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Component arrangement provided with a carrier substrate

  • US 7,608,789 B2
  • Filed: 08/02/2004
  • Issued: 10/27/2009
  • Est. Priority Date: 08/12/2004
  • Status: Active Grant
First Claim
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1. A component arrangement comprising:

  • a carrier substrate;

    a component on the carrier substrate; and

    a cover layer on the carrier substrate, the cover layer being over the component and forming a seal with the carrier substrate to seal the component;

    wherein the carrier substrate comprises;

    at least two layers of glass film, the at least two layers of glass film comprising a first glass film and a second glass film, andan intermediate layer over the first glass film;

    wherein a recess in the carrier substrate extends along an exterior of the component, the recess extending through the first glass film from a side of the carrier substrate facing the component to a contact plane;

    wherein the contact plane comprises the second glass film and a metallization on the second glass film; and

    wherein the cover layer is electrically connected to the metallization that is part of the contact plane.

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