Memory module assembly including heat sink attached to integrated circuits by adhesive and clips

• US 7,609,523 B1
• Filed: 03/26/2007
• Issued: 10/27/2009
• Est. Priority Date: 09/29/2004
• Status: Expired due to Fees

• Current Assignee: Super Talent Technology, Corporation
• Original Assignee: Super Talent Electronics, Inc.
• Inventors: Ma, Abraham C., Ni, Jim
• Primary Examiner(s): Vortman; Anatoly
• Application Number:
  US11/691,452
• Time in Patent Office: 946 Days
• Field of Search: 361/702, 361/707, 361709-711, 361/715, 361/720, 257/707
• US Class Current: 361/715
• CPC Class Codes: H01L 23/3672 Foil-like cooling fins or heat sinks being part of lead-frames H01L23/49568
• CPC Class Codes: H01L 23/4093 Snap-on arrangements, e.g. clips
• CPC Class Codes: H01L 23/42 Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
• CPC Class Codes: H01L 23/467 by flowing gases, e.g. air H01L23/473 takes precedence
• CPC Class Codes: H01L 25/105 the devices being of a type provided for in group H01L27/00
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: Y10T 156/10 Methods of surface bonding and/or assembly therefor

Abstract

A memory module assembly includes two-plate heat sink attached to one or more of the integrated circuits (e.g., memory devices) of a memory module PCBA by adhesive. The adhesive is either heat-activated or heat-cured. The adhesive is applied to either the memory devices or the heat-sink plates, and then compressed between the heat-sink plates and memory module using a fixture. The fixture is then passed through an oven to activate/cure the adhesive. The two heat sink plates are then secured by a clip to form a rigid frame.

Claims

1. A memory module assembly comprising:

a memory module printed circuit board assembly (PCBA) including;

a substrate having opposing first and second surfaces, a plurality of wiring traces formed on the first and second surfaces, at least some of the wiring traces being connected to metal contact pads formed along a connector edge of the substrate, and

a plurality of first integrated circuit (IC) devices mounted on the first surface of the substrate such that an upper surface of each of the plurality of first IC devices faces away from the substrate, and

a plurality of second IC devices mounted on the second surface of the substrate such that an upper surface of each of the plurality of second IC devices faces away from the substrate;

a first heat-sink plate having a first outer surface and an opposing first underside surface;

a second heat-sink plate having a second outer surface and an opposing second underside surface;

a plurality of adhesive portions including a first adhesive portion sandwiched between the first underside surface of the first heat-sink plate and the upper surface of an associated IC device of said plurality of first IC devices, and a second adhesive portion sandwiched between the second underside surface of the second heat-sink plate and the upper surface of an associated IC device of said plurality of second IC devices; and

means for pressing the first and second heat-sink plates onto the first and second surfaces, respectively, such that the first and second heat-sink plates are rigidly secured to the substrate,

wherein a first plurality of said first integrated circuit (IC) devices and a second plurality of said first IC devices are disposed on the first surface of the substrate such that upper surfaces of the first and second pluralities of first IC devices define a first plane that is parallel to the first surface of the substrate,

wherein the memory module PCBA further comprises a third IC device disposed on the first surface between the first and second pluralities of first devices, the second IC device having an upper surface defining a second plane that is parallel to the first surface of the substrate, wherein the first plane is located between the second plane and the first surface of the substrate, and

wherein the first heat-sink plate includes a first recessed region having a first upper surface region and an opposing first planar underside surface region, a second recessed region having a second upper surface region and an opposing second planar underside surface region, and a raised pocket structure defining a third upper surface region and an opposing third planar underside surface region, the pocket region being disposed between the first and second recessed regions.

2. The memory module assembly of claim 1,

wherein the substrate further comprises second wiring traces forming a bus,

wherein the first IC devices and the second IC devices comprise dynamic random access memory (DRAM) devices connected to the bus, and

wherein the third IC device comprises an advanced memory buffer (AMB) device that is connected to each of the first and second pluralities of first IC devices by way of the bus, the AMB device also being connected to said plurality of first wiring traces.

3. The memory module assembly of claim 1,

wherein at least one side edge of the substrate defines a positioning notch,

wherein the first and second heat-sink plates comprise side wall structures, each side wall structure abutting a corresponding one of said first and second surfaces adjacent to said at least one side edge, and

wherein at least one of the first and second heat-sink plates comprises a tab extending from a corresponding one of said side wall structures into the positioning notch.

4. The memory module assembly of claim 1,

wherein the first heat-sink plate comprises said tab, and

wherein the side wall structure of said second heat-sink plate comprises a groove formed such that an end of the tab is received in said groove when both the first and second heat-sink plates are mounted on the substrate.

5. The memory module assembly of claim 1, wherein both the first and second heat-sink plates comprise corresponding tab portions extending partially into the notch.

6. The memory module assembly of claim 1, wherein said means for pressing comprises at least one clip including a first engaging portion connected to the first outer surface of the first heat-sink plate, a second engaging portion connected to the second outer surface of the second heat-sink plate, and a linking member connected between the first and second engaging members.

7. The memory module assembly of claim 6, wherein the first heat-sink plate comprises first means for engaging the first engaging portion of the clip, and wherein the second heat-sink plate comprises second means for engaging the second engaging portion of the clip.

8. The memory module assembly of claim 7, wherein the first and second engaging means comprise hooks protruding from said first and second outer surfaces, respectively.

9. The memory module assembly of claim 7,

wherein the first engaging means comprises slots for receiving protruding end structures of said first engaging portion, and

wherein the second engaging means comprises a hole for receiving a positioning pin of said second engaging portion.

10. The memory module assembly of claim 6, wherein said means comprises:

a first single-piece clip connected between the first upper surface region and the second outer surface; and

a second single-piece clip connected between the second upper surface region and the second outer surface.

11. The memory module assembly of claim 1, wherein each of said first and second adhesive portions comprise a heat-activated adhesive material exhibiting a first, relatively low adherence when heated to a first, relatively high temperature, and exhibiting a second, relatively high adherence when subsequently cooled to a second, relatively low temperature.

12. The memory module assembly according to claim 1, wherein each of the first and second adhesive portions comprises one of a high thermal conductive adhesive film and a thermal-bond adhesive film.

13. The memory module assembly of claim 1, further comprising a thermal paste disposed between the upper surface of the AMB device and the third planar underside surface.

14. A memory module assembly comprising:

a memory module printed circuit board assembly (PCBA) including;

a substrate having opposing first and second surfaces, a plurality of first wiring traces formed on at least one of the first and second surfaces, each of the first wiring traces being connected to an associated metal contact pad formed along a connector edge of the substrate, the substrate also having opposing first and second side edges disposed at opposing ends of the connector edge, wherein each of said first and second side edges defines a notch; and

a first plurality of first integrated circuit (IC) devices and a second plurality of said first IC devices disposed on the first surface of the substrate such that upper surfaces of the first and second pluralities of first IC devices define a first plane that is parallel to the first surface of the substrate, and

a second IC device disposed on the first surface between the first and second pluralities of first devices, the second IC device having an upper surface defining a second plane that is parallel to the first surface of the substrate, wherein the first plane is located between the second plane and the first surface of the substrate;

a first heat-sink plate including;

a first recessed region having a first planar upper surface and an opposing first planar underside surface, the first recessed region having a first side wall structure contacting the first surface of the substrate adjacent to a first side edge, and a tab extending into the notch defined by the first side edge;

a second recessed region having a second planar upper surface and an opposing second planar underside surface, the second recessed region having a first side wall structure contacting the first surface of the substrate adjacent to a second side edge, and a tab extending into the notch defined by the second side edge;

a raised pocket region defining a third planar upper surface and an opposing third planar underside surface, the pocket region being disposed between the first and second recessed regions; and

an adhesive portion disposed between at least one of the first and second planar underside surfaces of said first heat sink plate and the upper surface of at least one of said first and second pluralities of said first IC devices.

15. The memory module assembly according to claim 14,

wherein the memory module further comprises a plurality of third IC devices mounted on the second surface of the substrate such that an upper surface of each of the plurality of third IC devices defines a third plane that is parallel to the second surface,

wherein the memory module assembly further comprises a second heat-sink plate having a fourth planar outer surface and a fourth planar underside surface, and a second adhesive portion sandwiched between the fourth planar underside surface and the upper surface of at least one of the plurality of third IC devices, and

wherein said clip includes a first engaging portion connected to at least one of the first planar upper surface, the second planar upper surface, and the raised pocket region, the clip also including a second engaging portion connected to the fourth planar outer surface of the second heat-sink plate.

16. The memory module assembly according to claim 14, wherein said adhesive portions comprise at least one of a heat-activated adhesive material, a high thermal conductive adhesive film, a thermal-bond adhesive film, and a thermal paste.