Body-contacted semiconductor structures and methods of fabricating such body-contacted semiconductor structures
First Claim
1. A method for forming a semiconductor structure in a semiconductor wafer including a semiconductor substrate, a semiconductor layer including a semiconductor body, and a buried dielectric layer separating the semiconductor substrate from the semiconductor layer, the method comprising:
- forming a first trench that extends through the semiconductor body and the buried dielectric layer into the semiconductor substrate;
building a first vertical memory cell in the first trench; and
implanting ions into a region of the buried dielectric layer to form a body contact that electrically couples the semiconductor body with the semiconductor substrate.
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Abstract
A semiconductor structure for a dynamic random access memory (DRAM) cell array that includes a plurality of vertical memory cells built on a semiconductor-on-insulator (SOI) wafer and a body contact in the buried dielectric layer of the SOI wafer. The body contact electrically couples a semiconductor body with a channel region of the access device of one vertical memory cell and a semiconductor substrate of the SOI wafer. The body contact provides a current leakage path that reduces the impact of floating body effects upon the vertical memory cell. The body contact may be formed by an ion implantation process that modifies the stoichiometry of a region of the buried dielectric layer so that the modified region becomes electrically conductive with a relatively high resistance.
37 Citations
9 Claims
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1. A method for forming a semiconductor structure in a semiconductor wafer including a semiconductor substrate, a semiconductor layer including a semiconductor body, and a buried dielectric layer separating the semiconductor substrate from the semiconductor layer, the method comprising:
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forming a first trench that extends through the semiconductor body and the buried dielectric layer into the semiconductor substrate; building a first vertical memory cell in the first trench; and implanting ions into a region of the buried dielectric layer to form a body contact that electrically couples the semiconductor body with the semiconductor substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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Specification