Multiple digital printing techniques for fabricating printed circuits
First Claim
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1. A method of fabricating a printed circuit comprising:
- depositing a first conductive material to form a first conductive pathway upon a substrate;
depositing a dielectric material directly over at least a first portion of the conductive pathway utilizing an electrophotographic process;
depositing a second conductive material over at least a portion of the dielectric material to form a second conductive pathway, where the second conductive pathway is in electrical communication with the first conductive pathway;
wherein the act of depositing the dielectric material over at least the first portion of the conductive pathway includes selectively depositing the dielectric material to form at least one via leaving exposed a second portion of the first conductive pathway; and
the act of depositing the second conductive material over at least a portion of the dielectric material to form the second conductive pathway upon the substrate includes utilizing an inkjet process to deposit the second conductive material.
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Abstract
Methods of fabricating a printed circuit and printed circuits, including a method comprising: (a) depositing a conductive material to form a first conductive pathway upon a substrate; (b) depositing a dielectric material directly over at least a first portion of the conductive pathway utilizing an electrophotographic process; and (c) depositing a conductive material over at least a portion of the dielectric material to form a second conductive pathway, where the second conductive pathway is in electrical communication with the first conductive pathway.
19 Citations
16 Claims
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1. A method of fabricating a printed circuit comprising:
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depositing a first conductive material to form a first conductive pathway upon a substrate; depositing a dielectric material directly over at least a first portion of the conductive pathway utilizing an electrophotographic process; depositing a second conductive material over at least a portion of the dielectric material to form a second conductive pathway, where the second conductive pathway is in electrical communication with the first conductive pathway; wherein the act of depositing the dielectric material over at least the first portion of the conductive pathway includes selectively depositing the dielectric material to form at least one via leaving exposed a second portion of the first conductive pathway; and the act of depositing the second conductive material over at least a portion of the dielectric material to form the second conductive pathway upon the substrate includes utilizing an inkjet process to deposit the second conductive material. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A method of fabricating a printed circuit comprising:
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depositing a conductive material to form a first conductive pathway upon a substrate; depositing a dielectric material in contact with at least a first portion of the first conductive pathway; depositing a conductive material directly over the dielectric material to form a second conductive pathway in a stacked structure; wherein the act of depositing the dielectric material in contact with at least a first portion of the first conductive pathway includes the act of vertically electrically insulating the first portion of the conductive pathway from the second conductive pathway; the act of depositing the conductive material to form the first conductive pathway upon the substrate includes utilization of a first set of inkjet nozzles to deposit the first conductive pathway upon the substrate; and the act of depositing the conductive material to form the second conductive pathway upon the substrate includes utilization of a second set of inkjet nozzles to deposit the second conductive pathway upon the substrate. - View Dependent Claims (12, 13, 14, 15, 16)
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Specification