Electronic device and method of manufacturing the same, chip carrier, circuit board, and electronic instrument
First Claim
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1. A method of manufacturing an electronic device, the method comprising:
- mounting a chip component above a substrate face up with an adhesive disposed between the substrate and the chip component, the chip component having an electrode on a first surface of the chip component opposite to a second surface facing the substrate;
forming an insulating section adjacent to the chip component by applying a force between the substrate and the chip component so that a portion of the adhesive is pressed out to a region adjacent to the chip component, the portion of the adhesive having a top higher from the substrate than the first surface, the insulating section formed of the portion of the adhesive; and
forming an interconnect on the insulating section from the electrode to an interconnect pattern formed on the substrate for electrically connecting the electrode and the interconnect pattern.
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Abstract
An external terminal is formed on an interconnect pattern formed on a substrate by using a soldering material. Subsequently, a chip component having an electrode is mounted on the substrate. An interconnect for electrically connecting the electrode and the interconnect pattern is formed at a temperature lower than a melting point of the soldering material.
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Citations
6 Claims
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1. A method of manufacturing an electronic device, the method comprising:
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mounting a chip component above a substrate face up with an adhesive disposed between the substrate and the chip component, the chip component having an electrode on a first surface of the chip component opposite to a second surface facing the substrate; forming an insulating section adjacent to the chip component by applying a force between the substrate and the chip component so that a portion of the adhesive is pressed out to a region adjacent to the chip component, the portion of the adhesive having a top higher from the substrate than the first surface, the insulating section formed of the portion of the adhesive; and forming an interconnect on the insulating section from the electrode to an interconnect pattern formed on the substrate for electrically connecting the electrode and the interconnect pattern. - View Dependent Claims (2, 3, 4, 5, 6)
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Specification