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Inter-chip communication

  • US 7,612,443 B1
  • Filed: 09/03/2004
  • Issued: 11/03/2009
  • Est. Priority Date: 09/04/2003
  • Status: Active Grant
First Claim
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1. A microchip comprising:

  • a plurality of first interconnect nodules, integrated with one or more edges of the microchip, each configured to make a direct electrical connection with one or more electrical contacts of one or more separate electronic devices, wherein said plurality of first interconnect nodules have at least two different shapes.

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