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Method for fabricating MEMS device package that includes grinding MEMS device wafer to expose array pads corresponding to a cap wafer

  • US 7,615,394 B2
  • Filed: 06/13/2007
  • Issued: 11/10/2009
  • Est. Priority Date: 06/14/2006
  • Status: Expired due to Fees
First Claim
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1. A method for fabricating a package of a micro-electro-mechanical systems (MEMS) device, the method comprising:

  • preparing a MEMS device wafer where a first trench is formed;

    preparing a cap wafer where a plurality of bonding bumps and a plurality of array pads are formed, the array pads formed in a region corresponding to the first trench and respectively coupled to the bonding bumps through inner interconnection lines;

    bonding the MEMS device wafer and the cap wafer to make the first trench and the array pads correspond to each other;

    grinding a rear portion of the MEMS device wafer to form an opening line exposing the array pads; and

    dicing the MEMS device wafer and the cap wafer.

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