LED lighting units and assemblies with edge connectors

• US 7,621,655 B2
• Filed: 11/16/2006
• Issued: 11/24/2009
• Est. Priority Date: 11/18/2005
• Status: Active Grant

• Current Assignee: Creeled Incorporated
• Original Assignee: CREE Incorporated (Wolfspeed, Inc.)
• Inventors: Roberts, John K., Sims, Paul E.
• Primary Examiner(s): Truong; Bao Q
• Assistant Examiner(s): ALLEN, DANIELLE NICOLE
• Application Number:
  US11/600,642
• Publication Number:
  US 20070115682A1
• Time in Patent Office: 1,104 Days
• Field of Search: None
• US Class Current: 362/249.02
• CPC Class Codes: G02F 1/133603 with LEDs
• CPC Class Codes: H01R 12/721 cooperating directly with the edge of the rigid printed circuits
• CPC Class Codes: H01R 13/432 by stamped-out resilient tongue snapping behind shoulder in base or case
• CPC Class Codes: H01R 13/6275 Latching arms not integral with the housing H01R13/6276, H01R13/6277, H01R13/6278 take precedence
• CPC Class Codes: H01R 13/6658 on printed circuit board H01R13/6666 - H01R13/6691 take precedence
• CPC Class Codes: Y10S 362/80 Light emitting diode

Abstract

An LED light unit includes a tile, a plurality of discrete LED light sources, and an edge connector. The LED light sources are on and dispersed across a major surface of the tile and are electrically connected to electrical pads along an edge region of the tile. The edge connector includes a plurality of contracts that are connected to a plurality of wires extending away from the edge connector, and is configured to releasably connect to an edge of the tile so that the contacts directly connect to the pads and electrically connect the wires of the edge connector to the LED light sources. An LED lighting assembly includes a plurality of the discrete tiles mounted to a plurality of bars, and a plurality of edge connectors that are each connected to an end one of the tiles along different ones of the bars.

Claims

1. An LED light unit comprising:

a tile;

a plurality of discrete LED light sources that are on and dispersed across a major surface of the tile and are electrically connected to electrical pads along an edge region of the tile; and

an edge connector comprising a plurality of contacts that are connected to a plurality of flexible wires extending away from the edge connector, the edge connector is configured to releasably connect to an edge of the tile so that the contacts directly connect to the pads and electrically connect the wires of the edge connector to the LED light sources, wherein the edge connector comprises a body with a plurality of recessed channels defined therein, each of the recessed channels being configured to guide a portion of one of the flexible wires away from the tile, wherein each one of the LED light sources comprises at least first and second LED chips, the first and second LED chips of the LED light sources are respective electrically connected to first and second tile pads, and the edge connector is configured to respective electrically connect first and second pairs of the plurality of wires to the first and second LED chips via the first and second tile pads.

2. The LED light unit of claim 1, wherein each of the recessed channels is configured to releasably connect to a portion of one of the flexible wires and to guide the connected portion of the flexible wire at a non-zero angle away from a plane of the major surface of the tile.

3. The LED light unit of claim 2, wherein each of the recessed channels is configured to guide the connected portion of the flexible wire at about a 90°

angle away from the plane of the major surface of the tile.

4. The LED light unit of claim 1, wherein:

each one of the LED light sources comprises an encapsulant that encloses the LED chips; and

a height of the edge connector above the major surface of the tile is no more than a height of the encapsulants of the LED light sources above the major surface of the tile.

5. An LED light unit comprising:

a tile;

a plurality of discrete LED light sources that are on and dispersed across a major surface of the tile and are electrically connected to electrical pads along an edge region of the tile; and

an edge connector comprising a plurality of contacts that are connected to a plurality of wires extending away from the edge connector, the edge connector configured to releasably connect to an edge of the tile so that the contacts directly connect to the pads and electrically connect the wires of the edge connector to the LED light sources, wherein the edge connector comprises a body with a cavity having an inner surface, and a locking mechanism that comprises a flexure lever that extends into the cavity and releasably locks onto an opening in a major surface of the tile while the edge connector contacts are directly connected to the tile pads and electrically connect the wires of the edge connector to the LED light sources.

6. The LED light unit of claim 5, further comprising a reflector panel comprising a material with high light reflectivity and defining apertures therein, and wherein:

the reflector panel extends across the major surface of the tile and the apertures are aligned with the plurality of LED light sources; and

a height of the edge connector above the major surface of the tile is no more than a height of an outer major surface of the reflector panel above the major surface of the tile.

7. The LED light unit of claim 6, wherein the body is configured to hold the wires along a plane, and the flexure lever extends through at least a portion of the body and separates the wires along the plane into two groups.

8. The LED light unit of claim 7, wherein the flexure lever extends through at least a portion of the body to separate the wires along the plane into two equal groups.

9. The LED light unit of claim 8, wherein the edge connector is configured to align and connect the first group of the wires to tile pads which are connected to anode terminals and not cathode terminals of the LED light sources, and configured to align and connect the second group of the wires to tile pads which are connected to cathode terminals and not anode terminals of the LED light sources.

10. The LED light of claim 6, wherein the edge connector comprises a material with high diffuse light reflectivity.

11. The LED light of claim 10, wherein the edge connector comprises a bright white material.

12. The LED light unit of claim 6, wherein the edge connector is configured to align and directly connect a different one of the edge connector contacts to a different one of the tile pads when the edge connector is connected to the tile.

13. The LED light unit of claim 12, wherein:

each one of the LED light sources comprises a red LED chip connected to a first pair of the tile pads, a green LED chip connected to a second pair of the tile pads, and a blue LED chip connected to a third pair of the tile pads; and

the edge connector is configured to electrically connect a first pair of the wires to the red LED chip via the first pair of tile pads, to electrically connect a second pair of the wires to the green LED chip via the second pair of tile pads, and to electrically connect a third pair of the wires to the blue LED chip via the third pair of tile pads.

14. The LED light unit of claim 6, wherein the plurality of connector wires are separate from one another along a major portion of their length and are independently flexible relative to one another.

15. The LED light unit of claim 6, wherein the plurality of connector wires comprise a ribbon cable.

18. The LED light unit of claim 6, wherein:

each one of the LED light sources comprises at least one LED chip within an encapsulant; and

a height of the edge connector above the at least one LED chip and a closest distance from the upper surface of the edge connector to the at least one LED chip are configured so that a tangential light ray angle between the at least one LED chip to a closest upper surface of the edge connector is no more than 30 degrees relative to horizontal.

19. The LED light unit of claim 18, wherein:

each one of the LED light sources comprises at least one LED chip within an encapsulant; and

a height of the edge connector above the at least one LED chip and a closest distance from the upper surface of the edge connector to the at least one LED chip are configured so that a tangential light ray angle between the at least one LED chip to a closest upper surface of the edge connector is no more than 7 degrees relative to horizontal.

20. The LED light unit of claim 6, wherein:

the tile comprises at least one notch along a edge portion thereof; and

the edge connector further comprises at least one elongated member extending from the body along at least a portion of the cavity, the elongated member located in the cavity to slide into the notch in the tile and guide the edge connector to align the edge connector contacts with the tile pads when an upper surface of the edge connector is facing upward relative to an upper surface of the tile, and to prevent connection of the edge connector to the tile when a lower surface of the edge connector is facing upward relative to an upper surface of the tile.

16. An LED light unit comprising:

a tile;

a plurality of discrete LED light sources that are on and dispersed across a major surface of the tile and are electrically connected to electrical pads along an edge region of the tile; and

an edge connector comprising a plurality of contacts that are connected to a plurality of flexible wires extending away from the edge connector, the edge connector configured to releasably connect to an edge of the tile so that the contacts directly connect to the pads and electrically connect the wires of the edge connector to the LED light sources, and the edge connector comprises a body having a notched corner adjacent to a closest one of the LED light sources.

17. The LED light unit of claim 16, wherein:

the LED light sources are arranged on the tile in a staggered grid extending in a direction away from the connected edge connector.

21. An LED lighting assembly comprising:

a plurality of discrete tiles, each of the tiles comprising a plurality of discrete LED light sources that are on and dispersed across a major surface of the tile and are electrically connected to electrical pads along an edge region of the tile;

a plurality of bars, wherein a plurality of the tiles are mounted to, and mechanical supported by, each of the bars to form a plurality of bar-tile assemblies arranged in a planar array; and

a plurality of edge connectors, wherein each of the edge connectors comprises a plurality of contacts that are connected to a plurality of flexible wires extending away from the edge connector, the edge connector configured to releasably connect to an edge of an end tile along one of the bars so that the contacts directly connect to the pads of the connected end tile and electrically connect the wires of the edge connector to the LED light sources on the connected bar, and each of the edge connectors comprises a body with a cavity having an inner surface, and a locking mechanism that comprises a flexure lever that extends into the cavity and releasably locks onto an opening in a major surface of the tile while the edge connector contacts are directly connected to the tile pads and electrically connect the wires of the edge connector to the LED light sources.

22. The LED light assembly of claim 21, wherein the pads of the end tile on the connected bar are electrically connected to a circuit path that extends through a plurality of the LED light sources on each of the tiles attached to the same connected bar.

23. The LED lighting assembly of claim 21, further comprising an LCD panel on the plurality of bars and arranged so that light from the LED light sources can pass therethrough.

24. A solid state lighting assembly, comprising:

a substrate including a major surface, an edge adjacent the major surface, and a plurality of electrical traces on the major surface;

a plurality of electrical contact pads on the major surface of the substrate and disposed adjacent the edge of the substrate, each of the plurality of electrical contact pads being connected to a respective one of the plurality of electrical traces;

a plurality of solid state light emitting devices on the major surface of the substrate, wherein the plurality of solid state light emitting devices are in electrical communication with at least one of the plurality of contact pads through at least one of the plurality of electrical traces; and

an edge connector on the edge of the substrate including at least two electrical contacts in contact with at least two of the electrical contact pads, the edge connector comprises a plurality of flexible wires extending away from the edge connector, and wherein the edge connector is configured to releasably connect to the edge of the substrate so that the electrical contacts directly connect to the contact pads and electrically connect the wires of the edge connector to the solid state light sources, and wherein the edge connector comprises a body with a cavity having an inner surface, and a locking mechanism that comprises a flexure lever that extends into the cavity and releasably locks onto an opening in a major surface of the substrate while the edge connector contacts are directly connected to the contact pads and electrically connect the wires of the edge connector to the solid state light emitting devices.

25. The solid state lighting assembly of claim 24, wherein a plurality of recessed channels are defined in the body of the edge connector, each of the recessed channels is configured to connect to and guide a portion of one of the flexible wires at a non-zero angle away from a plane of the major surface of the substrate.

26. The solid state lighting assembly of claim 25, wherein each of the recessed channels is configured to guide the connected portion of the flexible wire at about a 90°

angle away from the plane of the major surface of the tile.

27. The solid state lighting assembly of claim 24, wherein:

each one of the solid state light emitting devices comprises at least one LED chip within an encapsulant; and

a height of the edge connector above the major surface of the substrate is no more than a height of the encapsulants of the solid state light emitting devices above the major surface of the substrate.