Method and apparatus for impasse detection and resolution

• US 7,620,470 B1
• Filed: 09/30/2005
• Issued: 11/17/2009
• Est. Priority Date: 09/30/2005
• Status: Active Grant

• Current Assignee: Advanced Micro Devices, Inc.
• Original Assignee: Advanced Micro Devices, Inc.
• Inventors: Nicksic, Cabe W., Hickey, Susan, Stewart, Edward C., Grover, Jason A.
• Primary Examiner(s): Shechtman, Sean P
• Application Number:
  US11/241,023
• Time in Patent Office: 1,509 Days
• Field of Search: 700/11, 700/28, 700/95, 700/96, 700/97, 700 99-110, 700112-116, 700/121, 700/216, 700/222, 414/935, 414/937, 414/939, 414/940, 438/5, 438/7, 438/10, 438/14, 702/81, 702/82, 702/84
• US Class Current: 700/100
• CPC Class Codes: G05B 19/4184 characterised by fault tolerance, reliability of production system
• CPC Class Codes: G05B 19/41865 characterised by job scheduling, process planning, material flow
• CPC Class Codes: G05B 2219/31455 Monitor process status
• CPC Class Codes: G05B 2219/32243 Rerouting parts
• CPC Class Codes: G05B 2219/32297 Adaptive scheduling, feedback of actual proces progress to adapt schedule
• CPC Class Codes: G05B 2219/37224 Inspect wafer
• CPC Class Codes: Y02P 90/02 Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Abstract

A method, apparatus and a system, for provided for performing an automated process flow adjustment. A semiconductor wafer is processed based upon a routing plan and a predetermined schedule. A fault detection relating to the processing of the semiconductor wafer is performed. Dynamically modifying the predetermined routing plan or the predetermined schedule based upon the fault detection. A predetermined process material delivery plan is dynamically modified based upon the modifying of the routing plan or modifying of the predetermined schedule.

Claims

1. A method, comprising:

processing a workpiece based upon a routing plan and a predetermined schedule;

performing a fault detection relating to said processing of said workpiece;

modifying dynamically at least one of said predetermined routing plan and said predetermined schedule based upon said fault detection; and

modifying dynamically a predetermined process material delivery plan based upon at least one of said modifying of said routing plan and modifying of said predetermined schedule.

2. The method of claim 1, wherein processing said workpiece further comprises processing a semiconductor wafer.

3. The method of claim 1, further comprising processing at least one subsequent workpiece.

4. The method of claim 1, wherein routing said workpiece based upon a predetermined routing plan comprises routing said workpiece to a plurality of processing tools.

5. The method of claim 1, wherein performing said fault detection relating to said processing of said workpiece comprises performing at least one of a metrology data analysis, a tool state data analysis, and a statistical process control analysis.

6. The method of claim 5, wherein performing said tool state data analysis comprises correlating a process result to at least one of a pressure data, a humidity data, a temperature data, and a gas flow rate data relating to a chamber of a processing tool.

7. The method of claim 1, wherein performing said fault detection comprises detecting a malfunction relating to the operation of at least one chamber in a processing tool.

8. The method of claim 1, wherein modifying dynamically said predetermined process material delivery plan comprises modifying a predetermined route or schedule relating to the operation of an automated material handling unit.

9. The method of claim 8, wherein modifying said predetermined route or schedule of the operation of an automated material handling unit comprises determining the availability of a processing tool, a metrology tool, and a process material.

10. The method of claim 8, wherein modifying said predetermined route or schedule of the operation of an automated material handling unit comprises performing a load balancing process to provide for balance of process material throughout a fab.

11. A method, comprising:

monitoring a process flow relating to processing a workpiece;

detecting a change in said process flow;

performing an automated modification of a process material delivery process for delivery of material used in processing said workpiece based upon said change in the process flow to provide for balance of process material throughout a fab;

wherein performing said automated modification of said process material delivery process comprises performing a load balancing process to provide for balance of process material throughout a fab.

12. The method of claim 11, further comprising processing at least one subsequent workpiece.

13. A method, comprising:

determining a routing and a schedule for processing a first workpiece and a second workpiece;

processing said first workpiece based upon said routing and said schedule;

acquiring at least one of a metrology data and a tool state data relating to said processing of said first workpiece;

determining whether a process error has occurred based upon at least one of said metrology data and said tool state data;

modifying at least one of said routing and said schedule relating to said second workpiece based upon a determination that said process error has occurred; and

performing an automated modification of a process material delivery process for processing said second workpiece based upon said modifying at least one of said routing and said schedule;

wherein performing said automated modification of said process material delivery process comprises performing a load balancing process to provide for balance of process material throughout a fab.

14. The method of claim 13, further comprising processing said second workpiece.

15. An apparatus, comprising:

means for processing a workpiece based upon a routing plan and a predetermined schedule;

means for performing a fault detection relating to said processing of said workpiece;

means for modifying dynamically at least one of said predetermined routing plan and said predetermined schedule based upon said fault detection; and

means for modifying dynamically a predetermined process material delivery plan based upon at least one of said modifying of said routing plan and modifying of said predetermined schedule.

16. A computer readable program storage device encoded with instructions that, when executed by a computer, performs a method, comprising:

processing a workpiece based upon a routing plan and a predetermined schedule;

performing a fault detection relating to said processing of said workpiece;

modifying dynamically at least one of said predetermined routing plan and said predetermined schedule based upon said fault detection; and

modifying dynamically a predetermined process material delivery plan based upon at least one of said modifying of said routing plan and modifying of said predetermined schedule.

17. The computer readable program storage device encoded with instructions that, when executed by a computer, performs the method of claim 16, further comprising processing at least one subsequent workpiece.