Packaged microelectronic devices with a lead frame

• US 7,612,436 B1
• Filed: 07/31/2008
• Issued: 11/03/2009
• Est. Priority Date: 07/31/2008
• Status: Active Grant

• Current Assignee: Micron Technology, Inc.
• Original Assignee: Micron Technology, Inc.
• Inventors: Wang, Ai-Chie, Lee, Teck Kheng, Chin, Voon Siong
• Primary Examiner(s): Chambliss; Alonzo
• Application Number:
  US12/183,981
• Time in Patent Office: 460 Days
• Field of Search: None
• US Class Current: 257/672
• CPC Class Codes: H01L 2224/05554 being square
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/32145 the bodies being stacked
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/451 with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48145 the bodies being stacked
• CPC Class Codes: H01L 2224/48147 with an intermediate bond, e.g. continuous wire daisy chain
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2225/06562 at least one device in the stack being rotated or offset
• CPC Class Codes: H01L 23/49503 characterised by the die pad
• CPC Class Codes: H01L 23/4951 Chip-on-leads or leads-on-chip techniques, i.e. inner lead fingers being used as die pad
• CPC Class Codes: H01L 23/49575 Assemblies of semiconductor devices on lead frames
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 25/0657 Stacked arrangements of devices
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/00015 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed as prior art
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: Y10T 29/49121 : Beam lead frame or beam lead device

Abstract

Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices are disclosed herein. In one embodiment, a packaged microelectronic device can include a support member and at least one die in a stacked configuration attached to the support member. The support member may include a leadframe disposed longitudinally between first and second ends and latitudinally between first and second sides. The leadframe includes a lead extending between the first end and the first side.

Claims

1. A microelectronic device, comprising:

a leadframe disposed longitudinally between first and second ends and disposed latitudinally between first and second sides, the leadframe including—

a first lead extending between the first end and the second end;

a second lead extending between the first end and the first side; and

a die paddle disposed longitudinally between the first and second ends and disposed latitudinally between the first and second sides;

a first die mechanically coupled to the die paddle of the leadframe, the first die having a first edge proximate the first end at the leadframe, a second edge spaced inwardly of the second end of the leadframe, integrated circuitry, and an external terminal electrically connected to the integrated circuitry; and

a first wire bond electrically coupling one of the leads of the leadframe and the terminal of the first die.

2. The microelectronic device of claim 1, further comprising:

an encapsulant generally encasing the first die, the first wire bond and at least a portion of the leadframe; and

wherein no lead lock tape contacts the first and second leads within the encapsulant.

3. The microelectronic device of claim 1, wherein the leadframe includes a leadframe length measured longitudinally between the first and second ends, the first lead has a first length measured lengthwise along the first lead between the first and second ends, and the second lead includes a second length measured lengthwise along the second lead between the first end and the first side;

and wherein the first length is approximately equal to the leadframe length, and the second length is different than the leadframe length.

4. The microelectronic device of claim 3, wherein the second lead has a longitudinal section extending lengthwise from the first end of the leadframe to a bend between the second end of the leadframe and the second edge of the first die and a lateral section extending from the bend to the first side, and wherein the first wirebond is attached to the second lead.

5. The microelectronic device of claim 4, further comprising a second die stacked on the first die, and a second wirebond attached to the second lead and the second die.

6. A microelectronic device, comprising:

a leadframe disposed longitudinally between first and second ends and disposed latitudinally between first and second sides, the leadframe including—

a first lead extending generally longitudinally between the first and second ends of the leadframe;

a second lead having a first section, a second section, and a second bond pad, the first section of the second lead extending generally longitudinally from the first end, and the second section of the second lead extending generally laterally between the first side and the first section of the second lead;

a third lead having a first section, a second section, and a third bond pad, the first section of the third lead extending generally longitudinally from the first end, and the second section of the third lead extending generally laterally between the second side and the first section of the third lead; and

a die paddle disposed longitudinally between the first end and the second sections of the second and third leads, the die paddle being disposed latitudinally between the first and second sides;

a first die mechanically coupled to the die paddle of the leadframe, the first die including a first plurality of electrical terminals; and

a plurality of wire bonds electrically coupling the leadframe and the first die, the plurality of wire bonds including a first wire bond electrically coupling a first one of the first plurality of electrical terminals and the first bond pad, a second wire bond electrically coupling a second one of the first plurality of electrical terminals and the second bond pad, and a third wire bond electrically coupling a third one of the first plurality of electrical terminals and the third bond pad; and

an encapsulant encasing the first die and the plurality of wire bonds, and the first sections of the second and third leads project outside the encapsulant.

7. The microelectronic device according to claim 6, wherein the second sections of the second and third leads extend generally perpendicular to the first sections of the second and third leads, respectively, and also generally perpendicular the sides of the leadframe.

8. The microelectronic device of claim 6, further comprising:

a second die mechanically coupled to the first die, the second die including a second plurality of electrical terminals;

wherein the plurality of wire bonds includes a fourth wire bond electrically coupling a first one of the second plurality of electrical terminals and the fourth bond pad, and a fifth wire bond electrically coupling a second one of the second plurality of electrical terminals and the fifth bond pad.

9. The microelectronic device of claim 8, wherein the second die is disposed in a staggered-step configuration with respect to the first die.

10. The microelectronic device of claim 6, wherein the first die includes a NAND flash memory.

11. A microelectronic device, comprising:

a plurality of memory dies, wherein individual dies have a first end, a second end, and a terminal array proximate the second end, and wherein the dies are stacked in a staggered-step configuration such that an upper die reveals the terminal array of an immediately adjacent underlying die;

a leadframe extending longitudinally between first and second ends and extending latitudinally between first and second sides, the leadframe including—

a die paddle disposed longitudinally between the first and second ends and latitudinally between the first and second sides, the plurality of memory dies being stacked on the die paddle such that the sets of electric terminals are proximate but spaced apart from the second end of the leadframe; and

a first lead including first and second sections and a bond pad, the first section extending from the first end of the leadframe, the second section extending from the first side of the leadframe, and the bond pad being disposed between the plurality of memory dies and the second end of the leadframe; and

a wire bond electrically coupling one of the electric terminals and the bond pad.

12. The microelectronic device of claim 11, wherein the die paddle of the leadframe is downset relative to a portion of the first section of the first lead proximate the first end of the leadframe and is downset relative to a portion of the second section of the first lead proximate the first side of the lead frame.

13. The microelectronic device of claim 11, wherein a bottom one of the plurality of memory dies in the stagger-step configuration is mechanically coupled to the die paddle.

14. The microelectronic device of claim 11, further comprising:

an encapsulant encasing the plurality of memory dies, the die paddle of the leadframe and the wire bond, and the first section of the first lead projects outside the encapsulant.