Probe station thermal chuck with shielding for capacitive current

• US 7,616,017 B2
• Filed: 10/17/2007
• Issued: 11/10/2009
• Est. Priority Date: 06/30/1999
• Status: Expired due to Fees

• Current Assignee: FormFactor Beaverton, Inc. (FormFactor Incorporated)
• Original Assignee: Cascade Microtech Incorporated (FormFactor Incorporated)
• Inventors: Dunklee, John L., Cowan, Clarence E., Tervo, Paul A.
• Primary Examiner(s): Nguyen; Ha Tran T
• Assistant Examiner(s): Chan; Emily Y
• Application Number:
  US11/975,221
• Publication Number:
  US 20080042680A1
• Time in Patent Office: 755 Days
• Field of Search: 324/760, 219/410, 219/521
• US Class Current: 324/750.13
• CPC Class Codes: G01R 1/18 Screening arrangements against electric or magnetic fields, e.g. against earth's field
• CPC Class Codes: G01R 31/2855 Environmental, reliability or burn-in testing
• CPC Class Codes: G01R 31/2862 Chambers or ovens; Tanks
• CPC Class Codes: G01R 31/2865 Holding devices, e.g. chucks; Handlers or transport devices having contacts G01R31/2863
• CPC Class Codes: G01R 31/2874 related to temperature
• CPC Class Codes: G01R 31/2879 related to electrical aspects, e.g. to voltage or current supply or stimuli or to electrical loads
• CPC Class Codes: H10N 10/00 Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects integrated devices or assemblies of multiple devices H10N19/00
• CPC Class Codes: H10N 10/17 characterised by the structure or configuration of the cell or thermocouple forming the device

Abstract

To reduce the time to make measurements and the noise in measurements obtained by probing a device supported on surface of a thermal chuck in a probe station, a conductive member is arranged to intercept current coupling the thermal unit of the chuck to the surface supporting the device. The conductive member is capacitively coupled to the thermal unit but free of direct electrical connection thereto.

Claims

1. A thermal chuck including a surface for supporting a device under test, said thermal chuck comprising:

(a) an electrically powered thermal unit for modifying a temperature of said surface; and

(b) a first conductive member substantially enclosing said thermal unit and including a portion separating said thermal unit from said surface.

2. The thermal chuck of claim 1 further comprising a conductive connection of said first conductive member to a ground potential.

3. The thermal chuck of claim 1 further comprising conductive connection of a ground potential to said first conductive member and to a controller supplying power to said thermal unit.

4. The thermal chuck of claim 1 further comprising a second conductive member substantially encircling a power cable conducting electric power to said thermal unit, said second conductive member conductively connected to a ground potential.

5. The thermal chuck of claim 1 further comprising:

(a) a controller supplying electric power to said thermal unit; and

(b) a second conductive member substantially encircling a portion of a power cable conducting electric power from said controller to said thermal unit, said controller, said first conductor and said second conductor conductively connected to a ground potential.

6. The thermal chuck of claim 5 further comprising a third conductive member substantially encircling a portion of said second conductive member and conductively connected to another ground potential.

7. The thermal chuck of claim 6 wherein said another ground potential comprises a ground potential connected to an enclosure comprising portions defining a chamber in which said thermal chuck is located.

8. The thermal chuck of claim 6 wherein said another ground potential comprises a ground potential for an instrument for measuring a characteristic of said device under test supported on said surface.

9. A method of reducing a time for making a probing measurement of a device under test supported on a surface of a chuck, said chuck comprising a dielectric and a thermal unit for modifying a temperature of said surface, said method comprising:

(a) substantially enclosing said thermal unit with a conductive member, said conductive member including a surface interposed between said thermal unit and said surface of said chuck; and

(b) conductively connecting said conductive member to a controller supplying electric power to said thermal unit.

10. The method of reducing a time for making a probing measurement of claim 9 further comprising the step of grounding said conductive member and said controller at a common ground potential.

11. The method of reducing a time for making a probing measurement of claim 9 further comprising the step of substantially encircling a power conductor conductively connecting said thermal unit and said controller with a second conductive member conductively connected to said controller.

12. The method of reducing a time for making a probing measurement of claim 11 further comprising the step of grounding said controller, said first conductive member and said second conductive member at a common ground potential.

13. The method of reducing a time for making a probing measurement of claim 11 further comprising the step of substantially encircling said second conductive member with a third conductive member conductively connected to an enclosure comprising a portion defining a chamber in which said chuck is located.

14. The method of reducing a time for making a probing measurement of claim 13 further comprising the step of connecting a probe measurement instrument and said enclosure to a common ground potential.

15. A probe station comprising:

(a) a thermal chuck including a surface for supporting a device under test and an electrically powered thermal unit for modifying a temperature of said surface; and

(b) a conductive member substantially enclosing at least one of said surface and said thermal unit and including a portion separating said surface and said thermal unit.

16. The probe station of claim 15 further comprising a conductive connection between said conductive member and a ground potential.

17. The probe station of claim 16 wherein a controller supply electric power is also connected to said ground potential.

18. The probe station of claim 16 wherein an instrument for measuring a characteristic of said device under test is also connected to said ground potential.

19. The probe station of claim 15 wherein said conductive member substantially encircles a portion of an electric power conductor connected to said thermal unit.