at least one luminescent material and is deposited on said semiconductor body, characterized by the steps of
fabricating said semiconductor body, mounting on said substrate element and electrical contacting, applying a layer of bonding agent to at least one surface of said semiconductor body, wherein a maximum thickness of the layer of bonding agent is smaller than a thickness of the semiconductor body, and applying at least one luminescent material to the layer of bonding agent.
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16. A method for fabricating a light-radiating semiconductor component comprising:
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providing a light emitting semiconductor body; applying a layer of bonding agent to at least one surface of the semiconductor body, wherein a maximum thickness of the layer of bonding agent is smaller than a thickness of the semiconductor body; and applying at least one luminescent material to the layer of bonding agent. - View Dependent Claims (17, 18, 22)
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19. A method for fabricating a light-radiating semiconductor component that includes an electrically contacted semiconductor body mounted on a substrate element, and a luminescence conversion element that comprises at least one luminescent material deposited on said semiconductor body, the method comprising:
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fabricating the semiconductor body, mounting the semiconductor body to a substrate element, and electrically contacting the semiconductor body; spraying a layer of bonding agent onto at least one surface of the semiconductor body; and applying the at least one luminescent material to the at least one surface of the semiconductor body. - View Dependent Claims (23)
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20. A method for fabricating a light-radiating semiconductor component, the method comprising:
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providing a light emitting semiconductor body; spraying a layer of bonding agent onto at least one surface of the semiconductor body; and applying at least one luminescent material to the at least one surface of the semiconductor body. - View Dependent Claims (24)
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25. A method for fabricating a light-radiating semiconductor component, the method comprising:
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providing a light emitting semiconductor body; applying a layer of bonding agent to a plurality of surfaces of the semiconductor body; and applying at least one luminescent material to the layer of bonding agent.
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Specification