Vehicle radar sensor assembly

• US 7,603,097 B2
• Filed: 12/30/2005
• Issued: 10/13/2009
• Est. Priority Date: 12/30/2004
• Status: Active Grant

• Current Assignee: Valeo Radar Systems, Inc. (Valeo SE)
• Original Assignee: Valeo Radar Systems, Inc. (Valeo SE)
• Inventors: Pleva, Joseph S., Leblanc, Stephen P., Donovan, Richard Paul
• Primary Examiner(s): Nguyen; Duc M
• Application Number:
  US11/323,816
• Publication Number:
  US 20060152406A1
• Time in Patent Office: 1,383 Days
• Field of Search: 455/298, 455/300, 455/301, 455/575.5, 455/575.8, 455/90.3, 455/106, 342/70, 361/600, 361/679, 361/748, 361/764, 361/800, 361/816, 361/818
• US Class Current: 455/300
• CPC Class Codes: G01S 13/931 of land vehicles
• CPC Class Codes: G01S 7/027 Constructional details of housings, e.g. form, type, material or ruggedness
• CPC Class Codes: G01S 7/032 Constructional details for solid-state radar subsystems
• CPC Class Codes: H01P 5/107 Hollow-waveguide/strip-line transitions
• CPC Class Codes: H05K 1/0237 High frequency adaptations H05K1/0216 takes precedence
• CPC Class Codes: H05K 1/14 Structural association of two or more printed circuits providing electric connection to or between printed circuits H05K1/11, H01R12/00
• CPC Class Codes: H05K 9/0007 Casings standardised racks H05K9/0062
• CPC Class Codes: Y10T 29/49144 by metal fusion

Abstract

A radar electronics module includes a support structure having a first surface having a plurality of recesses with a transmitter circuit board and a receiver circuit board disposed thereon. The transmitter and receiver circuit boards are disposed over the first surface of the supports structure such that transmitter and receive circuits are disposed in cavities on the support structure. The radar electronics module further includes a digital/power supply circuit printed wiring board (PWB) disposed on a second surface of the support structure and a connector disposed on the support structure. The connector is disposed in such a way that it provides electrical connections for at least one of power signals, analog signals or digital signals between at least two of the digital/power supply PWB, the transmitter circuit board and the receiver circuit board.

Claims

1. A radar electronics module comprising:

a support structure having a first surface having a plurality of recesses provided therein and having a second opposing surface;

a transmitter circuit board having a transmitter circuit board connection point, said transmitter circuit board disposed on the first surface of said support structure over at least one of said plurality of recesses such that at least one circuit on said transmitter circuit board is disposed in the at least one recess of said support structure; and

;

a receiver circuit board having a receiver circuit board connection point, said receiver circuit board disposed on the first surface of said support structure, over at least one of said plurality of recesses such that at least one circuit on said receiver circuit board is disposed in the at least one recess of said support structure;

a digital/power supply circuit printed wiring board (PWB) disposed on the second surface of said support structure, said digital/power supply PWB having a first connection point; and

a connector coupled to said support structure, said connector having a first set of connection points coupled to the first connection point of said digital/power supply PWB, having a second set of connection points coupled to the first connection point of said transmitter circuit board and having a third set of connection points coupled to the first connection point of said receiver circuit board, said connector adapted to provide electrical connections for at least one of power signals, analog signals or digital signals between at least two of said digital/power supply PWB, said transmitter circuit board and said receiver circuit board.

2. The radar electronics module of claim 1 wherein:

the transmitter circuit board connection point is provided as a plurality of conductive regions disposed on an exposed surface of said transmitter circuit board;

the receiver circuit board connection point is provided as a plurality of conductive regions disposed on an exposed surface of said receiver circuit board; and

the first and second set of connection points on said connector are provided as pins having a size and shape adapted to mate with the conductive regions on said transmitter and receiver circuit boards.

3. The radar electronics module of claim 2 wherein:

said digital/power supply PWB the transmitter circuit board connection point is provided as a plurality of conductive regions disposed on an exposed surface of said digital/power supply PWB; and

the third set of connection points on said connector are provided as third set of pins having a size and shape adapted to mate with the conductive regions on said digital/power supply PWB.

4. The radar electronics module of claim 3 wherein the conductive region connection points on said digital/power supply PWB are provided having holes therethrough and the third set pins of pins from said connector are disposed through the holes on said digital/power supply PWB.

5. The radar electronics module of claim 1 wherein said support structure further comprises a waveguide transmission line and wherein a conductive region of said digital/power supply PWB provides a wall of said waveguide with said waveguide disposed having a first port coupled to said transmitter circuit board and a second port coupled to said receiver circuit board such that said waveguide is adapted to couple signals between said transmitter and receiver circuit boards.

6. The radar electronics module of claim 5 wherein at least a portion of said waveguide is provided as an integral portion of said support structure.

7. The radar electronics module of claim 6 wherein each of said transmitter and receiver circuit boards comprise a conductive patch and the first and second waveguide ports are disposed over respective ones of said conductive patches.

8. The radar electronics module of claim 1 wherein said transmitter circuit board is provided having conductive regions which meet with portions of said support structure around said plurality of recesses when said transmitter circuit board is disposed on said support structure to turn the plurality of recesses into a plurality of cavity regions.

9. The radar electronics module of claim 1 wherein said support structure is provided having a connector mounting region on the first surface thereof and said connector is disposed on the connector mounting region of said support structure.

10. The radar electronics module of claim 9 wherein said support structure is provided having a pair of openings therein, with a first opening located proximate a first side of the connector mounting region and a second opening located proximate a second opposite side of the connector mounting region.

11. The radar electronics module of claim 9 wherein:

said transmitter circuit board connection point is provided as a plurality of conductive regions and wherein said transmitter circuit board is disposed such that the conductive regions are disposed in a first one of the first and second openings in said support structure proximate a side of the connector mounting region;

said receiver circuit board connection point is provided as a plurality of conductive regions and wherein said receiver circuit board is disposed such that the conductive regions are disposed in a second one of the first and second openings in said support structure proximate a side of the connector mounting region; and

said connector is disposed on said connector mounting region such that the first and second set of connection points of said connector are coupled to respective ones of the connection points on said transmitter and receiver circuit boards through respective ones of the first and second openings in said support structure proximate the connector mounting region.

12. A sensor assembly comprising:

a housing;

an electrical shield disposed in said housing, said electrical shield having a shape and a size which substantially matches a shape and size of the bottom surface of said housing; and

a radar electronics module disposed in said housing over said electrical shield wherein said radar electronics module further comprises;

a support structure having a first surface having a plurality of recesses provided therein and having a second opposing surface;

a transmitter circuit board having a transmitter circuit board connection point, said transmitter circuit board disposed on the first surface of said support structure over at least one of said plurality of recesses such that at least one circuit on said transmitter circuit board is disposed in the at least one recess of said support structure; and

;

a receiver circuit board having a receiver circuit board connection point, said receiver circuit board disposed on the first surface of said support structure, over at least one of said plurality of recesses such that at least one circuit on said receiver circuit board is disposed in the at least one recess of said support structure;

a digital/power supply circuit printed wiring board (PWB) disposed on the second surface of said support structure said digital/power supply PWB having a first connection point; and

a connector coupled to said support structure, said connector having a first set of connection points coupled to the first connection point of said a digital/power supply PWB, having a second set of connection points coupled to the first connection point of said transmitter circuit board and having a third set of connection points coupled to the first connection point of said receiver circuit board, said connector adapted to provide electrical connections for at least one of power signals, analog signals or digital signals between at least two of said digital/power supply PWB, said transmitter circuit board and said receiver circuit board.

13. The sensor assembly of claim 12 wherein:

the transmitter circuit board connection point is provided as a plurality of conductive regions disposed on an exposed surface of said transmitter circuit board;

the receiver circuit board connection point is provided as a plurality of conductive regions disposed on an exposed surface of said receiver circuit board; and

the first and second set of connection points on said connector are provided as pins having a size and shape adapted to mate with the conductive regions on said transmitter and receiver circuit boards.

14. The sensor assembly of claim 13 wherein:

said digital/power supply PWB the transmitter circuit board connection point is provided as a plurality of conductive regions disposed on an exposed surface of said digital/power supply PWB; and

the third set of connection points on said connector are provided as third set of pins having a size and shape adapted to mate with the conductive regions on said digital/power supply PWB.

15. The sensor assembly of claim 14 wherein the conductive region connection points on said digital/power supply PWB are provided having holes therethrough and the third set pins of pins from said connector are disposed through the holes on said digital/power supply PWB.

16. The sensor assembly of claim 12 wherein said support structure further comprises a waveguide transmission line and wherein a conductive region of said digital/power supply PWB provides a wall of said waveguide with said waveguide disposed having a first port coupled to said transmitter circuit board and a second port coupled to said receiver circuit board such that said waveguide is adapted to couple signals between said transmitter and receiver circuit boards.

17. The sensor assembly of claim 16 wherein at least a portion of said waveguide is provided as an integral portion of said support structure.

18. The sensor assembly of claim 17 wherein each of said transmitter and receiver circuit boards comprise a conductive patch and the first and second waveguide ports are disposed over respective ones of said conductive patches.

19. The sensor assembly of claim 12 wherein said transmitter circuit board is provided having conductive regions which meet with portions of said support structure around said plurality of recesses when said transmitter circuit board is disposed on said support structure to turn the plurality of recesses into a plurality of cavity regions.

20. The sensor assembly of claim 12 wherein said support structure is provided having a connector mounting region on the first surface thereof and said connector is disposed on the connector mounting region of said support structure.

21. The sensor assembly of claim 20 wherein said support structure is provided having a pair of openings therein, with a first opening located proximate a first side of the connector mounting region and a second opening located proximate a second opposite side of the connector mounting region.

22. The sensor assembly of claim 20 wherein:

said transmitter circuit board connection point is provided as a plurality of conductive regions and wherein said transmitter circuit board is disposed such that the conductive regions are disposed in a first one of the first and second openings in said support structure proximate a side of the connector mounting region;

said receiver circuit board connection point is provided as a plurality of conductive regions and wherein said receiver circuit board is disposed such that the conductive regions are disposed in a second one of the first and second openings in said support structure proximate a side of the connector mounting region; and

said connector is disposed on said connector mounting region such that the first and second set of connection points are coupled to respective ones of the connection points on said transmitter and receiver circuit boards through respective ones of the first and second openings in said support structure proximate the connector mounting region.