Optical module having cavity substrate

• US 7,609,461 B1
• Filed: 12/21/2005
• Issued: 10/27/2009
• Est. Priority Date: 01/16/2001
• Status: Expired due to Fees

• Current Assignee: Amkor Technology Singapore Holding Pte., Ltd. (Amkor Technology Incorporated)
• Original Assignee: Amkor Technology Incorporated
• Inventors: Webster, Steven, Glenn, Thomas P., Hollaway, Roy Dale
• Primary Examiner(s): Sugarman, Scott J
• Assistant Examiner(s): Patel, Vipin M
• Application Number:
  US11/315,994
• Time in Patent Office: 1,406 Days
• Field of Search: 359/819, 359/811, 250/580, 257/9
• US Class Current: 359/811
• CPC Class Codes: G02B 7/02 for lenses supports for magnifying lenses G02B25/002
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/83 using a layer connector
• CPC Class Codes: H01L 2224/85 using a wire connector
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 27/14625 Optical elements or arrangements associated with the device
• CPC Class Codes: H01L 27/14632 Wafer-level processed structures
• CPC Class Codes: H01L 27/14685 Process for coatings or optical elements
• CPC Class Codes: H01L 27/14687 Wafer level processing
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01023 Vanadium [V]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01057 : Lanthanum [La]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/12041 : LED
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15153 : the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 31/0203 : Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80
• CPC Class Codes: H01L 31/02325 : the optical elements not being integrated nor being directly associated with the device
• CPC Class Codes: H04N 23/54 : Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
• CPC Class Codes: H04N 23/55 : Optical parts specially adapted for electronic image sensors; Mounting thereof
• CPC Class Codes: H04N 23/57 : Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
• CPC Class Codes: Y10T 29/49128 : Assembling formed circuit to base
• CPC Class Codes: Y10T 29/4913 : Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49146 : with encapsulating, e.g., potting, etc.
• CPC Class Codes: Y10T 29/49787 : Obtaining plural composite product pieces from preassembled workpieces

Abstract

A method of forming an optical module includes mounting an image sensor to a base of a substrate and bonding a lens housing to a sidewall of the substrate. A mounting surface of the lens housing includes a locking feature having a horizontal surface and a vertical surface. The sidewall of the substrate includes a joint surface. To bond the lens housing to the sidewall of the substrate, a bond is formed between the horizontal surface of the locking feature of the lens housing and the joint surface of the sidewall. Further, a bond is formed between the vertical surface of the locking feature of the lens housing and an interior surface of the sidewall.

Claims

1. An optical module comprising:

a substrate comprising;

a cavity;

a first interior surface;

a second interior surface formed around a periphery of the first interior surface and extending in a first direction from the first interior surface; and

a joint surface extending from the second interior surface;

an image sensor coupled in the cavity to the substrate, the image sensor being coupled to the first interior surface with an adhesive;

a lens housing coupled to the substrate, wherein the lens housing comprises a mounting surface comprising;

a first surface coupled to the joint surface; and

a second surface coupled to the second interior surface of the substrate; and

an electronic component on a first exterior surface of the substrate.

2. The optical module of claim 1 wherein the substrate comprises a cup shaped enclosure.

3. The optical module of claim 1 wherein a first surface of the image sensor is coupled to the first interior surface of the substrate with the adhesive.

4. The optical module of claim 3 wherein the image sensor comprises:

a second surface;

an active area on the second surface; and

bond pads on the second surface.

5. The optical module of claim 4 further comprising:

interior traces on the first interior surface of the substrate; and

bond wires electrically coupling the bond pads to the interior traces.

6. The optical module of claim 5 further comprising electrically conductive vias electrically coupled to the interior traces, the vias extending through the substrate from the first interior surface to the first exterior surface of the substrate.

7. The optical module of claim 6 further comprising exterior traces on the first exterior surface of the substrate, the exterior traces being electrically coupled to the vias.

8. The optical module of claim 7 wherein the exterior traces extend along a second exterior surface of the substrate.

9. The optical module of claim 5 further comprising electrically conductive pads on the first exterior surface of the substrate, the pads being electrically coupled to the interior traces.

10. The optical module of claim 5 further comprising electrically conductive interconnection balls on the first exterior surface of the substrate, the interconnection balls being electrically coupled to the interior traces.

11. The optical module of claim 4 wherein the lens housing comprises an internal cylindrical surface comprising a longitudinal axis perpendicular to the second surface of the image sensor.

12. The optical module of claim 11 wherein the internal cylindrical surface defines a central aperture, the optical module further comprising:

a lens support in the central aperture; and

an optical element coupled to the lens support.

13. The optical module of claim 1 further comprising an image sensor substrate comprising a plurality of substrates coupled together, the plurality of substrates comprising the substrate.

14. The optical module of claim 1 wherein the substrate is integral.

15. The optical module of claim 1 further comprising a second adhesive, the mounting surface being coupled to the joint surface by the second adhesive.

16. The optical module of claim 1 wherein the lens housing comprises a mounting rim comprising the mounting surface.