Infrared receiving module

• US 7,619,221 B2
• Filed: 07/07/2008
• Issued: 11/17/2009
• Est. Priority Date: 07/05/2007
• Status: Active Grant

• Current Assignee: Everlight Electronics Company Limited
• Original Assignee: Everlight Electronics Company Limited
• Inventors: Lin, Hui-Chin, Liang, Chun-Chih
• Primary Examiner(s): Porta; David P
• Assistant Examiner(s): Eley; Jessica L
• Application Number:
  US12/168,526
• Publication Number:
  US 20090008557A1
• Time in Patent Office: 498 Days
• Field of Search: 250/338.4
• US Class Current: 250/338.4
• CPC Class Codes: G01J 5/02 Constructional details
• CPC Class Codes: G01J 5/022 Monolithic
• CPC Class Codes: G01J 5/024 Special manufacturing steps or sacrificial layers or layer structures
• CPC Class Codes: G01J 5/04 Casings
• CPC Class Codes: G01J 5/045 Sealings; Vacuum enclosures; Encapsulated packages; Wafer bonding structures; Getter arrangements getter arrangements per se H01L23/26 and H01L21/3221
• CPC Class Codes: G01J 5/048 Protective parts
• CPC Class Codes: G01J 5/08 Optical arrangements
• CPC Class Codes: G01J 5/0875 Windows; Arrangements for fastening thereof
• CPC Class Codes: G01J 5/0884 Monolithic
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48257 connecting the wire to a die pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding

Abstract

An infrared receiving module is disclosed. The infrared receiving module including a first strip element, a second strip element, an infrared receiver disposed on the second strip element, and a resin wrapping the first strip element and the second strip element. The first strip element has a receiving window. The infrared receiver on the second strip element is under the receiving window.

Claims

1. An infrared receiving module comprising:

a first strip element, having a shielding portion and a ground pin, wherein a receiving window is formed in the shielding portion;

a second strip element, having a load area and a ground pin, wherein the first strip element and the second strip element are physically disconnected;

an infrared receiver exposed on the load area of the second strip element, wherein the infrared receiver is exposed by the receiving window; and

a resin package encapsulating the shielding portion of the first strip element and the load area of the second strip element and exposing a portion of the ground pin of the first strip element and a portion of the ground pin of the second strip element.

2. The infrared receiving module of claim 1, wherein the material of the first strip element and the second strip element is a metal.

3. The infrared receiving module of claim 2, wherein the material of the first strip element and the second strip element is a copper or an iron.

4. The infrared receiving module of claim 1, wherein the infrared receiver is a photodiode or a phototransistor.

5. The infrared receiving module of claim 1, wherein the resin package is an epoxy resin.

6. The infrared receiving module of claim 1, further comprising a driving chip disposed on the load area of the second strip element, wherein the infrared receiver and the driving chip have a plurality of bonding pads facing the first strip element respectively.

7. The infrared receiving module of claim 6, further comprising a silver glue glued on the second strip element for securing the infrared receiver and the driving chip on the load area of the second strip element.

8. The infrared receiving module of claim 7, further comprising a Vout pin and a Vcc pin partially wrapped in the resin package, wherein the infrared receiving module further comprises a plurality of bonding wires for connecting the bonding pads to the Vout pin and the Vcc pin.

9. The infrared receiving module of claim 1, wherein a surface of the resin package disposed over the receiving window is substantially parallel to the shielding portion.