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Film stack for manufacturing micro-electromechanical systems (MEMS) devices

  • US 7,616,369 B2
  • Filed: 03/31/2006
  • Issued: 11/10/2009
  • Est. Priority Date: 06/24/2003
  • Status: Expired due to Fees
First Claim
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1. A film stack for the production of MEMS devices, the film stack comprising:

  • a substrate;

    a first layer formed over the substrate, said first layer comprising a conductive material;

    ;

    a second layer formed over the first layer, said second layer comprising an insulator material; and

    a third layer formed on the second layer, said third layer comprising a sacrificial material, wherein said third layer is formed prior to processing of said first and second layers which takes place after the deposition of said first and second layers.

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