Method of forming a coating on a surface of a substrate

• US 7,618,684 B2
• Filed: 08/24/2007
• Issued: 11/17/2009
• Est. Priority Date: 12/12/2002
• Status: Active Grant

• Current Assignee: Innovatech, LLC
• Original Assignee: Innovatech, LLC
• Inventors: Nesbitt, Bruce
• Primary Examiner(s): PARKER, FREDERICK JOHN
• Application Number:
  US11/844,708
• Publication Number:
  US 20080032060A1
• Time in Patent Office: 816 Days
• Field of Search: None
• US Class Current: 427/470
• CPC Class Codes: A47J 36/025 Vessels with non-stick features, e.g. coatings
• CPC Class Codes: A61B 18/14 Probes or electrodes therefor
• CPC Class Codes: A61B 18/1402 Probes for open surgery
• CPC Class Codes: A61B 2018/0013 non-sticking
• CPC Class Codes: A61B 2018/00148 with metal
• CPC Class Codes: A61L 2300/104 Silver, e.g. silver sulfadiazine
• CPC Class Codes: A61L 2300/404 Biocides, antimicrobial agents, antiseptic agents
• CPC Class Codes: A61L 2420/02 Methods for coating medical devices
• CPC Class Codes: A61L 2420/08 Coatings comprising two or more layers
• CPC Class Codes: A61L 31/10 Macromolecular materials
• CPC Class Codes: A61L 31/16 Biologically active materials, e.g. therapeutic substances A61L31/047 takes precedence
• CPC Class Codes: B05D 2601/20 used for non-pigmentation effect
• CPC Class Codes: B05D 3/0281 with induction heating
• CPC Class Codes: B05D 3/20 by magnetic fields
• CPC Class Codes: B05D 5/00 Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
• CPC Class Codes: B05D 5/02 to obtain a matt or rough surface
• CPC Class Codes: B05D 5/06 to obtain multicolour or other optical effects B05D5/02 takes precedence
• CPC Class Codes: B05D 5/08 to obtain an anti-friction or anti-adhesive surface rendering particulate materials free-flowing in general, e.g. making them hydrophobic B01J2/30
• CPC Class Codes: B05D 5/083 involving the use of fluoropolymers
• CPC Class Codes: B05D 7/52 Two layers
• CPC Class Codes: B05D 7/54 : No clear coat specified
• CPC Class Codes: B65G 2249/02 : Controlled or contamination-free environments or clean space conditions
• CPC Class Codes: B65G 49/064 : in a horizontal position B65G49/066 takes precedence
• CPC Class Codes: C03B 35/14 : Transporting hot glass sheets or ribbons, e.g. by heat-resistant conveyor belts or bands
• CPC Class Codes: F16C 33/201 : Composition of the plastic
• CPC Class Codes: Y10T 428/24372 : Particulate matter
• CPC Class Codes: Y10T 428/2438 : Coated
• CPC Class Codes: Y10T 428/24413 : Metal or metal compound
• CPC Class Codes: Y10T 428/254 : Polymeric or resinous material
• CPC Class Codes: Y10T 428/31725 : Of polyamide
• CPC Class Codes: Y10T 428/32 : Composite [nonstructural laminate] of inorganic material having metal-compound-containing layer and having defined magnetic layer

Abstract

A reinforcing underlayment including dry uniform particles evenly applied to a wet bonding material layer on a surface of a substrate. The substrate, including the layers, is then cured to harden the one or more of the layers. A final coating or topcoat is applied to the cured surface of the substrate. The dry particles are evenly distributed onto the bonding material layer creating a uniform surface for subsequent coatings. The dry particles increase the strength of the liquid coatings increasing solid particle density within the coating system and thereby imparting properties not available for the liquid coatings. The present invention enables a user to easily introduce very heavy, dense, strong particles into a liquid coating and allows the user to apply very dense, heavy particles into and onto a wet bonding material layer followed by a subsequent wet topcoat layer which is cured as one contiguous material with reinforcement and underlayment strengthening coming from the added, dry particles.

Claims

1. A method of forming a non-stick, wear-resistance coating on a surface of a substrate, said method comprising:

(a) applying an electrically or electrostatically grounded non-stick wet bonding material to the surface of the substrate;

(b) coating the bonding material with a layer of substantially uniform anti-microbial particles, wherein the anti-microbial particles have an electrical or electrostatic charge opposite the electrical charge of the bonding material; and

(c) at least partially curing the wet bonding material and the substantially uniform anti-microbial particles, such that a plurality of the anti-microbial particles are substantially submerged within the cured bonding material and at least part of said anti-microbial particles protrude from the cured bonding material.

2. The method of claim 1, wherein the anti-microbial particles include silver compounds.

3. The method of claim 1, which includes evenly coating the bonding material with the layer of substantially uniform anti-microbial particles.

4. The method of claim 1, which includes applying a topcoating to the bonding material and anti-microbial particles.

5. A method of forming a wear-resistance coating on a surface of a substrate, said method comprising:

(a) applying an electrically or electrostatically grounded wet bonding material to the surface of the substrate;

(b) coating the bonding material with a layer of substantially uniform anti-microbial particles, wherein the anti-microbial particles have an electrical or electrostatic charge opposite the electrical charge of the bonding material; and

(c) shrinking the wet bonding material by at least partially curing the wet bonding material and the substantially uniform anti-microbial particles such that a plurality of the anti-microbial particles are substantially submerged within the cured bonding material and at least part of said anti-microbial particles protrude from the cured bonding material.

6. The method of claim 5, which includes applying a topcoating to the bonding material and anti-microbial particles.

7. The method of claim 5, wherein the anti-microbial particles include silver compounds.

8. The method of claim 5, which includes evenly coating the bonding material with the layer of substantially uniform anti-microbial particles.

9. A method of forming a non-stick, wear-resistance coating on a surface of a substrate, said method comprising:

(a) applying an electrically or electrostatically grounded non-stick wet bonding material to the surface of the substrate;

(b) coating the bonding material with a layer of substantially uniform dry particles, wherein the dry particles have an electrical or electrostatic charge opposite the electrical charge of the bonding material; and

(c) at least partially curing the wet bonding material and the substantially uniform dry particles, such that a plurality of the dry particles are substantially submerged within the cured bonding material and at least part of said dry particles protrude from the cured bonding material.

10. The method of claim 9, which includes applying a topcoating to the bonding material and dry particles.

11. The method of claim 9, which includes evenly coating the bonding material with the layer of substantially uniform dry particles.

12. A method of forming a non-stick coating on a surface of a substrate, said method comprising:

(a) applying an electrically or electrostatically grounded non-stick wet bonding material to the surface of the substrate;

(b) coating the bonding material with a layer of substantially uniform dry particles, wherein the dry particles have an electrical or electrostatic charge opposite the electrical charge of the bonding material; and

(c) at least partially curing the wet bonding material and the substantially uniform dry particles, such that a plurality of the dry particles are substantially submerged within the cured bonding material and at least part of said dry particles protrude from the cured bonding material.

13. The method of claim 12, which includes applying a topcoating to the bonding material and dry particles.

14. The method of claim 12, which includes evenly coating the bonding material with the layer of substantially uniform dry particles.

15. A method of forming a wear-resistance coating on a surface of a substrate, said method comprising:

(a) applying an electrically or electrostatically grounded wear-resistance wet bonding material to the surface of the substrate;

(b) coating the bonding material with a layer of substantially uniform dry particles, wherein the dry particles have an electrical or electrostatic charge opposite the electrical charge of the bonding material; and

(c) at least partially curing the wet bonding material and the substantially uniform dry particles, such that a plurality of the dry particles are substantially submerged within the cured bonding material and at least part of said dry particles protrude from the cured bonding material.

16. The method of claim 15, which includes applying a topcoating to the bonding material and dry particles.

17. The method of claim 15, which includes evenly coating the bonding material with the layer of substantially uniform dry particles.

18. A method of forming a non-stick, wear-resistance coating on a surface of a substrate, said method comprising:

(a) applying an electrically or electrostatically grounded non-stick wet bonding material to the surface of the substrate;

(b) coating the bonding material with at least two different packing densities of substantially uniform dry particles, wherein the dry particles have an electrical or electrostatic charge opposite the electrical charge of the bonding material; and

(c) at least partially curing the wet bonding material and the substantially uniform dry particles, such that a plurality of the dry particles are substantially submerged within the cured bonding material and at least part of said dry particles protrude from the cured bonding material.

19. A method of forming a non-stick, wear-resistance coating on a surface of a substrate, said method comprising:

(a) applying an electrically or electrostatically grounded non-stick wet bonding material to the surface of the substrate;

(b) coating the bonding material with a single layer of substantially uniform dry particles at different spatial orientations, wherein the dry particles have an electrical or electrostatic charge opposite the electrical charge of the bonding material; and

(c) at least partially curing the wet bonding material and the substantially uniform dry particles, such that a plurality of the dry particles are substantially submerged within the cured bonding material and at least part of said dry particles protrude from the cured bonding material.

20. The method of claim 19, which includes applying a topcoating to the bonding material and dry particles.

21. The method of claim 19, which includes evenly coating the bonding material with the layer of substantially uniform dry particles.

22. A method of forming an anti-microbial coating on a surface of a substrate, said method comprising:

(a) applying a non-stick wet bonding material to the surface of the substrate;

(b) coating the wet bonding material with a layer of substantially uniform copper particles; and

(c) at least partially curing the wet bonding material and the substantially uniform copper particles, such that a plurality of the copper particles are substantially submerged within the cured bonding material and at least part of said copper particles protrude from the cured bonding material.

23. The method of claim 22, which includes applying an electrically or electrostatically grounded non-stick wet bonding material to the surface of the substrate.

24. The method of claim 23, which includes causing the copper particles to have an electrical or electrostatic charge opposite the electrical charge of the wet bonding material.

25. The method of claim 22, which includes causing a portion of each of a plurality of the copper particles to protrude from a top coating.

26. The method of claim 22, which includes grit-blasting at least a portion of the applied wet bonding material with copper particles.

27. The method of claim 22, which includes at least partially smoothing out the copper particles which protrude from the cured bonding material.

28. The method of claim 22, which includes repeating (a) to (c) until a desired thickness is achieved.

29. The method of claim 22, which includes at least partially applying a top coating to the bonding material and the copper particles such that a portion of each of a plurality of the copper particles protrude from the wet bonding material.