Electromagnetically coupled interconnect system architecture

• US 7,612,630 B2
• Filed: 02/15/2005
• Issued: 11/03/2009
• Est. Priority Date: 05/08/2001
• Status: Expired due to Term

• Current Assignee: FormFactor Incorporated
• Original Assignee: FormFactor Incorporated
• Inventors: Miller, Charles A.
• Primary Examiner(s): Lee; Benny
• Application Number:
  US11/058,486
• Publication Number:
  US 20050156755A1
• Time in Patent Office: 1,722 Days
• Field of Search: 333/24.R, 333/109, 333/247
• US Class Current: 333/24.00R
• CPC Class Codes: H01L 23/48 Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H04B 5/22 Capacitive coupling
• CPC Class Codes: H04B 5/24 Inductive coupling
• CPC Class Codes: H04B 5/48 Transceivers
• CPC Class Codes: H05K 1/141 One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters H05K1/142 and H05K1/147 take precedence
• CPC Class Codes: H05K 1/181 associated with surface mounted components
• CPC Class Codes: H05K 2201/10098 Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
• CPC Class Codes: H05K 3/366 substantially perpendicularly to each other H05K3/361 takes precedence
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product

Abstract

An electromagnetic interconnect method and apparatus effects contactless, proximity connections between elements in an electronics system. Data to be communicated between elements in an electronic system are modulated into a carrier signal and transmitted contactlessly by electromagnetic coupling. The electromagnetic coupling may be directly between elements in the system or through an intermediary transmission medium.

Claims

1. An electronics system comprising:

a first integrated circuit comprising a first electromagnetic coupler;

a second integrated circuit comprising a second electromagnetic coupler, wherein said first integrated circuit and said second integrated circuit are disposed such that said first electromagnetic coupler is loosely coupled to said second electromagnetic coupler such that a signal in said first electromagnetic coupler induces a corresponding signal in said second electromagnetic coupler that is attenuated by at least about 10 decibels; and

a substrate, wherein said first integrated circuit is mounted to said substrate and said second integrated circuit is mounted to said first integrated circuit.

2. An electronics system comprising:

a first integrated circuit comprising a first electromagnetic coupler;

shielding material disposed between circuitry on said first integrated circuit and said first electromagnetic coupler;

a second integrated circuit comprising a second electromagnetic coupler, said first integrated circuit and said second integrated circuit dispose such that said first electromagnetic coupler and said second electromagnetic coupler are spaced from each other but within sufficient proximity to be electromagnetically coupled, whereby data provided to said first electromagnetic coupler is contactlessly communicated to said second electromagnetic coupler; and

shielding material disposed to at least partially shield a contactless communication channel between said first electromagnetic coupler and said second electromagnetic coupler.

3. An electronics system comprising:

a first integrated circuit comprising a first electromagnetic coupler, wherein said first electromagnetic coupler is smaller than said first integrated circuit; and

a second integrated circuit comprising a second electromagnetic coupler,

wherein said first integrated circuit and said second integrated circuit are disposed such that said first electromagnetic coupler is loosely coupled to said second electromagnetic coupler such that a signal in said first electromagnetic coupler induces a corresponding signal in said second electromagnetic coupler that is attenuated by at least about 10 decibels.

4. The electronics system of claim 3 further including a substrate, wherein said first integrated circuit and said second integrated circuit are mounted to said substrate.

5. The electronics system of claim 3, wherein said first electromagnetic coupler is spaced no more than approximately twenty-five millimeters from said second electromagnetic coupler.

6. The electronics system of claim 3 further comprising a third integrated circuit comprising a third electromagnetic coupler disposed to be electromagnetically coupled with at least one of said first electromagnetic coupler and said second electromagnetic coupler.

7. The electronics system of claim 3, wherein said second electromagnetic coupler is smaller than said second integrated circuit.

8. The electronics system of claim 3 further including shielding material disposed between circuitry on said first integrated circuit and said first electromagnetic coupler.

9. The electronics system of claim 8 further including shielding material disposed between circuitry on said second integrated circuit and said second electromagnetic coupler.

10. An electronics system comprising:

a first integrated circuit comprising a first electromagnetic coupler;

a second integrated circuit comprising a second electromagnetic coupler, wherein said first integrated circuit and said second integrated circuit are disposed such that said first electromagnetic coupler is loosely coupled to said second electromagnetic coupler such that a signal in said first electromagnetic coupler induces a corresponding signal in said second electromagnetic coupler that is attenuated by at least about 10 decibels; and

shielding material disposed to at least partially shield a contactless communication channel between said first electromagnetic coupler and said second electromagnetic coupler.

11. An electronics system comprising:

a first integrated circuit;

a second integrated circuit; and

electromagnetic coupling means for providing a loose, contactless electromagnetic coupling between said first integrated circuit and said second integrated circuit such that a signal output by said first integrated circuit induces a corresponding input signal in said second integrated circuit that is attenuated by at least about 10 decibels, wherein said electromagnetic coupling means comprises a first electromagnetic coupler that is part of the first integrated circuit, and the first electromagnetic coupler is smaller than said first integrated circuit.

12. The electronics system of claim 11, wherein said electromagnetic coupling means further comprises a second electromagnetic coupler that is electromagnetically coupled with the first electromagnetic coupler, and the second electromagnetic coupler is part of the second integrated circuit, and the second electromagnetic coupler is smaller than said second integrated circuit.

13. The electronics system of claim 11 further comprising first shielding means for shielding said first integrated circuit.

14. The electronics system of claim 13 further comprising second shielding means for shielding said second integrated circuit.

15. An electronics system comprising:

a first integrated circuit comprising a first electromagnetic coupler;

shielding material disposed between circuitry on said first integrated circuit and said first electromagnetic coupler;

a second integrated circuit comprising a second electromagnetic coupler, said first integrated circuit and said second integrated circuit dispose such that said first electromagnetic coupler and said second electromagnetic coupler are spaced from each other but within sufficient proximity to be electromagnetically coupled, whereby data provided to said first electromagnetic coupler is contactlessly communicated to said second electromagnetic coupler; and

a substrate, wherein said first integrated circuit is mounted to said substrate and said second integrated circuit is mounted to said first integrated circuit.

16. The electronics system of claim 15, wherein said first electromagnetic coupler is spaced no more than approximately twenty-five millimeters from said second electromagnetic coupler.

17. The electronics system of claim 15 further including shielding material disposed between circuitry on said second integrated circuit and said second electromagnetic coupler.

18. The electronics system of claim 15 further comprising a third integrated circuit comprising a third electromagnetic coupler disposed to be electromagnetically coupled with at least one of said first electromagnetic coupler and said second electromagnetic coupler.

19. The electronics system of claim 15, wherein said first electromagnetic coupler is smaller than said first integrated circuit.

20. The electronics system of claim 19, wherein said second electromagnetic coupler is smaller than said second integrated circuit.