Optical gratings, lithography tools including such optical gratings and methods for using same for alignment

• US 7,612,882 B2
• Filed: 10/20/2006
• Issued: 11/03/2009
• Est. Priority Date: 10/20/2006
• Status: Expired due to Fees

• Current Assignee: Hewlett-Packard Development Company, L.P. (HP Inc.)
• Original Assignee: Hewlett-Packard Development Company, L.P. (HP Inc.)
• Inventors: Wang, Shih-Yuan, Gao, Jun, Wu, Wei, Yu, Zhaoning, Robinett, Warren
• Primary Examiner(s): LAUCHMAN, LAYLA G
• Application Number:
  US11/584,461
• Publication Number:
  US 20080094629A1
• Time in Patent Office: 1,110 Days
• Field of Search: 356399-401, 356/618
• US Class Current: 356/401
• CPC Class Codes: G03F 9/7003 Alignment type or strategy, e.g. leveling, global alignment
• CPC Class Codes: G03F 9/7049 Technique, e.g. interferometric

Abstract

Lithography tools and substrates are aligned by generating geometric interference patterns using optical gratings associated with the lithography tools and substrates. In some embodiments, the relative position between a substrate and lithography tool is adjusted to cause at least one geometric shape to have a predetermined size or shape representing acceptable alignment. In additional embodiments, Moiré patterns that exhibit varying sensitivity are used to align substrates and lithography tools. Furthermore, lithography tools and substrates are aligned by causing radiation to interact with optical gratings positioned between the lithography tools and substrates. Lithography tools include an optical grating configured to generate a portion of an interference pattern that exhibits a sensitivity that increases as the relative position between the tools and a substrate moves towards a predetermined alignment position.

Claims

1. A method of aligning a lithography tool with a substrate, the method comprising:

providing a substrate having at least one substrate alignment feature comprising a first optical grating, wherein the first optical grating is configured to have a plurality of alternating light and dark regions;

providing a lithography tool having at least one tool alignment feature comprising a second optical grating, wherein the second optical grating is configured to have a plurality of alternating light and dark regions, the first optical grating and the second optical grating being configured to generate a Moiré

pattern in a beam of electromagnetic radiation when the beam of electromagnetic radiation interacts with both the first optical grating and the second optical grating, the sensitivity of the Moiré

pattern varying with the relative alignment between the substrate and the lithography tool;

configuring the alternating light and dark regions of both the first optical grating and the second optical grating to have at least one of a width, a pitch, and a duty cycle that varies across each respective optical grating;

positioning the lithography tool relative to the substrate and roughly aligning the tool alignment feature and the substrate alignment feature;

causing a beam of electromagnetic radiation to interact with both the first optical grating and the second optical grating to generate a Moiré

pattern; and

adjusting the relative position between the substrate and the lithography tool to cause the Moiré

pattern to approximate or match a predetermined pattern representing an acceptable degree of alignment between the lithography tool and the substrate.

2. The method of claim 1, wherein the alternating light and dark regions of the first optical grating each have an elongated generally rectangular shape, and wherein the alternating light and dark regions of the second optical grating each have an elongated generally rectangular shape.

3. The method of claim 1, further comprising configuring the alternating light and dark regions of both the first optical grating and the second optical grating to have a central region and two opposite end regions, at least one of a width, a pitch, and a duty cycle differing in the central region from each of the end regions in each respective optical grating.

4. The method of claim 3, further comprising:

configuring the alternating light and dark regions in the end regions of both the first optical grating and the second optical grating to generate a Moiré

pattern having a first sensitivity; and

configuring the alternating light and dark regions in the central region of both the first optical grating and the second optical grating to generate a Moiré

pattern having a second sensitivity, the second sensitivity being higher than the first sensitivity.

5. The method of claim 1, further comprising configuring the first optical grating and the second optical grating to generate a Moiré

pattern exhibiting a sensitivity that increases as the relative position between the lithography tool and the substrate is adjusted towards a predetermined alignment position between the lithography tool and the substrate.

6. The method of claim 1, further comprising configuring the first optical grating and the second optical grating to generate a Moiré

pattern exhibiting a sensitivity that increases exponentially as the relative position between the lithography tool and the substrate is adjusted towards a predetermined alignment position between the lithography tool and the substrate.

7. A method of aligning a lithography tool with a substrate, the method comprising:

providing a substrate having at least one substrate alignment feature including a first optical grating;

providing a lithography tool having at least one tool alignment feature including a second optical grating, the first optical grating and the second optical grating being configured to generate an interference pattern in a beam of electromagnetic radiation when the beam of electromagnetic radiation is caused to interact with both the first optical grating and the second optical grating;

positioning the lithography tool relative to the substrate and roughly aligning the tool alignment feature and the substrate alignment feature;

causing a beam of electromagnetic radiation to interact with both the first optical grating and the second optical grating to generate an interference pattern comprising a plurality of geometric shapes; and

adjusting the relative position between the substrate and the lithography tool to cause at least one geometric shape of the interference pattern to have at least one of a predetermined size and a predetermined shape representing an acceptable degree of alignment between the lithography tool and the substrate,

wherein adjusting the relative position between the substrate and the lithography tool comprises adjusting the relative position between the substrate and the lithography tool to cause at least one generally triangular shape of the interference pattern to have at least one of a predetermined size and a predetermined shape.

8. The method of claim 7, wherein providing a substrate further comprises configuring the first optical grating to have a plurality of alternating light and dark regions each having an elongated generally rectangular shape, and wherein providing a lithography tool further comprises configuring the second optical grating to have a plurality alternating light and dark regions each having an elongated generally rectangular shape.

9. The method of claim 8, wherein roughly aligning the tool alignment feature and the substrate alignment feature comprises orienting the alternating light and dark regions of the second optical grating at an angle relative to the alternating light and dark regions of the first optical grating.

10. The method of claim 7, further comprising configuring the first optical grating and the second optical grating to generate an interference pattern exhibiting a sensitivity that increases as the relative position between the lithography tool and the substrate is adjusted towards a predetermined alignment position between the lithography tool and the substrate.

11. The method of claim 10, further comprising:

configuring one of the first optical grating and the second optical grating to have a plurality of alternating light and dark regions each having an elongated generally rectangular shape, and

configuring the other of the first optical grating and the second optical grating to have a plurality of alternating light and dark regions each having a curved S shape.

12. A lithography tool comprising an optical grating for aligning the lithography tool relative to a substrate, the optical grating comprising a plurality of alternating light and dark regions configured to generate at least a portion of an interference pattern when a beam of electromagnetic radiation is caused to interact with the optical grating of the lithography tool and an optical grating of the substrate, the interference pattern exhibiting a pattern sensitivity that increases as the relative position between the lithography tool and the substrate is moved towards a predetermined alignment position between the lithography tool and the substrate.

13. The tool of claim 12, wherein the alternating light and dark regions of the optical grating have a substantially rectangular shape.

14. The tool of claim 12, wherein the alternating light and dark regions of the optical grating have a curved S shape.

15. The tool of claim 12, wherein the optical grating is geometrically symmetric about an axis passing approximately through the center of the optical grating.

16. The tool of claim 12, wherein the interference pattern exhibits a pattern sensitivity that increases continuously as the relative position between the lithography tool and the substrate is moved towards the predetermined alignment position between the lithography tool and the substrate.

17. The tool of claim 16, wherein the interference pattern exhibits a pattern sensitivity that increases exponentially as the relative position between the lithography tool and the substrate is moved towards the predetermined alignment position between the lithography tool and the substrate.

18. The tool of claim 12, wherein the plurality of alternating light and dark regions of the optical grating of the lithography tool is configured to generate at least a portion of a Moiré

pattern when a beam of electromagnetic radiation is caused to interact with the optical grating of the lithography tool and an optical grating on the substrate.

19. The tool of claim 16, wherein a central region of the optical grating of the lithography tool is configured to generate a portion of a Moiré

pattern exhibiting a first pattern sensitivity, and wherein an end region of the optical grating of the lithography tool is configured to generate a portion of a Moiré

pattern exhibiting a second pattern sensitivity, the first pattern sensitivity being higher than the second pattern sensitivity.

20. A method of aligning a lithography tool with a substrate, the method comprising:

roughly aligning a lithography tool with a substrate;

passing a beam of electromagnetic radiation between the lithography tool and the substrate without passing through the lithography tool or the substrate;

causing the beam of electromagnetic radiation to interact with both a first optical grating coupled to the substrate and a second optical grating coupled to the lithography tool to generate an interference pattern; and

adjusting a relative position between the substrate and the lithography tool to cause the interference pattern to approximate or match a predetermined pattern representing an acceptable degree of alignment between the lithography tool and the substrate.

21. The method of claim 20, wherein causing the beam of electromagnetic radiation to interact with both a first optical grating coupled to the substrate and a second optical grating coupled to the lithography tool comprises passing the beam of electromagnetic radiation between a first plurality of protrusions extending from a surface of the substrate and between a second plurality of protrusions extending from a surface of the lithography tool to generate the interference pattern.

22. The method of claim 21, wherein passing the beam of electromagnetic radiation between a first plurality of protrusions extending from a surface of the substrate and between a second plurality of protrusions extending from a surface of the lithography tool to generate the interference pattern comprises passing the beam of electromagnetic radiation between a first plurality of protrusions extending from a surface of the substrate and between a second plurality of protrusions extending from a surface of the lithography tool to generate a Moiré

pattern.

23. The method of claim 20, wherein roughly aligning a lithography tool with a substrate comprises providing a predetermined spacing between the substrate and the lithography tool using at least one of a first spacer attached to the substrate and a second spacer attached to the lithography tool.

24. The method of claim 23, further comprising providing the first optical grating on the first spacer and providing the second optical grating on the second spacer.

25. The method of claim 24, wherein causing the beam of electromagnetic radiation to interact with both a first optical grating coupled to the substrate and a second optical grating coupled to the lithography tool comprises causing the beam of electromagnetic radiation to pass through the first spacer, the optical grating on the first spacer, the second spacer, and the optical grating on the second spacer.

26. The method of claim 24, further comprising configuring the first spacer and the second spacer as a waveguide.

27. The method of claim 24, wherein causing the beam of electromagnetic radiation to pass through the first spacer and the second spacer comprises:

guiding the electromagnetic radiation towards the first optical grating using the first spacer; and

guiding the electromagnetic radiation towards a radiation detector using the second spacer.