Package for semiconductor acceleration sensor
First Claim
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1. A semiconductor device comprising:
- a package having a cavity therein, the package having a bottom surface;
a rectangular board having a plurality of sides, wherein the rectangular board is a deformation relief member and has no integrated circuits therein, and wherein the rectangular board has an upper surface;
a chip, having a semiconductor element, which is mounted on the rectangular board, the chip having a bottom surface that is smaller in size than the upper surface of the rectangular board; and
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an adhesive portion which attaches the rectangular board to the bottom surface of the package so that the rectangular board is disposed in the cavity and spaced apart from the bottom surface of the package, the adhesive portion extending along the sides of the rectangular board but leaving a hollow space in a central region between the sides.
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Abstract
A semiconductor device comprises a package having a cavity in the interior thereof, a chip having a semiconductor element, a board having the chip fixed to a first region on the upper face thereof, and an adhesive portion formed in a second region on the bottom face of the board in order to fix the board to a first face of the cavity, the second region being a region on the board other than the region thereof underneath the first region.
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Citations
10 Claims
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1. A semiconductor device comprising:
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a package having a cavity therein, the package having a bottom surface; a rectangular board having a plurality of sides, wherein the rectangular board is a deformation relief member and has no integrated circuits therein, and wherein the rectangular board has an upper surface; a chip, having a semiconductor element, which is mounted on the rectangular board, the chip having a bottom surface that is smaller in size than the upper surface of the rectangular board; and
;an adhesive portion which attaches the rectangular board to the bottom surface of the package so that the rectangular board is disposed in the cavity and spaced apart from the bottom surface of the package, the adhesive portion extending along the sides of the rectangular board but leaving a hollow space in a central region between the sides. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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Specification