Connecting part of conductor pattern and conductor patterns-connected structure

• US 7,616,171 B2
• Filed: 09/19/2007
• Issued: 11/10/2009
• Est. Priority Date: 09/20/2006
• Status: Active Grant

• Current Assignee: Lintec Corporation
• Original Assignee: Lintec Corporation
• Inventors: Katakura, Katumi, Matsushita, Taiga, Matsuura, Katsuyoshi
• Primary Examiner(s): Le; HoangAnh T
• Application Number:
  US11/857,660
• Publication Number:
  US 20080068272A1
• Time in Patent Office: 783 Days
• Field of Search: 343/700.MS, 343/895, 343/741, 343/742, 343/906
• US Class Current: 343/895
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/0775 arrangements for connecting the integrated circuit to the antenna
• CPC Class Codes: H05K 2201/09745 Recess in conductor, e.g. in pad or in metallic substrate
• CPC Class Codes: H05K 3/4664 Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders H05K3/4647 takes precedence
• CPC Class Codes: H05K 3/4685 Manufacturing of cross-over conductors

Abstract

The present invention discloses a connecting part of conductor pattern, which is connected to a conductor pattern formed on a surface of an insulating substrate and which has at least one dent on the surface, and a conductor patterns-connected structure obtained by electrically connecting the connecting parts of conductor patterns, mentioned above, to each other with a conductive material which fills the inside of the dent of each connecting part and further is adhered to each connecting part.

Claims

1. A conductor patterns-connected structure obtained by electrically connecting a first connecting part of a first conductor pattern to a second connecting part of a second conductor pattern, wherein the first connecting part of the first conductor pattern is connected to the first conductor pattern formed on a surface of an insulating substrate, wherein the first connecting part of the first conductor pattern has at least one dent on the surface of the insulating substrate, wherein the at least one dent is not passing through the insulating substrate, wherein the first connecting part of the first conductor pattern is connected to the second connecting part of the second conductor pattern with a conductive material which fills the inside of the dent of the first connecting part and further is adhered to each connecting part.

2. An antenna circuit having an insulating substrate and a surface circuit formed thereon, wherein the surface circuit comprising a plane coil circuit and at least one pair of opposed electrodes connected to the plane coil circuit, wherein the antenna circuit comprises a conductor patterns-connected structure obtained by electrically connecting a first connecting part of a first conductor pattern to a second connecting part of a second conductor pattern, wherein the first connecting part of the first conductor pattern is connected to the first conductor pattern formed on a surface of the insulating substrate, wherein the first connecting part of the first conductor pattern has at least one dent on the surface of the insulating substrate, wherein the at least one dent is not passing through the insulating substrate, wherein the first connecting part of the first conductor pattern is connected to the second connecting part of the second conductor pattern with a conductive material which fills the inside of the dent of the first connecting part and further is adhered to each connecting part.

3. An IC inlet comprising:

an antenna circuit having an insulating substrate and a surface circuit formed thereon, wherein the surface circuit comprising a plane coil circuit and at least one pair of opposed electrodes connected to the plane coil circuit, wherein the antenna circuit comprises a conductor patterns-connected structure obtained by electrically connecting a first connecting part of a first conductor pattern to a second connecting part of a second conductor pattern, wherein the first connecting part of the first conductor pattern is connected to the first conductor pattern formed on a surface of the insulating substrate, wherein the first connecting part of the first conductor pattern has at least one dent on the surface of the insulating substrate, wherein the at least one dent is not passing through the insulating substrate, wherein the first connecting part of the first conductor pattern is connected to the second connecting part of the second conductor pattern with a conductive material which fills the inside of the dent of the first connecting part and further is adhered to each connecting part; and

an IC chip.

4. An IC tag comprising:

an IC inlet having an IC chip and an antenna circuit, wherein the antenna circuit has an insulating substrate and a surface circuit formed thereon, wherein the surface circuit comprising a plane coil circuit and at least one pair of opposed electrodes connected to the plane coil circuit, wherein the antenna circuit comprises a conductor patterns-connected structure obtained by electrically connecting a first connecting part of a first conductor pattern to a second connecting part of a second conductor pattern, wherein the first connecting part of the first conductor pattern is connected to the first conductor pattern formed on a surface of the insulating substrate, wherein the first connecting part of the first conductor pattern has at least one dent on the surface of the insulating substrate, wherein the at least one dent is not passing through the insulating substrate, wherein the first connecting part of the first conductor pattern is connected to the second connecting part of the second conductor pattern with a conductive material which fills the inside of the dent of the first connecting part and further is adhered to each connecting part.