Light emitting apparatus

• US 7,607,801 B2
• Filed: 10/28/2004
• Issued: 10/27/2009
• Est. Priority Date: 10/31/2003
• Status: Expired due to Fees

• Current Assignee: Toyoda Gosei Company Limited (Toyota Motor Corporation)
• Original Assignee: Toyoda Gosei Company Limited (Toyota Motor Corporation)
• Inventors: Wada, Satoshi, Suehiro, Yoshinobu, Ota, Akihito
• Primary Examiner(s): Lee; Jong-Suk (James)
• Assistant Examiner(s): Makiya; David J
• Application Number:
  US10/521,943
• Publication Number:
  US 20060164836A1
• Time in Patent Office: 1,825 Days
• Field of Search: 362/294, 362/298, 362/580, 362/547, 362/126, 362/218, 362/373, 362/264, 362/345, 362/346
• US Class Current: 362/294
• CPC Class Codes: F21K 9/68 Details of reflectors forming part of the light source
• CPC Class Codes: F21V 15/01 Housings, e.g. material or assembling of housing parts F21V15/02 takes precedence housings forming signs or letters G09F13/04
• CPC Class Codes: F21V 29/505 of reflectors
• CPC Class Codes: F21V 29/507 of means for protecting lighting devices from damage, e.g. housings
• CPC Class Codes: F21V 29/74 with fins or blades
• CPC Class Codes: F21V 29/89 Metals
• CPC Class Codes: F21V 7/0008 providing for indirect lighting
• CPC Class Codes: F21V 7/06 with parabolic curvature
• CPC Class Codes: F21V 7/08 with elliptical curvature
• CPC Class Codes: F21V 7/24 characterised by the material
• CPC Class Codes: F21V 7/28 characterised by coatings
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/13 of an individual bump connector
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2924/00011 Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/483 Containers
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/642 characterized by the shape

Abstract

A reflection-type light emitting apparatus has an excellent heat radiation property and allows the use of a high-power light emitting element, the minimization of a reduction in radiation efficiency of reflected light, and the focused radiation of high-output light at high efficiency. The apparatus has: a case 10 of metallic material and with an excellent heat radiation property; a reflection mirror section 11 formed fitted to the lower portion of case 10; a transparent plate 12 to cover the upper surface of case 10; heat radiation plates 13, 14 of metallic material with excellent heat conductivity and inserted inside the case 10; an LED element 2 mounted on the heat radiation plate 13; lead sections 15A, 15B fixed through an insulating layer 15a to the heat radiation plate 13 to serve as a power supply member to supply power to the LED element 2; and a spacer 16 of an insulating material to insulate the lead sections 15A, 15B from the case 10.

Claims

1. A light emitting apparatus, comprising:

a solid-state light emitting element;

a power supply member that supplies power to the solid-state light emitting element;

a reflection section that is disposed opposite to a light extraction surface of the solid-state light emitting element to reflect light emitted from the solid-state light emitting element

a heat radiation member that is disposed with a heat radiation width in a back direction of the solid-state light emitting element;

an insulating layer disposed between the power supply member and the heat radiation member; and

a case in which the reflection section and the heat radiation member are placed and which externally radiates heat to be transferred from the heat radiation member,

wherein the case is integrated with the heat radiation member, the case comprises an inner wall surface with a high reflectivity, and the case has a high heat conductivity, and

wherein the heat radiation member comprises a planar member disposed parallel to a light extraction direction of the light emitting apparatus,

the power supply member, which is separate from said heat radiation member, is secured to an end face of the planar member,

the solid-state light emitting element is mounted on the end face of the planar member, and

the planar member is disposed parallel to a longitudinal direction of the power supply member, wherein the power supply member and the planar member both comprise a light reflective surface.

2. The light emitting apparatus according to claim 1, wherein:

the solid-state light emitting element is packaged such that the solid-state light emitting element is sealed with a light transmitting material.

3. The light emitting apparatus according to claim 1, wherein:

the solid-state light emitting element is flip-chip mounted on an inorganic material board on which a conductive pattern is formed to supply power to the solid-state light emitting element, and

the solid-state light emitting element is sealed with an inorganic seal material that has a thermal expansion coefficient nearly equal to that of the inorganic material board.

4. The light emitting apparatus according to claim 3, wherein:

the inorganic seal material comprises glass.

5. The light emitting apparatus according to claim 3, wherein:

the inorganic material board seals the solid state light emitting element while bonding in chemical reaction to the inorganic seal material.

6. The light emitting apparatus according to claim 1, wherein:

the solid-state light emitting element is sealed with the inorganic seal material with a refractive index of 1.55 or more.

7. The light emitting apparatus according claim 1, wherein:

the heat radiation member comprises a heat radiation plate that comprises a high reflectivity surface to reflect the light.

8. The light emitting apparatus according to claim 1, wherein:

the heat radiation member comprises;

a heat radiation support that comprises a high thermal conductivity material and transfers to the heat radiation member heat generated from the solid-state light emitting element, and

a heat radiation plate that transfers the heat through the heat radiation support.

10. The light emitting apparatus according to claim 1, wherein:

the power supply member comprises a metallic thin film and is disposed with a width in the back direction of the solid-state light emitting element and is integrated with the heat radiation member while being insulated from the heat radiation member.

11. The light emitting apparatus according to claim 10, wherein:

the power supply member comprises a metallic thin film and is sandwiched through an insulator between a plurality of heat radiation plates to compose the heat radiation member.

12. The light emitting apparatus according to claim 1, wherein:

a spectrum light with plurality of region wavelengths is radiated from the solid-state light emitting element or from the periphery of the solid-state light emitting element.

13. The light emitting apparatus according to claim 12, wherein:

a phosphor is disposed on the periphery of the solid-state light emitting element.

14. The light emitting apparatus according to claim 1, wherein:

the heat radiation member has the heat radiation width that is three times or more its thickness.

15. The light emitting apparatus according to claim 1, wherein:

the solid-state light emitting element has a width that is within five times that of the solid-state light emitting element.

16. The light emitting apparatus according to claim 1, wherein:

the heat radiation member comprises a shape that protrudes toward a bottom of the reflection surface.

17. The light emitting apparatus according to claim 1, wherein:

the reflection surface opposite to the solid-state light emitting element comprises a solid angle of 2π

it to 3.4π

strad.

18. The light emitting apparatus according to claim 1, wherein:

the solid-state light emitting element comprises a light source with a turn-on power of 1 W or more.

19. The light emitting apparatus according to claim 1, wherein:

the reflection section comprises a resin material.

20. The light emitting apparatus according to claim 1, wherein:

the solid-state light emitting element comprises one of a plurality of solid-state light emitting elements.

21. The light emitting apparatus according to claim 1,

wherein the light emitting apparatus further comprises:

a plurality of solid-state light emitting elements and

a plurality of heat radiation members, the heat radiation members corresponding to the plurality of solid-state light emitting elements.

22. The light emitting apparatus according to claim 1, wherein:

the plurality of solid-state light emitting elements generate a plurality of emission colors.

23. The light emitting apparatus according to claim 22, wherein:

the plurality of solid-state light emitting elements generate emission colors of R, G and B.

25. The light emitting apparatus according to claim 1, wherein the power supply member is insulated from the heat radiation member by the insulation layer.

26. The light emitting apparatus according to claim 1, wherein said heat radiation member further comprises a second planar member disposed perpendicular to and intersecting said planar member.

27. The light emitting apparatus according to claim 1, wherein said planar member comprises a front surface, a rear surface, and said end face, a surface area of said end face is smaller than a surface area of said front surface and the surface area of said end face is smaller than a surface area of said rear surface.

28. The light emitting apparatus according to claim 1, wherein said planar member has a width and thickness, the thickness corresponding to said end face, and

wherein the width of the planar member is larger than a thickness of the end face.

29. The light emitting apparatus according to claim 1, wherein the power supply member comprises a lead and the planar member is disposed parallel to a longitudinal direction of the lead.

9. A light emitting apparatus, comprising:

a solid-state light emitting element;

a power supply member that supplies power to the solid-state light emitting element;

a reflection section that is disposed opposite to a light extraction surface of the solid-state light emitting element to reflect light emitted from the solid-state light emitting element;

a heat radiation member that is disposed with a heat radiation width in a back direction of the solid-state light emitting element;

an insulating layer disposed between the power supply member and the heat radiation member; and

a case in which the reflection section and the heat radiation member are placed and which externally radiates heat to be transferred from the heat radiation member,

wherein the case is integrated with the heat radiation member, the case comprises an inner wall surface with a high reflectivity, and the case has a high heat conductivity, and

wherein the power supply member is formed with a width in the back direction of the solid-state light emitting element,

the heat radiation member comprises a planar member disposed parallel to a light extraction direction of the light emitting apparatus,

the power supply member, which is separate from said heat radiation member, is secured to an end face of the planar member,

the solid-state light emitting element is mounted on the end face of the planar member, and

the planar member is disposed parallel to a longitudinal direction of the power supply member, wherein the power supply member and the planar member both comprise a light reflective surface.

24. A light emitting apparatus, comprising:

a solid-state light emitting element;

a power supply member that supplies power to the solid-state light emitting element

a reflection section that is disposed opposite to a light extraction surface of the solid-state light emitting element to reflect light emitted from the solid-state light emitting element; and

a heat radiation member that is disposed with a heat radiation width in a back direction of the solid-state light emitting element; and

a case in which the reflection section and the heat radiation member are placed and which external radiates heat to be transferred from the heat radiation member,

wherein the case is integrated with the heat radiation member, the case comprises an inner wall surface with a high reflectivity, and the case has a high heat conductivity, and

wherein the heat radiation member is separated from the power supply member,

the heat radiation member comprises a planar member disposed parallel to a light extraction direction of the light emitting apparatus,

the power supply member, which is separate from said heat radiation member, is secured to an end face of the planar member,

the solid-state light emitting element is mounted on the end face of the planar member, and

the planar member is disposed parallel to a longitudinal direction of the power supply member, wherein the power supply member and the planar member both comprise a light reflective surface.