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Package for semiconductor acceleration sensor

  • US 7,615,835 B2
  • Filed: 06/29/2006
  • Issued: 11/10/2009
  • Est. Priority Date: 07/27/2005
  • Status: Expired due to Fees
First Claim
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1. A semiconductor device comprising:

  • a package having a cavity therein, the package having a bottom surface;

    a rectangular board having a plurality of sides, wherein the rectangular board is a deformation relief member and has no integrated circuits therein, and wherein the rectangular board has an upper surface;

    a chip, having a semiconductor element, which is mounted on the rectangular board, the chip having a bottom surface that is smaller in size than the upper surface of the rectangular board; and

    ;

    an adhesive portion which attaches the rectangular board to the bottom surface of the package so that the rectangular board is disposed in the cavity and spaced apart from the bottom surface of the package, the adhesive portion extending along the sides of the rectangular board but leaving a hollow space in a central region between the sides.

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