Mesoscale and microscale device fabrication methods using split structures and alignment elements

• US 7,611,616 B2
• Filed: 08/18/2006
• Issued: 11/03/2009
• Est. Priority Date: 05/07/2002
• Status: Expired due to Fees

• Current Assignee: Microfabrica Incorporated (Technoprobe S.P.A.)
• Original Assignee: Microfabrica Incorporated (Technoprobe S.P.A.)
• Inventors: Smalley, Dennis R., Cohen, Adam L., Lockard, Michael S.
• Primary Examiner(s): Nguyen; Nam X
• Assistant Examiner(s): Van; Luan V
• Application Number:
  US11/506,586
• Publication Number:
  US 20070039828A1
• Time in Patent Office: 1,173 Days
• Field of Search: 205/118, 205/122, 205/170, 205/181, 205/182, 205/223
• US Class Current: 205/118
• CPC Class Codes: B33Y 10/00 Processes of additive manufacturing
• CPC Class Codes: B81B 2201/042 Micromirrors, not used as optical switches
• CPC Class Codes: B81C 1/00293 maintaining a controlled atmosphere with processes not provided for in B81C1/00285
• CPC Class Codes: B81C 1/00333 Aspects relating to packaging of MEMS devices, not covered by groups B81C1/00269 - B81C1/00325
• CPC Class Codes: B81C 2201/0197 Processes for making multi-layered devices not provided for in groups B81C2201/0176 - B81C2201/0192
• CPC Class Codes: B81C 2203/0145 Hermetically sealing an opening in the lid
• CPC Class Codes: C25D 1/003 3D structures, e.g. superposed patterned layers
• CPC Class Codes: C25D 1/10 Moulds; Masks; Masterforms
• CPC Class Codes: C25D 5/022 using masking means
• CPC Class Codes: G01P 15/0802 Details
• CPC Class Codes: G01P 15/125 by capacitive pick-up
• CPC Class Codes: H01P 1/202 Coaxial filters cascaded coaxial cavities H01P1/205
• CPC Class Codes: H01P 11/00 Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
• CPC Class Codes: H01P 11/005 Manufacturing coaxial lines
• CPC Class Codes: H01P 3/06 Coaxial lines
• CPC Class Codes: H01P 5/183 at least one of the guides being a coaxial line
• CPC Class Codes: H05K 3/4647 by applying an insulating layer around previously made via studs
• CPC Class Codes: Y10T 156/10 Methods of surface bonding and/or assembly therefor

Abstract

Various embodiments of the invention are directed to formation of mesoscale or microscale devices using electrochemical fabrication techniques where structures are formed from a plurality of layers as opened structures which can be folded over or other otherwise combined to form structures of desired configuration. Each layer is formed from at least one structural material and at least one sacrificial material. The initial formation of open structures may facilitate release of the sacrificial material, ability to form fewer layers to complete a structure, ability to locate additional materials into the structure, ability to perform additional processing operations on regions exposed while the structure is open, and/or the ability to form completely encapsulated and possibly hollow structures.

Claims

1. A method for forming at least a portion of a three-dimensional device having a desired configuration, comprising:

a. forming at least first and second portions of a structure from a plurality of adhered layers of at least one structural material where the first portion has a first surface and the second portion has a second surface where the first and second surfaces are separated from one another during formation of the layers but which are to be located in contact or in proximity to one another in the desired configuration;

b. separating the structure from any sacrificial material that would hinder the bringing of the first and second portions into contact or into proximity or which would be effectively trapped if in place when the first and second portions are brought together; and

c. rotating at least one of the first and second portions relative to the other to bring the first and second surfaces into contact or into proximity to yield the three-dimensional device,

wherein the forming comprises depositing at least one of the at least one structural material or the sacrificial material selectively onto a substrate or previously deposited material via one or more openings in a masking material that is adhered to the substrate or previously deposited material.

2. The method of claim 1 wherein the method additionally comprises:

d. after moving the first and second portions into contact or proximity, securing the portions to yield the desired configuration.

3. The method of claim 2 wherein the securing comprises at least one of bonding with solder, bonding with a eutectic material, bonding with gold, encapsulating at least a portion of the first and second portions with a dielectric encapsulant, or engaging one or more locking clips.

4. The method of claim 1 wherein the forming results in said first and second portions being attached to one another by a bendable hinge structure.

5. The method of claim 4 wherein the hinge structure comprises a plurality of hinge structures.

6. The method of claim 4 wherein, the hinge structure comprises a configuration having at least one wider region and at least one narrower region wherein bending preferentially occurs in the narrower region.

7. The method of claim 1 wherein the forming results in said first and second portions being joined to one another by a pivotable hinge structure.

8. The method of claim 1 wherein at least one of the first portion or the second portion includes alignment structures which aid in guiding the first and second surfaces in proximity or in contact.

9. The method of claim 1 wherein at least one of the first portion or the second portion includes alignment structures which aid in ensuring that the first and second portions are properly located after moving.

14. The method of claim 3 wherein the hinge structure comprises a plurality of hinge structures.

15. The method of claim 14 wherein the hinge structure comprises a configuration having at least one wider region and at least one narrower region wherein bending preferentially occurs in the narrower region.

10. A method for forming at least a portion of a three-dimensional device having a desired configuration, comprising:

a. forming at least first and second portions of a structure from a plurality of adhered layers of at least one structural material where the first portion has a first surface and the second portion has a second surface where the first and second surfaces are separated from one another during formation of the layers but which are to be located in contact or in proximity to one another in the desired configuration; and

b. rotating at least one of the first and second portions relative to the other to bring the first and second surfaces into contact or into proximity,

wherein the forming comprises depositing at least one material selectively onto a substrate or previously deposited material via one or more openings in a masking material that is adhered to the substrate or previously deposited material, and

wherein the forming comprises forming one or more alignment structures which aid in locating the first and second surfaces in proximity or in contact and/or which aid in guiding the first and second surfaces in proximity or in contact.

11. The method of claim 10 wherein the method additionally comprises:

c. after moving the first and second portions into contact or proximity, securing the portions to yield the desired configuration.

12. The method of claim 11 wherein the securing comprises at least one of bonding with solder, bonding with a eutectic material, bonding with gold, encapsulating at least a portion of the first and second portions with a dielectric encapsulant, or engaging one or more locking clips.

13. The method of claim 10 wherein, the forming results in said first and second portions being attached to one another by a bendable hinge structure.

16. The method of claim 10 wherein the forming results in said first and second portions being joined to one another by a pivotable hinge structure.

17. The method of claim 10 wherein the alignment structure comprises a plurality of structures which include at least one structure which is bent from a formed position to an alignment guiding position.

18. A method for forming at least a portion of a three-dimensional device having a desired configuration, comprising:

a. forming at least first, second, and third portions of a structure from a plurality of adhered layers of at least one structural material where the first portion has a first surface and the second portion has a second surface and the third portion has a third surface, where the first, second, surfaces are separated from one another during formation of the layers but which are to be located in contact or in proximity to one another in the desired configuration, and where the third surface is separated from the first and second portions during formation but is to be located in contact or in proximity to a surface of one of the first or second portions; and

b. moving at least one of the first and second portions relative to the other to bring the first and second surfaces into contact or into proximity,

c. moving at least one of the third or combined first and second portions relative to the other to bring the third and combined first and second portions into contact or into proximity, wherein at least one of the moving steps comprises rotating.