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Method and apparatus for strain monitoring of printed circuit board assemblies

  • US 7,621,190 B2
  • Filed: 02/21/2006
  • Issued: 11/24/2009
  • Est. Priority Date: 02/21/2006
  • Status: Active Grant
First Claim
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1. A printed circuit board assembly comprising:

  • a circuit board substrate;

    a plurality of mounting points for receiving electrical components carried on the circuit board substrate;

    a plurality of electrically conductive pathways carried on the circuit board substrate between mounting points; and

    at least one strain detector mounted on the circuit board substrate, the strain detector formed of a non-ductile material;

    wherein the strain detector has a portion composed of alumina to provide desired failure of the alumina at an appropriate strain level.

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