Glass package that is hermetically sealed with a frit and method of fabrication
First Claim
1. An organic light emitting diode device comprising:
- a first glass substrate;
a second glass substrate;
an organic light emitting diode (OLED) positioned between the first and second glass substrates;
a frit positioned between the first and second glass substrates, the frit comprising a transition metal and a coefficient of expansion (CTE) lowering filler, the filler being no more than about 30% by weight of the fit; and
wherein the OLED was hermetically sealed between the first and second glass substrates with a laser that heated and softened the frit thereby forming a hermetic seal between the first and second substrates.
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Accused Products
Abstract
A hermetically sealed glass package and method for manufacturing the hermetically sealed glass package are described herein using an OLED display as an example. Basically, the hermetically sealed OLED display is manufactured by providing a first substrate plate and a second substrate plate and depositing a frit onto the second substrate plate. OLEDs are deposited on the first substrate plate. An irradiation source (e.g., laser, infrared light) is then used to heat the frit which melts and forms a hermetic seal that connects the first substrate plate to the second substrate plate and also protects the OLEDs. The frit is glass that was doped with at least one transition metal and possibly a CTE lowering filler such that when the irradiation source heats the frit, it softens and forms a bond. This enables the frit to melt and form the hermetic seal while avoiding thermal damage to the OLEDs.
158 Citations
25 Claims
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1. An organic light emitting diode device comprising:
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a first glass substrate; a second glass substrate; an organic light emitting diode (OLED) positioned between the first and second glass substrates; a frit positioned between the first and second glass substrates, the frit comprising a transition metal and a coefficient of expansion (CTE) lowering filler, the filler being no more than about 30% by weight of the fit; and wherein the OLED was hermetically sealed between the first and second glass substrates with a laser that heated and softened the frit thereby forming a hermetic seal between the first and second substrates. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A glass package comprising:
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a first glass substrate with a first coefficient of thermal expansion (CTE); a second glass substrate with a second CTE; a frit made from a lead free glass comprising one or more transition metals and a CTE lowering filler, the frit having a third CTE less than the first or second CTE and the filler having a mean particle size less than about 20 μ
m;an organic layer positioned between the first and second glass substrates; and wherein the frit was heated by an irradiation source to melt the frit and form a hermetic seal between the first and second glass plates. - View Dependent Claims (12)
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13. An organic light emitting diode (OLED) device comprising:
an organic light emitting diode disposed between first and second glass substrates hermetically sealed with a frit, the frit comprising one or more transition metals, a crystalline phase coefficient of thermal expansion lowering filler, and free of lead and cadmium, and wherein the frit was heated with a laser in a manner that caused the frit to melt and form a hermetic seal between the first and second glass substrates. - View Dependent Claims (14, 15, 16, 17, 18)
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19. An organic light emitting diode device comprising:
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a first and second glass substrate suitable for use in an organic light emitting diode device; a lead-free frit forming a hermetic seal between the first and second substrates and expansion matched thereto; an organic light emitting diode disposed between the first and second glass substrates; and an adhesive within a gap located between outer edges of the first and second glass substrates, wherein said gap is caused by the presence of the hermetic seal. - View Dependent Claims (20, 21, 22)
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23. A hermetically sealed glass package comprising:
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a first glass plate; a second glass plate; a frit made from glass doped with at least one transition metal and a coefficient of thermal expansion (CTE) lowering filler positioned between the first glass plate and the second glass plate, the filler comprising no more than about 30% of the fit; a temperature sensitive material positioned between the first and second glass plates; and wherein the fit was heated with a laser in a manner that caused the frit to soften and form a hermetic seal between the first and second glass plates, thereby hermetically sealing the temperature sensitive material between the first and second glass plates, and wherein a temperature of the temperature sensitive material did not exceed about 100°
C. during the heating. - View Dependent Claims (24, 25)
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Specification