Method for making reservoir-based sensor device

• US 7,614,135 B2
• Filed: 10/29/2007
• Issued: 11/10/2009
• Est. Priority Date: 03/02/2000
• Status: Expired due to Fees

• Current Assignee: Microchips Biotech, Inc. (Keratin Biosciences, Inc.)
• Original Assignee: MicroCHIPS Inc.
• Inventors: Santini, John T. Jr., Sheppard, Norman F. Jr., Langer, Robert S., Young, Chung Chang
• Primary Examiner(s): ARBES, CARL J
• Application Number:
  US11/927,156
• Publication Number:
  US 20080115361A1
• Time in Patent Office: 743 Days
• Field of Search: 295/95, 298/25, 436/174
• US Class Current: 29/595
• CPC Class Codes: A61B 5/00 Measuring for diagnostic purposes radiation diagnosis A61B6/00; diagnosis by ultrasonic, sonic or infrasonic waves A61B8/00; Identification of persons
• CPC Class Codes: A61B 5/14532 for measuring glucose, e.g. by tissue impedance measurement
• CPC Class Codes: A61B 5/14546 for measuring analytes not otherwise provided for, e.g. ions, cytochromes
• CPC Class Codes: A61B 5/1473 invasive, e.g. introduced into the body by a catheter A61B5/1482 takes precedence
• CPC Class Codes: A61B 5/14865 invasive, e.g. introduced into the body by a catheter or needle or using implanted sensors
• CPC Class Codes: A61K 47/6957 the form being a device or a kit, e.g. stents or microdevices
• CPC Class Codes: A61K 49/0002 General or multifunctional contrast agents, e.g. chelated agents
• CPC Class Codes: A61K 9/0004 Osmotic delivery systems; Sustained release driven by osmosis, thermal energy or gas
• CPC Class Codes: A61K 9/0009 involving or responsive to electricity, magnetism or acoustic waves; Galenical aspects of sonophoresis, iontophoresis, electroporation or electroosmosis microelectromechanical systems A61K9/0097
• CPC Class Codes: A61K 9/0097 Micromachined devices; Microelectromechanical systems [MEMS]; Devices obtained by lithographic treatment of silicon; Devices comprising chips intradermal microneedle arrays A61K9/0021; MEMS in general B81B7/02
• CPC Class Codes: A61P 3/10 for hyperglycaemia, e.g. antidiabetics
• CPC Class Codes: B01J 19/0093 Microreactors, e.g. miniaturised or microfabricated reactors laboratory containers with capillary fluid transport in microfabricated channels or chambers B01L3/5027
• CPC Class Codes: B01J 2219/00317 Microwell devices, i.e. having large numbers of wells
• CPC Class Codes: B01J 2219/00351 Means for dispensing and evacuation of reagents
• CPC Class Codes: B01J 2219/00783 Laminate assemblies, i.e. the reactor comprising a stack of plates
• CPC Class Codes: B01J 2219/00819 Materials of construction
• CPC Class Codes: B01J 2219/00822 Metal
• CPC Class Codes: B01J 2219/00824 Ceramic
• CPC Class Codes: B01J 2219/00828 Silicon wafers or plates
• CPC Class Codes: B01J 2219/00831 Glass
• CPC Class Codes: B01J 2219/00833 : Plastic
• CPC Class Codes: B01J 2219/00835 : Comprising catalytically active material
• CPC Class Codes: B01J 2219/00844 : Comprising porous material
• CPC Class Codes: B01J 2219/00853 : Employing electrode arrangements
• CPC Class Codes: B01J 2219/00873 : Heat exchange
• CPC Class Codes: B01J 2219/00889 : Mixing micromixers B01F33/30
• CPC Class Codes: B01J 2219/00907 : using membranes
• CPC Class Codes: B01J 2219/00925 : Irradiation
• CPC Class Codes: B01J 2219/00952 : Sensing operations
• CPC Class Codes: B01J 2219/00957 : Compositions or concentrations
• CPC Class Codes: B01J 2219/00966 : pH
• CPC Class Codes: B01J 2219/0097 : Optical sensors
• CPC Class Codes: B01J 2219/00984 : Residence time
• CPC Class Codes: B01J 2219/00986 : Microprocessor
• CPC Class Codes: B01L 2200/12 : Specific details about manufacturing devices
• CPC Class Codes: B01L 2300/023 : Sending and receiving of information, e.g. using bluetooth
• CPC Class Codes: B01L 2300/049 : Valves integrated in closure
• CPC Class Codes: B01L 2300/0627 : Sensor or part of a sensor is integrated
• CPC Class Codes: B01L 2300/0654 : Lenses; Optical fibres
• CPC Class Codes: B01L 2300/0819 : Microarrays; Biochips
• CPC Class Codes: B01L 2400/0677 : phase change valves; Meltable, freezing, dissolvable plugs; Destructible barriers
• CPC Class Codes: B01L 3/50853 : with covers or lids
• CPC Class Codes: C40B 60/14 : for creating libraries
• CPC Class Codes: G01N 2035/00158 : Elements containing microarrays, i.e. "biochip"
• CPC Class Codes: G01N 2035/00247 : Microvalves
• CPC Class Codes: Y10T 29/49007 : Indicating transducer
• CPC Class Codes: Y10T 29/49117 : Conductor or circuit manufacturing
• CPC Class Codes: Y10T 436/25 : including sample preparation

Abstract

Methods are provided for making a reservoir-based sensor device. The method may include fabricating a first substrate portion which comprises an upper surface, an opposed lower surface, a plurality of through holes defining reservoirs between said upper surface and said lower surface, and a plurality of reservoir caps closing off one end of said through holes at said upper surface; fabricating a plurality of sensors on an upper surface of a second substrate portion; aligning the first and second substrate portions such that each of said plurality of sensors is in alignment with each of said plurality of reservoirs; and bonding together the lower surface of said first substrate portion and the upper surface of said second substrate portion to seal each of said sensors inside the reservoir with which it is aligned.

Claims

1. A method for making a reservoir-based sensor device, comprising:

fabricating a first substrate portion which comprises an upper surface, an opposed lower surface, a plurality of through holes defining reservoirs between said upper surface and said lower surface, and a plurality of reservoir caps closing off one end of said through holes at said upper surface;

fabricating a plurality of sensors on an upper surface of a second substrate portion;

aligning the first and second substrate portions such that each of said plurality of sensors is in alignment with each of said plurality of reservoirs; and

bonding together the lower surface of said first substrate portion and the upper surface of said second substrate portion to seal each of said sensors inside the reservoir with which it is aligned,

wherein the reservoir caps each comprise a metal membrane operable to be selectively disintegrated to open one end of the through hole closed off by the reservoir cap.

2. The method of claim 1, wherein the sensors are biosensors.

3. The method of claim 1, wherein the first and second substrate portions comprise silicon, glass, or a combination thereof

4. The method of claim 1, wherein the bonding comprises a molecular-scale bond at the interface between the materials forming the first and second substrate portions.

5. The method of claim 1, wherein the bonding comprises melting and re-solidification of the material forming the interfacing surface of one or both of the first and second substrate portions.

6. The method of claim 1, wherein the bonding comprises the use of a chemical adhesive, epoxy, or cement.

7. The method of claim 1, wherein the metal membrane comprises gold.

8. The method of claim 1, wherein the selective disintegration of the metal membrane comprises a phase change in the metal membrane by application of an electric field or current.

9. The method of claim 1, wherein the step of fabrication of the first substrate portion comprises fabricating electrical circuitry on the upper surface of the first substrate portion, wherein the electrical circuitry is used in the selective disintegration of the metal membrane.

10. The method of claim 9, wherein the electrical circuitry comprises at least one electrode tat is connected to the reservoir cap on the upper surface of the first substrate portion.

11. The method of claim 9, wherein the electrical circuitry is fabricated by a deposition, patterning, and etching process;

by microcontact printing;

or by soft lithography methods.

12. A method for making an implantable reservoir-based sensor device, comprising:

fabricating a first substrate portion which comprises an upper surface, an opposed lower surface, a plurality of through holes defining reservoirs between said upper surface and said lower surface, and a plurality of metal reservoir caps closing off one end of said through holes at said upper surface;

fabricating a plurality of biosensors on an upper surface of a second substrate portion, the biosensors comprising an enzyme or antibody;

aligning the first and second substrate portions such that each of said plurality of biosensors is in alignment with each of said plurality of reservoirs;

bonding together the lower surface of said first substrate portion and the upper surface of said second substrate portion to seal each of said biosensors inside the reservoir with which it is aligned; and

packaging the bonded first and second substrate portions together with control circuitry and a power source into a package suitable for implantation into a patient.

13. The method of claim 12, wherein the metal reservoir caps are operable to be selectively disintegrated to open one end of the though hole closed off by the reservoir cap.

14. The method of claim 13, wherein the control circuitry and power source are operable to induce a phase change in the reservoir caps.

15. The method of claim 12, wherein the metal reservoir caps comprise gold.