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Peroxide preservation

  • US 7,611,011 B2
  • Filed: 06/12/2001
  • Issued: 11/03/2009
  • Est. Priority Date: 06/12/2000
  • Status: Expired due to Term
First Claim
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1. A method of packaging a PVA sponge for use in scrubbing semiconductor wafers, said sponge having particulate, metal ion and anionic counts at or below the value specified for a clean room, said method comprising:

  • (a) placing said sponge in a flexible plastic bag;

    (b) said sponge containing a quality of de-ionized water with around 0.05% to around 0.01% by volume of hydrogen peroxide; and

    (c) sealing said bag.

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