Semiconductor device including a strained superlattice layer above a stress layer
First Claim
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1. A semiconductor device comprising:
- a stress layer;
a strained superlattice layer above said stress layer and comprising a plurality of stacked groups of layers;
each group of layers of said strained superlattice layer comprising a plurality of stacked base semiconductor monolayers defining a base semiconductor portion and a single non-semiconductor monolayer constrained within a crystal lattice of adjacent base semiconductor portions from among the plurality of base semiconductor portions, wherein not all of the possible sites for non-semiconductor atoms in the single non-semiconductor monolayer are occupied by non-semiconductor atoms; and
non-superlattice regions for causing transport of charge carriers through said strained superlattice layer in a parallel direction relative to the stacked groups of layers, said non-superlattice regions comprising source and drain regions with said strained superlattice layer therebetween.
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Abstract
A semiconductor device may include a stress layer and a strained superlattice layer above the stress layer and including a plurality of stacked groups of layers. More particularly, each group of layers of the strained superlattice layer may include a plurality of stacked base semiconductor monolayers defining a base semiconductor portion, and at least one non-semiconductor monolayer constrained within a crystal lattice of adjacent base semiconductor portions.
170 Citations
33 Claims
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1. A semiconductor device comprising:
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a stress layer; a strained superlattice layer above said stress layer and comprising a plurality of stacked groups of layers; each group of layers of said strained superlattice layer comprising a plurality of stacked base semiconductor monolayers defining a base semiconductor portion and a single non-semiconductor monolayer constrained within a crystal lattice of adjacent base semiconductor portions from among the plurality of base semiconductor portions, wherein not all of the possible sites for non-semiconductor atoms in the single non-semiconductor monolayer are occupied by non-semiconductor atoms; and non-superlattice regions for causing transport of charge carriers through said strained superlattice layer in a parallel direction relative to the stacked groups of layers, said non-superlattice regions comprising source and drain regions with said strained superlattice layer therebetween. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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21. A semiconductor device comprising:
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a stress layer comprising a semiconductor graded in a vertical direction; a strained superlattice layer comprising a plurality of groups of layers vertically stacked on said graded semiconductor layer; each group of layers of said strained superlattice layer comprising a plurality of stacked base silicon monolayers defining a base silicon portion and a single oxygen monolayer constrained within a crystal lattice of adjacent base silicon portions from among the plurality of base silicon portions, wherein not all of the possible sites for oxygen atoms in the single oxygen monolayer are occupied by oxygen atoms; and non-superlattice regions for causing transport of charge carriers through said strained superlattice layer in a parallel direction relative to the stacked groups of layers, said non-superlattice regions comprising source and drain regions with said strained superlattice layer therebetween. - View Dependent Claims (22, 23, 24, 25, 26)
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27. A semiconductor device comprising:
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a stress layer; a strained layer above said stress layer and comprising a plurality of stacked base semiconductor portions and a single non-semiconductor monolayer constrained within a crystal lattice of adjacent base semiconductor portions from among the plurality of base semiconductor portions, wherein not all of the possible sites for non-semiconductor atoms in the single non-semiconductor monolayer are occupied by non-semiconductor atoms; and non-superlattice regions for causing transport of charge carriers through said strained layer in a parallel direction relative to the stacked base semiconductor portions, said non-superlattice regions comprising source and drain regions with said strained layer therebetween. - View Dependent Claims (28, 29, 30, 31, 32, 33)
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Specification