Probe card assembly and kit
First Claim
1. A probe card assembly comprising:
- a probe substrate comprising traces;
an interconnection substrate coupled to the probe substrate;
a plurality of probes disposed on and extending from a first face of the interconnection substrate; and
a flexible cable comprising a first end connected to the first face of the interconnection substrate and a second end connected to the probe substrate to provide electrical connections between the interconnection substrate and the probe substrate.
1 Assignment
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Accused Products
Abstract
In a probe card assembly, a series of probe elements can be arrayed on a silicon space transformer. The silicon space transformer can be fabricated with an array of primary contacts in a very tight pitch, comparable to the pitch of a semiconductor device. One preferred primary contact is a resilient spring contact. Conductive elements in the space transformer are routed to second contacts at a more relaxed pitch. In one preferred embodiment, the second contacts are suitable for directly attaching a ribbon cable, which in turn can be connected to provide selective connection to each primary contact. The silicon space transformer is mounted in a fixture that provides for resilient connection to a wafer or device to be tested. This fixture can be adjusted to planarize the primary contacts with the plane of a support probe card board.
89 Citations
15 Claims
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1. A probe card assembly comprising:
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a probe substrate comprising traces; an interconnection substrate coupled to the probe substrate; a plurality of probes disposed on and extending from a first face of the interconnection substrate; and a flexible cable comprising a first end connected to the first face of the interconnection substrate and a second end connected to the probe substrate to provide electrical connections between the interconnection substrate and the probe substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. A method of testing a wafer comprising:
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providing a probe card assembly comprising a probe substrate and a plurality of interconnection substrates coupled to the probe substrate, wherein a plurality of probes are disposed on a face of the interconnection substrates and electrically coupled to the probe substrate via a flexible cable coupled between the face of the interconnection substrate and the probe substrate; installing the probe card assembly into a tester to form electrical connections between test channels of the tester and ones of the plurality of probes; bringing the probe card assembly into contact with a wafer under test to form temporary electrical connections between the ones of the plurality of probes and terminals of the wafer under test; and testing the wafer by applying and receiving signals via the test channels. - View Dependent Claims (15)
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Specification