Interconnection of through-wafer vias using bridge structures
First Claim
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1. A method for forming an interconnection in a capped or stacked wafer device, the method comprising:
- forming a bridge structure on a first wafer device;
bonding the first wafer device to a second wafer device such that the bridge structure at least partially spans a gap between a through-hole via in one of the wafers and a corresponding component on the other wafer; and
forming an interconnection to the component through the through-hole via across the bridge structure.
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Abstract
Bridge structures provide a surface on which to form interconnections to components through through-hole vias. The bridge structures at least partially, and preferably fully, span the gap between two wafers, and, more specifically, between a through-hole via in one wafer and a corresponding component on the other wafer. Bridge structure may be formed on the wafer having the through-hole via and/or the wafer having the component.
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Citations
20 Claims
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1. A method for forming an interconnection in a capped or stacked wafer device, the method comprising:
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forming a bridge structure on a first wafer device; bonding the first wafer device to a second wafer device such that the bridge structure at least partially spans a gap between a through-hole via in one of the wafers and a corresponding component on the other wafer; and forming an interconnection to the component through the through-hole via across the bridge structure. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. Apparatus comprising:
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a first wafer having a component; a second wafer bonded to the first wafer, the second wafer having a through-hole via; at least one bridge structure formed on one of the wafers, wherein the bridge structure at least partially spans a gap between the through-hole via and the component; and an interconnection formed through the through-hole via to the component across the bridge structure. - View Dependent Claims (16, 17, 18, 19, 20)
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Specification