MEMS structure for flow sensor

• US 7,603,898 B2
• Filed: 12/19/2007
• Issued: 10/20/2009
• Est. Priority Date: 12/19/2007
• Status: Active Grant

• Current Assignee: Honeywell International Inc.
• Original Assignee: Honeywell International Inc.
• Inventors: Speldrich, Jamie W.
• Primary Examiner(s): Caputo; Lisa M
• Assistant Examiner(s): Kirkland, III; Freddie
• Application Number:
  US11/960,192
• Publication Number:
  US 20090158838A1
• Time in Patent Office: 671 Days
• Field of Search: 732/041.1, 732/042.3, 732/042.5, 732/042.6
• US Class Current: 73/204.26
• CPC Class Codes: G01F 1/6845 Micromachined devices
• CPC Class Codes: G01F 15/006 characterised by the use of a particular material, e.g. anti-corrosive material G01F15/14 takes precedence

Abstract

A MEMS based flow sensor is disclosed which generally incorporate isolation between a sensing structure and the sensed media. An internal flow channel can be configured by attaching a backing structure with flow openings to the back of the sensing structure. The sensing structure can be composed of a insulating layer with heating element and a dual sensing element which comprises of resistive thin films positioned in a Wheatstone bridge configuration over a backside cavity. The dual sensing element and its associated wirebonds can be isolated from the sensing media by directing the fluid through the internal flow channel. The completed sensing structure can be over packaged with standard processes such as epoxies and seals.

Claims

1. A flow sensor, comprising:

a backing structure including;

a first major surface and an opposing second major surface spaced apart by a thickness of the backing structure;

a first channel opening extending through the entire thickness of the backing structure from the first major surface to the second major surface;

a second channel opening, laterally spaced from the first channel opening, and extending through the entire thickness of the backing structure from the first major surface to the second major surface;

a sensing structure including;

a substrate having a first major surface and an opposing second major surface spaced by a thickness of the substrate, the substrate having a cavity opening extending through the entire thickness of the substrate from the first major surface to the second major surface;

a topside layer having a top side and a back side, the back side of the topside layer secured relative to the first major surface of the substrate, at least a portion of the topside layer suspended over the cavity opening in the substrate;

a heater element and a plurality of sensing elements secured relative to the top side of said portion of said topside layer that is suspended over the cavity opening in the substrate, wherein a first one of said plurality of sensing elements is located adjacent said heating element in a first lateral direction and a second one of said plurality of sensing elements is located adjacent said heating element in a second lateral direction that is opposite to the first lateral direction;

the first major surface of the backing structure is bonded to the second major surface of the substrate such that the first channel opening of the backing structure is in fluid communication with the cavity opening of the substrate and the spaced second channel opening of the backing structure is in fluid communication with the cavity opening of the substrate;

wherein the first channel opening of the backing structure, the cavity opening in the substrate and the second channel opening of the backing structure form a fluid flow channel that directs fluid flow from adjacent the second major surface of the backing structure to the back side of the topside layer, and back to adjacent the second major surface of the backing structure.

2. The flow sensor of claim 1 further comprising;

a plurality of electrical conductive leads extending along the top side of the topside layer from said heater element and said plurality of sensing elements to corresponding ones of a plurality of wirebond pads.

3. The flow sensor of claim 2, wherein said plurality of electrical conductive leads and said plurality of wirebond pads provide an electrical connection for said heater element and said plurality of sensing elements.

4. The flow sensor of claim 2 wherein said heater element and/or said plurality of sensing elements comprise a resistive thin film formed from a metal selected from nickel and platinum.

5. The flow sensor of claim 2 wherein said plurality of sensing elements are connected as part of a Wheatstone bridge.

6. The flow sensor of claim 1 wherein said sensing structure is overpackaged utilizing standard processes comprising epoxies and seals.

7. The sensor of claim 1 wherein said backing structure, said sensing structure and said resulting fluid flow channel are arranged together to comprise an assembly.

8. The flow sensor of claim 1 wherein said backing structure includes a material selected from the group comprising etched silicon, a fabricated glass, and a molded plastic.

9. A flow sensor, comprising:

a backing structure having two spaced openings each extending entirely through the backing structure;

a sensing structure including a substrate having an etched cavity extending entirely therethrough, and a topside layer having a top side and a back side, where the back side of the topside layer is secured relative to the substrate with at least a portion of the topside layer suspended over the etched cavity in the substrate, the sensing structure further having a heater element and a plurality of sensing elements disposed adjacent the top side of the topside layer, wherein two of said plurality of sensing elements are arranged on opposing lateral sides of said heating element;

the sensing structure further having a plurality of electrical conductive leads extending above the top side of the topside layer and to said heater element and said plurality of sensing elements; and

the backing structure is bonded to the sensing structure such that the two spaced openings in the backing structure are in fluid communication with the etched cavity in the substrate to provide a fluid flow path to the back side of the topside layer.

10. The flow sensor of claim 9, wherein said plurality of electrical conductive leads extend from said heater element and said plurality of sensing elements to corresponding ones of a plurality of wire bond pads.

11. The flow sensor of claim 9 wherein said heater element and/or said plurality of sensing elements comprises a resistive thin film formed from a metal selected from nickel and platinum.

12. The flow sensor of claim 9 wherein said plurality of sensing elements are connected as part of a Wheatstone bridge.

13. The flow sensor of claim 9 wherein said sensing structure is overpackaged utilizing standard processes comprising epoxies and seals.

14. The sensor of claim 9 wherein said backing structure, said sensing structure and said resulting fluid flow path are assembled together into an assembly.

15. The flow sensor of claim 9 wherein said backing structure includes a material selected from the group comprising etched silicon, a fabricated glass, and a molded plastic.

16. A MEMS flow sensor, comprising:

a backing structure having two separate spaced apart openings for fluid flow formed there through;

a sensing structure including a substrate having a backside cavity extending from a top side of the substrate to an opposing bottom side of the substrate, the sensing structure further having a topside layer secured relative to the top side of the substrate such that at least a portion of the topside layer is suspended over the backside cavity in the substrate thereby exposing a back side of the topside layer to the backside cavity, the sensing structure further having a heater element and at least one sensing element positioned over the top side of the topside layer,

the backing structure is bonded to the sensing structure such that the two separate spaced apart openings in the backing structure are in fluid communication with the backside cavity in the substrate to provide a fluid flow path along the back side of the topside layer.

17. The flow sensor of claim 16 further comprising:

a plurality of electrical conductive leads extending from said heater element and said at least one sensing element to a plurality of wire bond pads.

18. The flow sensor of claim 17, wherein said plurality of electrical conductive leads and said plurality of wire bond pads provide an electrical connection for said heater element and said at least one sensing element.

19. The flow sensor of claim 16 wherein said at least one sensing element is connected as part of a Wheatstone bridge.

20. The flow sensor of claim 16 wherein said backing structure includes a material that is selected from a group comprising etched silicon, a fabricated glass, and a molded plastic.