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Universal energy conditioning interposer with circuit architecture

DC CAFC
  • US 7,609,500 B2
  • Filed: 07/26/2007
  • Issued: 10/27/2009
  • Est. Priority Date: 04/08/1997
  • Status: Expired due to Fees
First Claim
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1. A structure for conditioning power provided to an integrated circuit, comprising:

  • a power plane having a power plane surface and a power plane periphery;

    a first ground plane having a first ground plane surface and a first ground plane periphery;

    said power plane opposes said first ground plane;

    said power plane couples power to signals of an integrated circuit;

    said first ground plane couples ground to said signals;

    said first ground plane is separated from said power plane by a first distance;

    said first ground plane surface is larger than said power plane surface;

    said first ground plane periphery extends a second distance from said power plane periphery;

    said second distance is larger than said first distance; and

    surfaces of said power plane define a plurality of vias extending through said power plane.

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