Semiconductor substrate having reference semiconductor chip and method of assembling semiconductor chip using the same
First Claim
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1. A method of assembling semiconductor chips, comprising:
- providing a semiconductor substrate having a plurality of semiconductor chips;
making an identification mark on a reference semiconductor chip among the semiconductor chips; and
aligning the semiconductor substrate referring to the reference semiconductor chip and performing an electrical die sorting test on the semiconductor chips after making the identification mark on the reference semiconductor chip.
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Abstract
A semiconductor substrate having a reference semiconductor chip and a method of assembling semiconductor chips using the same are provided. According to the method, a semiconductor substrate having a plurality of semiconductor chips is provided. An identification mark is made on a reference semiconductor chip among the semiconductor chips. The semiconductor substrate is aligned with reference to the reference semiconductor chip, so that an electrical die sorting test can be performed on the semiconductor chips on the semiconductor substrate.
58 Citations
14 Claims
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1. A method of assembling semiconductor chips, comprising:
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providing a semiconductor substrate having a plurality of semiconductor chips; making an identification mark on a reference semiconductor chip among the semiconductor chips; and aligning the semiconductor substrate referring to the reference semiconductor chip and performing an electrical die sorting test on the semiconductor chips after making the identification mark on the reference semiconductor chip. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A method of assembling semiconductor chips, comprising:
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providing a semiconductor substrate having a plurality of semiconductor chips; making an identification mark on a reference semiconductor chip among the semiconductor chips; aligning the semiconductor substrate referring to the reference semiconductor chip and performing an electrical die sorting test on the semiconductor chips; and physically separating the semiconductor chips using the test results after the performing of the electrical die sorting test, wherein the separating of the semiconductor chips comprises sorting the semiconductor substrate referring to the reference semiconductor chip.
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13. A method of assembling semiconductor chips, comprising:
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providing a semiconductor substrate having a plurality of semiconductor chips; making an identification mark on a reference semiconductor chip among the semiconductor chips; aligning the semiconductor substrate referring to the reference semiconductor chip and performing an electrical die sorting test on the semiconductor chips; physically separating the semiconductor chips using the test results after the performing of the electrical die sorting test; and making ink marks on the semiconductor chips using the test results before the separating of the semiconductor chips. - View Dependent Claims (14)
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Specification