Peroxide preservation

• US 7,611,011 B2
• Filed: 06/12/2001
• Issued: 11/03/2009
• Est. Priority Date: 06/12/2000
• Status: Expired due to Term

• Current Assignee: Illinois Tool Works Inc.
• Original Assignee: Illinois Tool Works Inc.
• Inventors: Skoufis, John
• Primary Examiner(s): Mohandesi; Jila M
• Application Number:
  US09/879,613
• Publication Number:
  US 20020070130A1
• Time in Patent Office: 3,066 Days
• Field of Search: 206205-207, 206/209.X, 206/222, 206/229, 206/233, 206/568.X, 206/812.X, 206/361, 206/446, 206/397, 206/407, 206/408, 206/210, 151/049.4 X, 152/441.X, 152/444, 151/84, 152/570.1, 152/570.5, 152/58, 534/27.X, 534/28, 534/69.X, 132/313, 132/317
• US Class Current: 206/361
• CPC Class Codes: A46B 11/0003 containing only one dose of substance, e.g. single-use toothbrushes
• CPC Class Codes: A46B 2200/1006 Brushes for cleaning the hand or the human body
• CPC Class Codes: A47L 13/51 Storing of cleaning tools, e.g. containers therefor
• CPC Class Codes: B65D 81/22 in moist conditions or immersed in liquids
• CPC Class Codes: C11D 17/041 Compositions releasably affixed on a substrate or incorporated into a dispensing means
• CPC Class Codes: C11D 2111/22 Electronic devices, e.g. PCBs or semiconductors
• CPC Class Codes: C11D 3/3947 Liquid compositions

Abstract

Clean room cleaning articles such as PVA sponge brushes and pre-saturated wipers are packaged in a sealed container with a de-ionized water containing around 0.05 to 1% hydrogen peroxide.

Claims

1. A method of packaging a PVA sponge for use in scrubbing semiconductor wafers, said sponge having particulate, metal ion and anionic counts at or below the value specified for a clean room, said method comprising:

(a) placing said sponge in a flexible plastic bag;

(b) said sponge containing a quality of de-ionized water with around 0.05% to around 0.01% by volume of hydrogen peroxide; and

(c) sealing said bag.

2. A method as in claim 1 in which said quality of de-ionized water with hydrogen peroxide is between an amount sufficient to wet said sponge and an amount necessary to saturate said sponge.

3. A method as in claim 1 in which volume of hydrogen peroxide is around 0.1%.

4. A method of packaging a PVA sponge brush, said sponge brush having particulate, metal ion and anionic counts at or below the values for a clean room, said method comprising placing said cleaning article in a plastic bag, said sponge brush containing a quantity of de-ionized water, said water containing hydrogen peroxide in an amount effective to kill and retard the growth of bacteria in said cleaning article but less than an amount sufficient to develop significant quantities of metallic ions in said container, and sealing said container, in which said amount of hydrogen peroxide is about 0.05% to around 0.1 by volume.

5. A packaged PVA sponge for use in clean rooms, said cleaning article having particulate, metal ion and anionic counts at or below the values specified for a clean room, said package comprising a sealed flexible plastic bag, said sponge being positioned in said bag, and containing a quantity of de-ionized water, said de-ionized water containing hydrogen peroxide in a concentration effective to kill and retard the growth of bacteria in said sponge, said amount being low enough to substantially ensure decomposition of said hydrogen peroxide in a relatively short period of time after the container is sealed and being between 0.05% and 0.1% by volume.

6. A cleaning article as in claim 5 in which said cleaning article is a PVA sponge for scrubbing semiconductor wafer surfaces, and said concentration of hydrogen peroxide is around 0.1 percent by volume.