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Semiconductor substrate having reference semiconductor chip and method of assembling semiconductor chip using the same

  • US 7,618,832 B2
  • Filed: 01/20/2006
  • Issued: 11/17/2009
  • Est. Priority Date: 01/22/2005
  • Status: Expired due to Fees
First Claim
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1. A method of assembling semiconductor chips, comprising:

  • providing a semiconductor substrate having a plurality of semiconductor chips;

    making an identification mark on a reference semiconductor chip among the semiconductor chips; and

    aligning the semiconductor substrate referring to the reference semiconductor chip and performing an electrical die sorting test on the semiconductor chips after making the identification mark on the reference semiconductor chip.

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