Electronic device including an inductor
First Claim
Patent Images
1. An electronic device comprising:
- a substrate;
an interconnect level overlying the substrate, wherein the interconnect level comprises a first interconnect and a second interconnect;
a shock-absorbing layer overlying the interconnect level, wherein the shock-absorbing layer includes a first opening over the first interconnect and a second opening over the second interconnect; and
a first inductor including conductive traces and at least one looped wire, wherein;
the conductive traces include a first conductive trace and a second conductive trace;
a first via pad portion of the first conductive trace extends to the first opening of the shock-absorbing layer and is electrically connected to the first interconnect, and a primary pad portion of the first conductive trace overlies the shock-absorbing layer;
a secondary pad portion of the second conductive trace overlies the shock-absorbing layer, and a via portion of the second conductive trace extends to the second opening of the shock-absorbing layer and is electrically connected to the second interconnect;
a first looped wire of the at least one wire is wire bonded to the primary pad portion of the first conductive trace; and
the first looped wire or a second looped wire of the at least one wire is wire bonded to the secondary pad portion of the second conductive trace.
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Abstract
An electronic device can include an inductor overlying a shock-absorbing layer. In one aspect, the electronic device can include a substrate, an interconnect level overlying the substrate, and the shock-absorbing layer overlying the interconnect level. The inductor can include conductive traces and looped wires. The conductive traces can be attached to the conductive traces over the shock-absorbing layer. In another aspect, a process can be used to form the electronic device including the inductor. In still another aspect, an electronic device can a toroidal-shaped inductor that includes linear inductor segments that are connected in series.
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Citations
20 Claims
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1. An electronic device comprising:
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a substrate; an interconnect level overlying the substrate, wherein the interconnect level comprises a first interconnect and a second interconnect; a shock-absorbing layer overlying the interconnect level, wherein the shock-absorbing layer includes a first opening over the first interconnect and a second opening over the second interconnect; and a first inductor including conductive traces and at least one looped wire, wherein; the conductive traces include a first conductive trace and a second conductive trace; a first via pad portion of the first conductive trace extends to the first opening of the shock-absorbing layer and is electrically connected to the first interconnect, and a primary pad portion of the first conductive trace overlies the shock-absorbing layer; a secondary pad portion of the second conductive trace overlies the shock-absorbing layer, and a via portion of the second conductive trace extends to the second opening of the shock-absorbing layer and is electrically connected to the second interconnect; a first looped wire of the at least one wire is wire bonded to the primary pad portion of the first conductive trace; and the first looped wire or a second looped wire of the at least one wire is wire bonded to the secondary pad portion of the second conductive trace. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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Specification