Surface-mount saw device

• US 7,608,977 B2
• Filed: 11/12/2004
• Issued: 10/27/2009
• Est. Priority Date: 02/05/2004
• Status: Expired due to Fees

• Current Assignee: Seiko Epson Corporation (Seiko Group)
• Original Assignee: Epson Toyocom Corporation (Seiko Group)
• Inventors: Onozawa, Yasuhide
• Primary Examiner(s): SAN MARTIN, JAYDI A
• Application Number:
  US10/586,224
• Publication Number:
  US 20070164637A1
• Time in Patent Office: 1,810 Days
• Field of Search: 310/340, 310/348
• US Class Current: 310/313.00R
• CPC Class Codes: H03H 9/1085 the enclosure being defined by a non-uniform sealing mass covering the non-active sides of the BAW device

Abstract

A surface-mount SAW device configured to prevent sealing resin layer coated all over the top surface of a piezoelectric substrate from becoming charged even if the piezoelectric substrate forming the SAW device is made of a pyroelectric material. The SAW device is composed of a mounting substrate; a SAW chip provided with a piezoelectric substrate, an IDT electrode formed on one surface of said piezoelectric substrate, and connection pads connected via conductor bumps to conductor traces; a flip chip mounted to the mounting substrate; and a sealing resin layer coated all over the outer surface of the SAW chip flip-chip mounted on the mounting substrate and extended down to the top surface of the mounting substrate to define an airtight space between the IDT electrode and the mounting substrate; and wherein the electrical conductivity of the piezoelectric substrate is increased to suppress charging of the sealing resin layer.

Claims

1. A surface-mount SAW device comprising:

a mounting substrate composed of an insulating substrate, external electrodes mounted on the underside of said insulating substrate for surface mounting use, and conductor traces arranged on the top of said insulating substrate and connected to said external electrodes;

a SAW chip provided with a piezoelectric substrate, an IDT electrode formed on one surface of said piezoelectric substrate, and connection pads connected to said conductor traces via conductor bumps and flip chip mounted on said mounting substrate; and

sealing resin layer coated all over the outer surface of said flip-chip mounted SAW chip and down to the top surface of the mounting substrate to form an airtight space between said IDT electrode and said mounting substrate;

wherein the crystal structure of the piezoelectric substrate belongs to any one of point groups C₁, C₂, C_S, C_2V, C₄, C_4V, C₃, C_3V, C₆ and C_6V in terms of Schoenflies symbols;

characterized in that;

said sealing resin layer has a relative dielectric constant of 3.2 or below and a volume resistivity of 1×

10¹⁶ Ω

·

cm or below;

the thickness H of the sealing resin layer on the top surface of said SAW chip is 0.02 mm or above; and

electrical conductivity of said piezoelectric substrate is increased to suppress charging of the sealing resin layer.

2. The surface-mount SAW device of claim 1, characterized in that the electrical conductivity of said piezoelectric substrate is increased by heating an oxidizable element while holding it in contact with said piezoelectric substrate.

3. The surface-mount SAW device of claim 1, characterized in that at least one metal selected from the group consisting of Fe, Zr, Al Cr, Mn, Rh, Cu, V, W, U and Sn is contained as an impurity in said piezoelectric substrate to provide increased electrical conductivity of said piezoelectric substrate.

4. The surface-mount SAW device of any one of claims 2 or 3, characterized in that said piezoelectric substrate is made of LiTaO₃.