Method for fabricating MEMS device package that includes grinding MEMS device wafer to expose array pads corresponding to a cap wafer
First Claim
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1. A method for fabricating a package of a micro-electro-mechanical systems (MEMS) device, the method comprising:
- preparing a MEMS device wafer where a first trench is formed;
preparing a cap wafer where a plurality of bonding bumps and a plurality of array pads are formed, the array pads formed in a region corresponding to the first trench and respectively coupled to the bonding bumps through inner interconnection lines;
bonding the MEMS device wafer and the cap wafer to make the first trench and the array pads correspond to each other;
grinding a rear portion of the MEMS device wafer to form an opening line exposing the array pads; and
dicing the MEMS device wafer and the cap wafer.
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Abstract
A package of a micro-electro-mechanical systems (MEMS) device includes a cap wafer, a plurality of bonding bumps formed over the cap wafer, a plurality of array pads arrayed on an outer side of the bonding bumps, and an MEMS device wafer bonded to an upper portion of the cap wafer in a manner to expose the array pads.
10 Citations
14 Claims
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1. A method for fabricating a package of a micro-electro-mechanical systems (MEMS) device, the method comprising:
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preparing a MEMS device wafer where a first trench is formed; preparing a cap wafer where a plurality of bonding bumps and a plurality of array pads are formed, the array pads formed in a region corresponding to the first trench and respectively coupled to the bonding bumps through inner interconnection lines; bonding the MEMS device wafer and the cap wafer to make the first trench and the array pads correspond to each other; grinding a rear portion of the MEMS device wafer to form an opening line exposing the array pads; and dicing the MEMS device wafer and the cap wafer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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Specification